Locke; Peter S.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Locke; Peter S..The latest application filed is for "early detection of contact liner integrity by chemical reaction".

Company Profile

0.11.10

Locke; Peter S. - Hopewell Junction NY
Locke; Peter S. - Hopewell Jct. NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Void-free damascene copper deposition process and means of monitoring thereof Grant 7,678,258 - Andricacos , et al. March 16, 2	2010-03-16
Electroplated copper interconnection structure, process for making and electroplating bath Grant 7,227,265 - Andricacos , et al. June 5, 2	2007-06-05
Method for plating copper conductors and devices formed Grant 6,979,393 - Rodbell , et al. December 27, 2	2005-12-27
Void-free damascene copper deposition process and means of monitoring thereof App 20050006242 - Andricacos, Panayotis ; et al.	2005-01-13
Early Detection Of Contact Liner Integrity By Chemical Reaction App 20050010455 - Bauer, Lawrence JR. ; et al.	2005-01-13
Electroplated copper interconnection structure, process for making and electroplating bath App 20040178078 - Andricacos, Panayotis C. ; et al.	2004-09-16
Electroplated copper interconnection structure, process for making and electroplating bath App 20040178077 - Andricacos, Panayotis C. ; et al.	2004-09-16
Method for depositing metal films onto substrate surfaces utilizing a chamfered ring support Grant 6,660,330 - Locke , et al. December 9, 2	2003-12-09
Seedlayer for plating metal in deep submicron structures Grant 6,600,230 - Uzoh , et al. July 29, 2	2003-07-29
Method of controlling additives in copper plating baths App 20030000850 - Horkans, Wilma Jean ; et al.	2003-01-02
Method of controlling chemical bath composition in a manufacturing environment Grant 6,471,845 - Dukovic , et al. October 29, 2	2002-10-29
Deformation-susceptible substrate holder for low-pressure MOCVD and process for use thereof App 20020146903 - Locke, Peter S. ; et al.	2002-10-10
Method to build multi level structure Grant 6,413,854 - Uzoh , et al. July 2, 2	2002-07-02
Electroless metal liner formation methods App 20020081842 - Sambucetti, Carlos J. ; et al.	2002-06-27
Method for plating copper conductors and devices formed App 20020066673 - Rodbell, Kenneth P. ; et al.	2002-06-06
Selective plating process Grant 6,368,484 - Volant , et al. April 9, 2	2002-04-09
Method of improving contact reliability for electroplating App 20020027082 - Andricacos, Panayotis C. ; et al.	2002-03-07
Method for plating copper conductors and devices formed Grant 6,344,129 - Rodbell , et al. February 5, 2	2002-02-05
Pattern-sensitive electrolytic metal plating Grant 6,344,125 - Locke , et al. February 5, 2	2002-02-05
Method to produce high quality metal fill in deep submicron vias and lines App 20010046565 - Uzoh, Cyprian E. ; et al.	2001-11-29
Method to produce high quality metal fill in deep submicron vias and lines Grant 6,258,717 - Uzoh , et al. July 10, 2	2001-07-10

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