Madrid; Ruben P.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Madrid; Ruben P..The latest application filed is for "package assembly for semiconductor devices".
- Madrid; Ruben P. - Lapu-lapu N/A PH
- Madrid; Ruben P. - Talisay PH
- Madrid; Ruben P. - Talisay City PH
- Madrid; Ruben P. - Lapu-lapu City PH
- Madrid; Ruben P. - Cebu PH
- Madrid; Ruben P. - Baguio PH
- Madrid, Ruben P. - Baguio City PH
| Patent | Date |
|---|---|
| SiP substrate Grant 8,372,690 - Quinones , et al. February 12, 2 | 2013-02-12 |
| Semiconductor die package with clip interconnection Grant 8,193,618 - Madrid June 5, 2 | 2012-06-05 |
| Thermally enhanced thin semiconductor package Grant 8,193,622 - Madrid June 5, 2 | 2012-06-05 |
| Package Assembly For Semiconductor Devices App 20110244633 - Madrid; Ruben P. ; et al. | 2011-10-06 |
| SiP SUBSTRATE App 20110133318 - Quinones; Maria Clemens Y. ; et al. | 2011-06-09 |
| SiP substrate Grant 7,893,548 - Quinones , et al. February 22, 2 | 2011-02-22 |
| Packaged semiconductor device with dual exposed surfaces and method of manufacturing Grant 7,816,178 - Madrid , et al. October 19, 2 | 2010-10-19 |
| Thermally Enhanced Thin Semiconductor Package App 20100155913 - Madrid; Ruben P. | 2010-06-24 |
| Semiconductor Die Package With Clip Interconnection App 20100148327 - Madrid; Ruben P. | 2010-06-17 |
| Packaged Semiconductor Device With Dual Exposed Surfaces And Method Of Manufacturing App 20090269885 - Madrid; Ruben P. ; et al. | 2009-10-29 |
| SiP SUBSTRATE App 20090236702 - Quinones; Maria Clemens Y. ; et al. | 2009-09-24 |
| Packaged semiconductor device with dual exposed surfaces and method of manufacturing Grant 7,576,429 - Madrid , et al. August 18, 2 | 2009-08-18 |
| Semiconductor Die Package Including Stand Off Structures App 20090057855 - Quinones; Maria Clemens ; et al. | 2009-03-05 |
| Thermally Enhanced Thin Semiconductor Package App 20090057852 - Madrid; Ruben P. | 2009-03-05 |
| Folded frame carrier for MOSFET BGA Grant 7,402,462 - Madrid , et al. July 22, 2 | 2008-07-22 |
| Packaged semiconductor device with dual exposed surfaces and method of manufacturing App 20070161151 - Madrid; Ruben P. ; et al. | 2007-07-12 |
| Folded frame carrier for MOSFET BGA App 20070015316 - Madrid; Ruben P. ; et al. | 2007-01-18 |
| Semiconductor leadframe for staggered board attach Grant 7,002,240 - Madrid February 21, 2 | 2006-02-21 |
| Wirefilm bonding for electronic component interconnection Grant 6,857,459 - Madrid February 22, 2 | 2005-02-22 |
| Semiconductor leadframe for staggered board attach App 20040159917 - Madrid, Ruben P. | 2004-08-19 |
| Semiconductor leadframe for staggered board attach Grant 6,707,135 - Madrid March 16, 2 | 2004-03-16 |
| Semiconductor leadframe for staggered board attach App 20020089042 - Madrid, Ruben P. | 2002-07-11 |
| Method and system for manufacturing ball grid array ("BGA") packages App 20020081772 - Madrid, Ruben P. ; et al. | 2002-06-27 |
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