Loo; Kum Weng

Patent Applications and Registrations

Patent applications and USPTO patent grants for Loo; Kum Weng.The latest application filed is for "semiconductor package with thermal heat spreader".

Company Profile

0.8.9

Loo; Kum Weng - Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor package with thermal heat spreader Grant 8,338,943 - Loo December 25, 2	2012-12-25
Semiconductor Package With Thermal Heat Spreader App 20120050996 - Loo; Kum Weng	2012-03-01
Semiconductor package with a stiffening member supporting a thermal heat spreader Grant 8,013,438 - Luan , et al. September 6, 2	2011-09-06
Semiconductor package with position member Grant 7,919,361 - Loo , et al. April 5, 2	2011-04-05
Cap including a housing and optically transparent member to protect a camera module lens Grant 7,880,132 - Brodie , et al. February 1, 2	2011-02-01
Semiconductor Package With A Stiffening Member Supporting A Thermal Heat Spreader App 20110018125 - Loo; Kum-Weng ; et al.	2011-01-27
Simplified multichip packaging and package design App 20110006411 - Loo; Kum-Weng ; et al.	2011-01-13
Semiconductor package with position member App 20100297813 - Loo; Kum-weng ; et al.	2010-11-25
Simplified multichip packaging and package design Grant 7,816,182 - Loo , et al. October 19, 2	2010-10-19
Semiconductor package with position member Grant 7,745,945 - Loo , et al. June 29, 2	2010-06-29
Camera Module Lens Cap App 20090057544 - Brodie; Stuart ; et al.	2009-03-05
Semiconductor package with position member App 20070085177 - Loo; Kum-weng ; et al.	2007-04-19
Method for fixing a lens of an optic group with respect to an optical sensor inside an electronic device able to acquire images and corresponding device Grant 7,061,697 - Magni , et al. June 13, 2	2006-06-13
Semiconductor device package and method of manufacture Grant 7,056,765 - Loo , et al. June 6, 2	2006-06-06
Simplified multichip packaging and package design App 20060113643 - Loo; Kum-Weng ; et al.	2006-06-01
Method for fixing a lens of an optic group with respect to an optical sensor inside an electronic device able to acquire images and corresponding device App 20050046973 - Magni, Pierangelo ; et al.	2005-03-03
Semiconductor device package and method of manufacture App 20040159927 - Loo, Kum-Weng ; et al.	2004-08-19

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.