| Patent | Date |
|---|
Semiconductor Device And Method Of Manufacturing The Same
App 20220293561 - Lo; Yi-Jen ; et al. | 2022-09-15 |
Semiconductor Device And Method Of Manufacturing The Same
App 20220293552 - Lo; Yi-Jen ; et al. | 2022-09-15 |
Wafer-to-wafer Interconnection Structure And Method Of Manufacturing The Same
App 20220223433 - Lo; Yi-Jen | 2022-07-14 |
3d Bonded Semiconductor Device And Method Of Forming The Same
App 20220165618 - LO; Yi-Jen | 2022-05-26 |
Semiconductor structure and manufacturing method thereof
Grant 11,342,307 - Chiu , et al. May 24, 2 | 2022-05-24 |
Method For Manufacturing Semiconductor Structure
App 20220102320 - CHIU; Hsih-Yang ; et al. | 2022-03-31 |
Semiconductor Device And Method Of Manufacturing Thereof
App 20220102244 - LO; Yi-Jen | 2022-03-31 |
Apparatuses including redistribution layers and related microelectronic devices
Grant 11,211,351 - Kuan , et al. December 28, 2 | 2021-12-28 |
Semiconductor Structure And Manufacturing Method Thereof
App 20210111158 - CHIU; Hsih-Yang ; et al. | 2021-04-15 |
Method Of Manufacturing Semiconductor Device
App 20200357765 - WU; PEI-JHEN ; et al. | 2020-11-12 |
Semiconductor structure and method for preparing the same
Grant 10,818,508 - Lo October 27, 2 | 2020-10-27 |
Method of manufacturing semiconductor device
Grant 10,811,382 - Wu , et al. October 20, 2 | 2020-10-20 |
Apparatuses Including Redistribution Layers And Related Microelectronic Devices
App 20200294945 - Kuan; Shih-Fan ; et al. | 2020-09-17 |
Methods of manufacturing a multi-device package
Grant 10,679,958 - Kuan , et al. | 2020-06-09 |
Semiconductor Structure And Method For Preparing The Same
App 20200126806 - LO; Yi-Jen | 2020-04-23 |
Multi-device packages and related microelectronic devices
Grant 10,593,637 - Kuan , et al. | 2020-03-17 |
Methods of manufacturing a multi-device package
Grant 10,373,922 - Kuan , et al. | 2019-08-06 |
Methods Of Manufacturing A Multi-device Package
App 20190088606 - Kuan; Shih-Fan ; et al. | 2019-03-21 |
Multi-device Packages And Related Semiconductor Devices
App 20180358315 - Kuan; Shih-Fan ; et al. | 2018-12-13 |
Method for fabricating semiconductor package
Grant 9,748,106 - Lo , et al. August 29, 2 | 2017-08-29 |
Method For Fabricating Semiconductor Package
App 20170213740 - Lo; Yi-Jen ; et al. | 2017-07-27 |
Fan-out wafer level packaging and manufacturing method thereof
Grant 9,576,933 - Lo February 21, 2 | 2017-02-21 |
Multi-device Package And Manufacturing Method Thereof
App 20170033078 - KUAN; Shih-Fan ; et al. | 2017-02-02 |
Multi-device package and manufacturing method thereof
Grant 9,543,270 - Kuan , et al. January 10, 2 | 2017-01-10 |
Multi-device Package And Manufacturing Method Thereof
App 20160358870 - KUAN; Shih-Fan ; et al. | 2016-12-08 |
Through Silicon Via Structure And Method For Fabricating The Same
App 20130249047 - Hung; Chih-Hsiung ; et al. | 2013-09-26 |
Semiconductor structure and method for making the same
Grant 8,003,528 - Lo , et al. August 23, 2 | 2011-08-23 |
Semiconductor Structure With Selectively Deposited Tungsten Film And Method For Making The Same
App 20100276764 - Lo; Yi-Jen ; et al. | 2010-11-04 |
Semiconductor Structure And Method For Making The Same
App 20100279498 - Lo; Yi-Jen ; et al. | 2010-11-04 |
Method Of Forming Multi Metal Layers Thin Film On Wafer
App 20100240214 - Chiu; YuShan ; et al. | 2010-09-23 |
Method for controlling a thickness of a first layer and method for adjusting the thickness of different first layers
Grant 7,341,950 - Lo , et al. March 11, 2 | 2008-03-11 |
Method for controlling a thickness of a first layer and method for adjusting the thickness of different first layers
App 20070125748 - Lo; Yi-Jen ; et al. | 2007-06-07 |
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