| Patent | Date |
|---|
Vibronic Multisensor
App 20220260400 - Lopatin; Sergey ; et al. | 2022-08-18 |
Corrosion-protection element for a field device
Grant 11,340,126 - Lopatin , et al. May 24, 2 | 2022-05-24 |
Vibronic Multisensor
App 20220146484 - Lopatin; Sergey ; et al. | 2022-05-12 |
Pressure Gauge Comprising A Device For Deflecting An Isolation Diaphragm
App 20220065725 - Lopatin; Sergey ; et al. | 2022-03-03 |
Pressure Gauge Comprising A Device For Deflecting An Isolation Diaphragm
App 20220042869 - Lopatin; Sergey ; et al. | 2022-02-10 |
Vibronic Multisensor
App 20210364347 - Lopatin; Sergey ; et al. | 2021-11-25 |
Corrosion-protection Element For A Field Device
App 20200200632 - Lopatin; Sergey ; et al. | 2020-06-25 |
Method For Determining A Process Variable With A Classifier For Selecting A Measuring Method
App 20200124461 - Lopatin; Sergey ; et al. | 2020-04-23 |
Method For Determining A Process Variable With A Classifier For Selecting A Model For Determining The Process Variable
App 20200125974 - Alber; Thomas ; et al. | 2020-04-23 |
Structural modification using electron beam activated chemical etch
Grant 8,052,885 - Naser-Ghodsi , et al. November 8, 2 | 2011-11-08 |
Tungsten plug deposition quality evaluation method by EBACE technology
Grant 7,945,086 - Gotkis , et al. May 17, 2 | 2011-05-17 |
Electroplating Apparatus
App 20110031113 - Lopatin; Sergey ; et al. | 2011-02-10 |
Etch selectivity enhancement in electron beam activated chemical etch
Grant 7,879,730 - Naser-Ghodsi , et al. February 1, 2 | 2011-02-01 |
Electroplating on roll-to-roll flexible solar cell substrates
Grant 7,799,182 - Lopatin , et al. September 21, 2 | 2010-09-21 |
Precision printing electroplating through plating mask on a solar cell substrate
Grant 7,736,928 - Lopatin , et al. June 15, 2 | 2010-06-15 |
High-aspect ratio anode and apparatus for high-speed electroplating on a solar cell substrate
Grant 7,704,352 - Lopatin , et al. April 27, 2 | 2010-04-27 |
Apparatus and method of detecting the electroless deposition endpoint
Grant 7,534,298 - Shanmugasundram , et al. May 19, 2 | 2009-05-19 |
Tungsten Plug Deposition Quality Evaluation Method By Ebace Technology
App 20090010526 - Gotkis; Yehiel ; et al. | 2009-01-08 |
Method Of Metallizing A Solar Cell Substrate
App 20080128019 - LOPATIN; Sergey ; et al. | 2008-06-05 |
Electroplating On Roll-to-roll Flexible Solar Cell Substrates
App 20080128013 - Lopatin; Sergey ; et al. | 2008-06-05 |
High-aspect Ratio Anode And Apparatus For High-speed Electroplating On A Solar Cell Substrate
App 20080128268 - Lopatin; Sergey ; et al. | 2008-06-05 |
Precision Printing Electroplating Through Plating Mask On A Solar Cell Substrate
App 20080132082 - Lopatin; Sergey ; et al. | 2008-06-05 |
Selective Electroless Deposition For Solar Cells
App 20080121276 - Lopatin; Sergey ; et al. | 2008-05-29 |
Pulse Plating Of A Low Stress Film On A Solar Cell Substrate
App 20080092947 - Lopatin; Sergey ; et al. | 2008-04-24 |
Apparatus for electroless deposition
Grant 7,341,633 - Lubomirsky , et al. March 11, 2 | 2008-03-11 |
Wafer cleaning solution for cobalt electroless application
Grant 7,273,813 - Emami , et al. September 25, 2 | 2007-09-25 |
Pretreatment for electroless deposition
Grant 7,256,111 - Lopatin , et al. August 14, 2 | 2007-08-14 |
Etch Selectivity Enhancement In Electron Beam Activated Chemical Etch
App 20070158304 - Nasser-Ghodsi; Mehran ; et al. | 2007-07-12 |
Structural Modification Using Electron Beam Activated Chemical Etch
App 20070158303 - NASSER-GHODSI; MEHRAN ; et al. | 2007-07-12 |
Method for forming CoWRe alloys by electroless deposition
Grant 7,205,233 - Lopatin , et al. April 17, 2 | 2007-04-17 |
Protection against the effects of condensate bridges
App 20060284626 - D'Angelico; Sascha ; et al. | 2006-12-21 |
Wafer cleaning solution for cobalt electroless application
App 20060174912 - Emami; Ramin ; et al. | 2006-08-10 |
Chemical solution for electroplating a copper-zinc alloy thin film
Grant 6,974,767 - Lopatin December 13, 2 | 2005-12-13 |
Semiconductor component and method of manufacture
Grant 6,943,096 - Wang , et al. September 13, 2 | 2005-09-13 |
Semiconductor device having copper lines with reduced electromigration using an electroplated interim copper-zinc alloy film on a copper surface
Grant 6,936,925 - Lopatin , et al. August 30, 2 | 2005-08-30 |
Pretreatment for electroless deposition
App 20050164497 - Lopatin, Sergey ; et al. | 2005-07-28 |
Method and tool of chemical doping CoW alloys with Re for increasing barrier properties of electroless capping layers for IC Cu interconnects
App 20050101130 - Lopatin, Sergey ; et al. | 2005-05-12 |
Apparatus and method of detecting the electroless deposition endpoint
App 20050088647 - Shanmugasundram, Arulkumar ; et al. | 2005-04-28 |
Apparatus for electroless deposition
App 20050081785 - Lubomirsky, Dmitry ; et al. | 2005-04-21 |
Method of controlling zinc-doping in a copper-zinc alloy thin film electroplated on a copper surface and a semiconductor device thereby formed
Grant 6,811,671 - Lopatin , et al. November 2, 2 | 2004-11-02 |
Method of reducing electromigration by forming an electroplated copper-zinc interconnect and a semiconductor device thereby formed
Grant 6,717,236 - Lopatin , et al. April 6, 2 | 2004-04-06 |
Selective deposition process for allowing damascene-type Cu interconnect lines
Grant 6,689,689 - Besser , et al. February 10, 2 | 2004-02-10 |
Method of reducing electromigration in a copper line by electroplating an interim copper-zinc alloy thin film on a copper surface and a semiconductor device thereby formed
Grant 6,660,633 - Lopatin , et al. December 9, 2 | 2003-12-09 |
Process for formation of a wiring network using a porous interlevel dielectric and related structures
App 20030218253 - Avanzino, Steven C. ; et al. | 2003-11-27 |
Semiconductor device having reduced electromigration in copper lines with calcium-doped copper surfaces formed by using a chemical solution
Grant 6,646,353 - Lopatin November 11, 2 | 2003-11-11 |
Method of reducing electromigration by ordering zinc-doping in an electroplated copper-zinc interconnect and a semiconductor device thereby formed
Grant 6,630,741 - Lopatin , et al. October 7, 2 | 2003-10-07 |
Method of fabricating a semiconductor device by calcium doping a copper surface using a chemical solution
Grant 6,624,074 - Lopatin , et al. September 23, 2 | 2003-09-23 |
Method of reducing electromigration in a copper line by Zinc-Doping of a copper surface from an electroplated copper-zinc alloy thin film and a semiconductor device thereby formed
Grant 6,624,075 - Lopatin , et al. September 23, 2 | 2003-09-23 |
Semiconductor device fabricated by reducing carbon, sulphur, and oxygen impurities in a calcium-doped copper surface
Grant 6,621,165 - Lopatin , et al. September 16, 2 | 2003-09-16 |
Depositing an adhesion skin layer and a conformal seed layer to fill an interconnect opening
Grant 6,528,412 - Wang , et al. March 4, 2 | 2003-03-04 |
Interconnect structure formed in porous dielectric material with minimized degradation and electromigration
Grant 6,528,409 - Lopatin , et al. March 4, 2 | 2003-03-04 |
Semiconductor device with copper-filled via includes a copper-zinc/alloy film for reduced electromigration of copper
Grant 6,515,368 - Lopatin , et al. February 4, 2 | 2003-02-04 |
Method of copper-polysilicon T-gate formation
Grant 6,500,743 - Lopatin , et al. December 31, 2 | 2002-12-31 |
Formation without vacuum break of sacrificial layer that dissolves in acidic activation solution within interconnect
Grant 6,498,093 - Achuthan , et al. December 24, 2 | 2002-12-24 |
Method of re-working copper damascene wafers
Grant 6,495,443 - Lopatin , et al. December 17, 2 | 2002-12-17 |
Method of electrochemical formation of high Tc superconducting damascene interconnect for integrated circuit
Grant 6,482,656 - Lopatin November 19, 2 | 2002-11-19 |
Tin palladium activation with maximized nuclei density and uniformity on barrier material in interconnect structure
Grant 6,472,310 - Achuthan , et al. October 29, 2 | 2002-10-29 |
Semiconductor device formed by calcium doping a copper surface using a chemical solution
Grant 6,469,387 - Lopatin , et al. October 22, 2 | 2002-10-22 |
Selective deposition process for passivating top interface of damascene-type Cu interconnect lines
Grant 6,455,425 - Besser , et al. September 24, 2 | 2002-09-24 |
Formation of alloy material using alternating depositions of alloy doping element and bulk material
Grant 6,447,933 - Wang , et al. September 10, 2 | 2002-09-10 |
Method of reducing carbon, sulphur, and oxygen impurities in a calcium-doped copper surface and semiconductor device thereby formed
Grant 6,444,580 - Lopatin , et al. September 3, 2 | 2002-09-03 |
Method of copper-polysilicon gate formation
Grant 6,440,830 - Lopatin August 27, 2 | 2002-08-27 |
Tantalum anodization for in-laid copper metallization capacitor
Grant 6,433,379 - Lopatin , et al. August 13, 2 | 2002-08-13 |
Minimizing resistance and electromigration of interconnect by adjusting anneal temperature and amount of seed layer dopant
Grant 6,426,293 - Wang , et al. July 30, 2 | 2002-07-30 |
Superconducting damascene interconnected for integrated circuit
Grant 6,420,189 - Lopatin July 16, 2 | 2002-07-16 |
Method of porous dielectric formation with anodic template
Grant 6,387,818 - Lopatin May 14, 2 | 2002-05-14 |
Selective Deposition Process For Passivating Top Interface Of Damascene-Type Cu Interconnect Lines
App 20020027261 - Besser, Paul R. ; et al. | 2002-03-07 |
Method of fabricating improved copper metallization including forming and removing passivation layer before forming capping film
Grant 6,350,687 - Avanzino , et al. February 26, 2 | 2002-02-26 |
Method of electroless ag layer formation for cu interconnects
Grant 6,291,082 - Lopatin September 18, 2 | 2001-09-18 |
Method of forming Cu-Ca-O thin films on Cu surfaces in a chemical solution and semiconductor device thereby formed
Grant 6,291,348 - Lopatin , et al. September 18, 2 | 2001-09-18 |
Method for filling a dual damascene opening having high aspect ratio to minimize electromigration failure
Grant 6,245,670 - Cheung , et al. June 12, 2 | 2001-06-12 |
Method of forming copper/copper alloy interconnection with reduced electromigration
Grant 6,242,349 - Nogami , et al. June 5, 2 | 2001-06-05 |
Method of forming an alloy precipitate to surround interconnect to minimize electromigration
Grant 6,228,759 - Wang , et al. May 8, 2 | 2001-05-08 |
Method for removing copper residue from surfaces of a semiconductor wafer
Grant 6,127,282 - Lopatin October 3, 2 | 2000-10-03 |
Method of improving Cu damascene interconnect reliability by laser anneal before barrier polish
Grant 6,103,624 - Nogami , et al. August 15, 2 | 2000-08-15 |
Method of forming reliable copper interconnects with improved hole filling
Grant 6,103,086 - Woo , et al. August 15, 2 | 2000-08-15 |
Copper/low dielectric interconnect formation with reduced electromigration
Grant 6,096,648 - Lopatin , et al. August 1, 2 | 2000-08-01 |
Fabrication of a via plug having high aspect ratio with a diffusion barrier layer effectively surrounding the via plug
Grant 6,083,842 - Cheung , et al. July 4, 2 | 2000-07-04 |
Method for making multilayered coaxial interconnect structure
Grant 6,060,383 - Nogami , et al. May 9, 2 | 2000-05-09 |
Scaled interconnect anodization for high frequency applications
Grant 6,033,982 - Lopatin , et al. March 7, 2 | 2000-03-07 |
Method of metal/polysilicon gate formation in a field effect transistor
Grant 6,015,747 - Lopatin , et al. January 18, 2 | 2000-01-18 |
Method of operating an ultransonic piezoelectric transducer and circuit arrangement for performing the method
Grant 5,757,104 - Getman , et al. May 26, 1 | 1998-05-26 |
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