Ma; Diana Xiaobing

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ma; Diana Xiaobing.The latest application filed is for "non-permeable substrate carrier for electroplating".

Company Profile

1.29.13

Ma; Diana Xiaobing - Saratoga CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Non-permeable substrate carrier for electroplating Grant 11,280,019 - Abas , et al. March 22, 2	2022-03-22
Non-permeable Substrate Carrier For Electroplating App 20190301046 - ABAS; Emmanuel Chua ; et al.	2019-10-03
Maintainable substrate carrier for electroplating Grant RE46,088 - Chen , et al. August 2, 2	2016-08-02
Non-permeable Substrate Carrier For Electroplating App 20160108541 - ABAS; Emmanuel Chua ; et al.	2016-04-21
Non-permeable substrate carrier for electroplating Grant 9,222,193 - Abas , et al. December 29, 2	2015-12-29
Non-permeable Substrate Carrier For Electroplating App 20140034488 - ABAS; Emmanuel Chua ; et al.	2014-02-06
Non-permeable substrate carrier for electroplating Grant 8,317,987 - Abas , et al. November 27, 2	2012-11-27
Maintainable substrate carrier for electroplating Grant 8,221,601 - Chen , et al. July 17, 2	2012-07-17
Non-Permeable Substrate Carrier For Electroplating App 20120073974 - ABAS; Emmanuel Chua ; et al.	2012-03-29
Maintainable substrate carrier for electroplating App 20120073976 - CHEN; Chen-An ; et al.	2012-03-29
Methods Of Trimming Amorphous Carbon Film For Forming Ultra Thin Structures On A Substrate App 20090004875 - Shen; Meihua ; et al.	2009-01-01
CMOS S/D SiGe DEVICE MADE WITH ALTERNATIVE INTEGRATION PROCESS App 20070284668 - Shen; Meihua ; et al.	2007-12-13
ALTERNATIVE INTEGRATION SCHEME FOR CMOS S/D SiGe PROCESS App 20070287244 - Shen; Meihua ; et al.	2007-12-13
System level in-situ integrated dielectric etch process particularly useful for copper dual damascene Grant 6,949,203 - Hsieh , et al. September 27, 2	2005-09-27
Plasma chamber having multiple RF source frequencies App 20050106873 - Hoffman, Daniel J. ; et al.	2005-05-19
Monitoring dimensions of features at different locations in the processing of substrates Grant 6,829,056 - Barnes , et al. December 7, 2	2004-12-07
Method for reducing topography dependent charging effects in a plasma enhanced semiconductor wafer processing system Grant 6,635,577 - Yamartino , et al. October 21, 2	2003-10-21
Method and apparatus for asymmetric gas distribution in a semiconductor wafer processing system Grant 6,620,289 - Yan , et al. September 16, 2	2003-09-16
System level in-situ integrated dielectric etch process particularly useful for copper dual damascene App 20030164354 - Hsieh, Chang-Lin ; et al.	2003-09-04
Method of heating a semiconductor substrate Grant 6,547,978 - Ye , et al. April 15, 2	2003-04-15
Method for etching low k dielectrics Grant 6,547,977 - Yan , et al. April 15, 2	2003-04-15
Control of patterned etching in semiconductor features Grant 6,534,416 - Ye , et al. March 18, 2	2003-03-18
Integrated system for oxide etching and metal liner deposition App 20030027427 - Ma, Diana Xiaobing ; et al.	2003-02-06
Etched patterned copper features free from etch process residue Grant 6,488,862 - Ye , et al. December 3, 2	2002-12-03
Copper etch using HCl and HBR chemistry Grant 6,489,247 - Ye , et al. December 3, 2	2002-12-03
Method and apparatus for forming metal interconnects App 20020058408 - Maydan, Dan ; et al.	2002-05-16
Method of heating a semiconductor substrate App 20020045354 - Ye, Yan ; et al.	2002-04-18
Method of pattern etching a low K dielectric layer Grant 6,331,380 - Ye , et al. December 18, 2	2001-12-18
RF plasma reactor with hybrid conductor and multi-radius dome ceiling Grant 6,248,250 - Hanawa , et al. June 19, 2	2001-06-19
Plasma reactor having a helicon wave high density plasma source Grant 6,189,484 - Yin , et al. February 20, 2	2001-02-20
Post-etch treatment of plasma-etched feature surfaces to prevent corrosion Grant 6,153,530 - Ye , et al. November 28, 2	2000-11-28
Method for high temperature etching of patterned layers using an organic mask stack Grant 6,143,476 - Ye , et al. November 7, 2	2000-11-07
Method of etching patterned layers useful as masking during subsequent etching or for damascene structures Grant 6,080,529 - Ye , et al. June 27, 2	2000-06-27
Inductively and multi-capacitively coupled plasma reactor Grant 6,020,686 - Ye , et al. February 1, 2	2000-02-01
Patterned copper etch for micron and submicron features, using enhanced physical bombardment Grant 6,010,603 - Ye , et al. January 4, 2	2000-01-04
Process for copper etch back Grant 5,968,847 - Ye , et al. October 19, 1	1999-10-19
Process gas focusing apparatus and method Grant 5,891,348 - Ye , et al. April 6, 1	1999-04-06
RF plasma reactor with cleaning electrode for cleaning during processing of semiconductor wafers Grant 5,817,534 - Ye , et al. October 6, 1	1998-10-06
Plasma process for etching multicomponent alloys Grant 5,779,926 - Ma , et al. July 14, 1	1998-07-14
RF plasma reactor with hybrid conductor and multi-radius dome ceiling Grant 5,777,289 - Hanawa , et al. July 7, 1	1998-07-07
Method and apparatus for cleaning by-products from plasma chamber surfaces Grant 5,756,400 - Ye , et al. May 26, 1	1998-05-26
Inductively and multi-capacitively coupled plasma reactor Grant 5,710,486 - Ye , et al. January 20, 1	1998-01-20

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