loadpatents
name:-0.096441030502319
name:-0.015049934387207
name:-0.011216878890991
Lutter; Stefan Patent Filings

Lutter; Stefan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lutter; Stefan.The latest application filed is for "method and apparatus for temporary bonding of ultra thin wafers".

Company Profile
0.8.11
  • Lutter; Stefan - Eisingen DE
  • Lutter; Stefan - Nurtingen N/A DE
  • Lutter; Stefan - Nauchatel CH
  • Lutter; Stefan - Neuchatel CH
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method And Apparatus For Temporary Bonding Of Ultra Thin Wafers
App 20150251396 - GEORGE; GREGORY ;   et al.
2015-09-10
Method and apparatus for temporary bonding of ultra thin wafers
Grant 9,064,686 - George , et al. June 23, 2
2015-06-23
Method And Apparatus For Temporary Bonding Of Ultra Thin Wafers
App 20130244400 - GEORGE; GREGORY ;   et al.
2013-09-19
Device for coating a substrate
Grant 8,353,255 - Beyer , et al. January 15, 2
2013-01-15
Device for coating a substrate
App 20100192843 - Beyer; Ralph ;   et al.
2010-08-05
Process for producing an SPM sensor
Grant 6,979,407 - Lutter December 27, 2
2005-12-27
SPM sensor and process for producing it
Grant 6,958,124 - Lutter October 25, 2
2005-10-25
Micro device and process for producing it
Grant 6,953,751 - Detterbeck , et al. October 11, 2
2005-10-11
Micro device and process for producing it
App 20040266049 - Detterbeck, Manfred ;   et al.
2004-12-30
Semiconductor component in a wafer assembly
App 20040207063 - Lutter, Stefan
2004-10-21
Semiconductor component in a wafer assembly
Grant 6,780,767 - Lutter August 24, 2
2004-08-24
SPM sensor and process for producing it
App 20040046119 - Lutter, Stefan
2004-03-11
SPM sensor and process for producing same
App 20040007053 - Lutter, Stefan ;   et al.
2004-01-15
Process for producing an SPM sensor
App 20030196988 - Lutter, Stefan
2003-10-23
Semiconductor component in a wafer assembly
App 20020197862 - Lutter, Stefan
2002-12-26

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