Liu; Xiao Hu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Liu; Xiao Hu.The latest application filed is for "multi-chip package structure having high density chip interconnect bridge with embedded power distribution network".

Company Profile

22.70.72

Liu; Xiao Hu - Briarcliff Manor NY
Liu; Xiao Hu - Brarcliff Manor NY
Liu; Xiao Hu - Yorktown Heights NY
Liu; Xiao Hu - Briarcliff NY
Liu; Xiao Hu - Briarliff Manor NY US
Liu; Xiao Hu - Croton on Hudson NY
Liu; Xiao Hu - Croton-on-Husdson NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Forming ultra-thin chips for flexible electronics applications Grant 11,295,982 - Sakuma , et al. April 5, 2	2022-04-05
Multi-chip package structure having high density chip interconnect bridge with embedded power distribution network Grant 11,133,259 - Rubin , et al. September 28, 2	2021-09-28
Multi-chip Package Structure Having High Density Chip Interconnect Bridge With Embedded Power Distribution Network App 20210183773 - Rubin; Joshua M. ; et al.	2021-06-17
Flexible electronics for wearable healthcare sensors Grant 11,015,913 - Hu , et al. May 25, 2	2021-05-25
Piezoelectronic device with novel force amplification Grant 10,964,881 - Elmegreen , et al. March 30, 2	2021-03-30
Advanced crack stop structure Grant 10,957,657 - Yang , et al. March 23, 2	2021-03-23
Forming Ultra-thin Chips For Flexible Electronics Applications App 20200395248 - Sakuma; KATSUYUKI ; et al.	2020-12-17
Advanced crack stop structure Grant 10,847,475 - Yang , et al. November 24, 2	2020-11-24
Advanced crack stop structure Grant 10,840,195 - Yang , et al. November 17, 2	2020-11-17
Advanced crack stop structure Grant 10,840,194 - Yang , et al. November 17, 2	2020-11-17
Advanced Crack Stop Structure App 20200118943 - Yang; Chih-Chao ; et al.	2020-04-16
Nanofluidic channel fabrication by controlled spontaneous fracturing Grant 10,622,220 - Liu , et al.	2020-04-14
Advanced Crack Stop Structure App 20200051930 - Yang; Chih-Chao ; et al.	2020-02-13
Advanced Crack Stop Structure App 20200035621 - Yang; Chih-Chao ; et al.	2020-01-30
Advanced Crack Stop Structure App 20200035620 - Yang; Chih-Chao ; et al.	2020-01-30
Wafer-scale power delivery Grant 10,546,809 - Cox , et al. Ja	2020-01-28
Advanced crack stop structure Grant 10,490,513 - Yang , et al. Nov	2019-11-26
Advanced crack stop structure Grant 10,475,753 - Yang , et al. Nov	2019-11-12
Advanced Crack Stop Structure App 20190304929 - Yang; Chih-Chao ; et al.	2019-10-03
Advanced Crack Stop Structure App 20190304928 - Yang; Chih-Chao ; et al.	2019-10-03
Thru-silicon-via structures Grant 10,388,567 - Chen , et al. A	2019-08-20
Flexible Electronics For Wearable Healthcare Sensors App 20190242690 - HU; HUAN ; et al.	2019-08-08
Flexible electronics for wearable healthcare sensors Grant 10,359,269 - Hu , et al.	2019-07-23
Wafer-scale Power Delivery App 20190035722 - Cox; Charles E. ; et al.	2019-01-31
Wafer-scale power delivery Grant 10,147,676 - Cox , et al. De	2018-12-04
Wafer-scale Power Delivery App 20180331028 - Cox; Charles E. ; et al.	2018-11-15
Piezoelectronic device with novel force amplification Grant 9,941,472 - Elmegreen , et al. April 10, 2	2018-04-10
Piezoelectronic Device With Novel Force Amplification App 20180090681 - Elmegreen; Bruce G. ; et al.	2018-03-29
Flexible Electronics For Wearable Healthcare Sensors App 20180073854 - HU; HUAN ; et al.	2018-03-15
Thru-silicon-via Structures App 20180047626 - CHEN; Fen ; et al.	2018-02-15
Thru-silicon-via structures Grant 9,812,359 - Chen , et al. November 7, 2	2017-11-07
Controlling fragmentation of chemically strengthened glass Grant 9,738,560 - Cabral, Jr. , et al. August 22, 2	2017-08-22
Flexible electronics for wearable healthcare sensors Grant 9,670,061 - Hu , et al. June 6, 2	2017-06-06
Controlling fragmentation of chemically strengthened glass Grant 9,586,857 - Cabral, Jr. , et al. March 7, 2	2017-03-07
Thru-silicon-via Structures App 20160358821 - CHEN; Fen ; et al.	2016-12-08
Controlling Fragmentation Of Chemically Strengthened Glass App 20160264456 - Cabral, JR.; Cyril ; et al.	2016-09-15
Controlling Fragmentation Of Chemically Strengthened Glass App 20160137548 - Cabral, JR.; Cyril ; et al.	2016-05-19
Through-vias for wiring layers of semiconductor devices Grant 9,245,824 - Jahnes , et al. January 26, 2	2016-01-26
Through-vias for wiring layers of semicondutor devices Grant 9,236,325 - Jahnes , et al. January 12, 2	2016-01-12
Piezoelectronic Device With Novel Force Amplification App 20150255699 - Elmegreen; Bruce G. ; et al.	2015-09-10
Semiconductor article having a zig-zag guard ring and method of forming the same Grant 9,082,781 - Filippi , et al. July 14, 2	2015-07-14
Semiconductor Article Having A Zig-zag Guard Ring App 20150097297 - Filippi; Ronald G. ; et al.	2015-04-09
Through-vias For Wiring Layers Of Semiconductor Devices App 20140312467 - Jahnes; Christopher V. ; et al.	2014-10-23
Through-vias For Wiring Layers Of Semiconductor Devices App 20140312502 - Jahnes; Christopher V. ; et al.	2014-10-23
Dislocation engineering using a scanned laser Grant 8,865,571 - Lai , et al. October 21, 2	2014-10-21
Dislocation engineering using a scanned laser Grant 8,865,572 - Lai , et al. October 21, 2	2014-10-21
Dieletric Cap Having Material With Optical Band Gap To Substantially Block Uv Radiation During Curing Treatment, And Related Methods App 20140302685 - Belyansky; Michael P. ; et al.	2014-10-09
Optimization metallization for prevention of dielectric cracking under controlled collapse chip connections Grant 8,796,133 - Bonilla , et al. August 5, 2	2014-08-05
Dislocation Engineering Using A Scanned Laser App 20140154872 - Lai; Chung Woh ; et al.	2014-06-05
Dislocation Engineering Using A Scanned Laser App 20140154873 - Lai; Chung Woh ; et al.	2014-06-05
Fixed curvature force loading of mechanically spalled films Grant 8,679,943 - Bedell , et al. March 25, 2	2014-03-25
Elastic modulus mapping of an integrated circuit chip in a chip/device package Grant 8,650,512 - Daubenspeck , et al. February 11, 2	2014-02-11
Optimization Metallization For Prevention Of Dielectric Cracking Under Controlled Collapse Chip Connections App 20140021622 - Bonilla; Griselda ; et al.	2014-01-23
Negative coefficient thermal expansion engineered particles for composite fabrication Grant 8,624,152 - Hougham , et al. January 7, 2	2014-01-07
Structure and method for reducing vertical crack propagation Grant 8,604,618 - Cooney, III , et al. December 10, 2	2013-12-10
Multiple orientation nanowires with gate stack sensors Grant 8,492,802 - Chidambarrao , et al. July 23, 2	2013-07-23
Structure And Method For Reducing Vertical Crack Propagation App 20130171817 - Cooney, III; Edward C. ; et al.	2013-07-04
Structure And Method For Reducing Vertical Crack Propagation App 20130075913 - Cooney, III; Edward C. ; et al.	2013-03-28
Coupling piezoelectric material generated stresses to devices formed in integrated circuits Grant 8,405,279 - Elmegreen , et al. March 26, 2	2013-03-26
Fixed Curvature Force Loading Of Mechanically Spalled Films App 20130052798 - Bedell; Stephen W. ; et al.	2013-02-28
Multiple Orientation Nanowires with Gate Stack Sensors Grant 8,367,492 - Chidambarrao , et al. February 5, 2	2013-02-05
Multiple orientation nanowires with gate stack stressors Grant 8,368,125 - Chidambarrao , et al. February 5, 2	2013-02-05
Multiple Orientation Nanowires With Gate Stack Sensors App 20130015507 - Chidambarrao; Dureseti ; et al.	2013-01-17
Communication App 20120322215 - CHIDAMBARRAO; Dureseti ; et al.	2012-12-20
Dislocation Engineering Using a Scanned Laser App 20120294322 - Lai; Chung Woh ; et al.	2012-11-22
Coupling Piezoelectric Material Generated Stresses To Devices Formed In Integrated Circuits App 20120270353 - Elmegreen; Bruce G. ; et al.	2012-10-25
Reprogrammable fuse structure and method Grant 8,278,155 - Burr , et al. October 2, 2	2012-10-02
Coupling piezoelectric material generated stresses to devices formed in integrated circuits Grant 8,247,947 - Elmegreen , et al. August 21, 2	2012-08-21
Negative thermal expansion system (NTES) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging Grant 8,241,957 - Hougham , et al. August 14, 2	2012-08-14
Negative Coefficient Thermal Expansion Engineered Particles For Composite Fabrication App 20120121906 - Hougham; Gareth G. ; et al.	2012-05-17
Piezo-effect transistor device and applications Grant 8,159,854 - Elmegreen , et al. April 17, 2	2012-04-17
Dislocation engineering using a scanned laser Grant 8,138,066 - Lai , et al. March 20, 2	2012-03-20
Negative coefficient thermal expansion engineered particles for composite fabrication Grant 8,138,448 - Hougham , et al. March 20, 2	2012-03-20
Negative coefficient of thermal expansion particles Grant 8,119,206 - Hougham , et al. February 21, 2	2012-02-21
Structure for inhibiting back end of line damage from dicing and chip packaging interaction failures Grant 8,076,756 - Lane , et al. December 13, 2	2011-12-13
Reprogrammable Fuse Structure and Method App 20110207286 - Burr; Geoffrey W. ; et al.	2011-08-25
Structure For Inhibiting Back End Of Line Damage From Dicing And Chip Packaging Interaction Failures App 20110140245 - LANE; MICHAEL W. ; et al.	2011-06-16
Reprogrammable fuse structure and method Grant 7,960,808 - Burr , et al. June 14, 2	2011-06-14
Coupling Piezoelectric Material Generated Stresses To Devices Formed In Integrated Circuits App 20110133603 - Elmegreen; Bruce G. ; et al.	2011-06-09
Using crack arrestor for inhibiting damage from dicing and chip packaging interaction failures in back end of line structures Grant 7,955,955 - Lane , et al. June 7, 2	2011-06-07
Crackstop structures and methods of making same Grant 7,955,952 - Liu , et al. June 7, 2	2011-06-07
Electronics structures using a sacrificial multi-layer hardmask scheme Grant 7,947,907 - Colburn , et al. May 24, 2	2011-05-24
Enhanced transistor performance by non-conformal stressed layers Grant 7,935,588 - Doris , et al. May 3, 2	2011-05-03
Negative Thermal Expansion System (NTES) Device for TCE Compensation in Elastomer Composites and Conductive Elastomer Interconnects in Microelectronic Packaging App 20110034047 - HOUGHAM; Gareth Geoffrey ; et al.	2011-02-10
Negative thermal expansion system (NTEs) device for TCE compensation in elastomer compsites and conductive elastomer interconnects in microelectronic packaging Grant 7,883,919 - Hougham , et al. February 8, 2	2011-02-08
Nanostructure For Changing Electric Mobility App 20110012177 - Chidambarrao; Dureseti ; et al.	2011-01-20
Multiple Orientation Nanowires With Gate Stack Stressors App 20110012176 - CHIDAMBARRAO; Dureseti ; et al.	2011-01-20
Piezo-effect Transistor Device And Applications App 20100328984 - Elmegreen; Bruce G. ; et al.	2010-12-30
Piezo-driven non-volatile memory cell with hysteretic resistance Grant 7,848,135 - Elmegreen , et al. December 7, 2	2010-12-07
Crackstop structures and methods of making same Grant 7,790,577 - Liu , et al. September 7, 2	2010-09-07
Dislocation Engineering Using A Scanned Laser App 20100081259 - Lai; Chung Woh ; et al.	2010-04-01
Piezo-driven Non-volatile Memory Cell With Hysteretic Resistance App 20100073997 - Elmegreen; Bruce G. ; et al.	2010-03-25
Crackstop Structures And Methods Of Making Same App 20100013043 - Liu; Xiao Hu ; et al.	2010-01-21
Crackstop Structures And Methods Of Making Same App 20100012950 - Liu; Xiao Hu ; et al.	2010-01-21
Ultralow Dielectric Constant Layer With Controlled Biaxial Stress App 20090304951 - Dimitrakopoulos; Christos Dimitrios ; et al.	2009-12-10
Negative Thermal Expansion System (NTES) Device for TCE Compensation in Elastomer Compsites and Conductive Elastomer Interconnects in Microelectronic Packaging App 20090263991 - Hougham; Gareth Geoffrey ; et al.	2009-10-22
Negative Coefficient of Thermal Expansion Particles and Method of Forming the Same App 20090214780 - Hougham; Gareth Geoffrey ; et al.	2009-08-27
Negative coefficient of thermal expansion particles and method of forming the same Grant 7,579,069 - Hougham , et al. August 25, 2	2009-08-25
Negative thermal expansion system (NTEs) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging Grant 7,556,979 - Hougham , et al. July 7, 2	2009-07-07
Negative Coefficient Thermal Expansion Engineered Particles For Composite Fabrication App 20090169886 - Hougham; Gareth G. ; et al.	2009-07-02
Strained MOS devices using source/drain epitaxy Grant 7,525,161 - Ieong , et al. April 28, 2	2009-04-28
Heat-shielded low power PCM-based reprogrammable eFUSE device Grant 7,491,965 - Doyle , et al. February 17, 2	2009-02-17
Ultralow Dielectric Constant Layer With Controlled Biaxial Stress App 20080286494 - Dimitrakopoulos; Christos Dimitrios ; et al.	2008-11-20
Inhibiting Damage From Dicing And Chip Packaging Interaction Failures In Back End Of Line Structures App 20080277765 - Lane; Michael W. ; et al.	2008-11-13
Electronics Structures Using a Sacrificial Multi-Layer Hardmask Scheme App 20080251284 - Colburn; Matthew Earl ; et al.	2008-10-16
Heat-shielded Low Power Pcm-based Reprogrammable Efuse Device App 20080224118 - Doyle; James P. ; et al.	2008-09-18
Enhanced Transistor Performance by Non-Conformal Stressed Layers App 20080217663 - Doris; Bruce B. ; et al.	2008-09-11
Negative thermal expansion system (NTEs) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging Grant 7,417,315 - Hougham , et al. August 26, 2	2008-08-26
Strained MOS devices using source/drain epitaxy App 20080179627 - Ieong; Meikei ; et al.	2008-07-31
Dielectric Cap Having Material With Optical Band Gap To Substantially Block Uv Radiation During Curing Treatment, And Related Methods App 20080173985 - Belyansky; Michael P. ; et al.	2008-07-24
Heat-shielded low power PCM-based reprogrammable EFUSE device Grant 7,394,089 - Doyle , et al. July 1, 2	2008-07-01
Reprogrammable fuse structure and method Grant 7,388,273 - Burr , et al. June 17, 2	2008-06-17
Process for preparing electronics structures using a sacrificial multilayer hardmask scheme Grant 7,371,684 - Colburn , et al. May 13, 2	2008-05-13
Ultralow dielectric constant layer with controlled biaxial stress Grant 7,357,977 - Dimitrakopoulos , et al. April 15, 2	2008-04-15
Heat-shielded Low Power Pcm-based Reprogrammable Efuse Device App 20080048169 - Doyle; James P. ; et al.	2008-02-28
Negative Thermal Expansion System (NTES) Device for TCE Compensation in Elastomer Composites and Conductive Elastomer Interconnects in Microelectronic Packaging App 20080048305 - Hougham; Gareth Geoffrey ; et al.	2008-02-28
Ultralow Dielectric Constant Layer With Controlled Biaxial Stress App 20080044668 - Dimitrakopoulos; Christos Dimitrios ; et al.	2008-02-21
Reprogrammable Fuse Structure and Method App 20070290233 - Burr; Geoffrey W. ; et al.	2007-12-20
Silicon chip carrier with conductive through-vias and method for fabricating same Grant 7,276,787 - Edelstein , et al. October 2, 2	2007-10-02
Method of extracting properties of back end of line (BEOL) chip architecture Grant 7,260,810 - Filippi, Jr. , et al. August 21, 2	2007-08-21
Reprogrammable fuse structure and method App 20060278895 - Burr; Geoffrey W. ; et al.	2006-12-14
Process for preparing electronics structures using a sacrificial multilayer hardmask scheme App 20060258159 - Colburn; Matthew Earl ; et al.	2006-11-16
Silicon chip carrier with conductive through-vias and method for fabricating same App 20060027934 - Edelstein; Daniel Charles ; et al.	2006-02-09
Stacked via-stud with improved reliability in copper metallurgy App 20060014376 - Agarwala; Birendra N. ; et al.	2006-01-19
Stacked via-stud with improved reliability in copper metallurgy Grant 6,972,209 - Agarwala , et al. December 6, 2	2005-12-06
Silicon chip carrier with conductive through-vias and method for fabricating same App 20050121768 - Edelstein, Daniel Charles ; et al.	2005-06-09
Negative coefficient of thermal expansion particles and method of forming the same App 20050100743 - Hougham, Gareth Geoffrey ; et al.	2005-05-12
Method of extracting properties of back end of line (BEOL) chip architecture App 20050086628 - Filippi, Ronald G. JR. ; et al.	2005-04-21
Negative thermal expansion system (NTEs) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging App 20040110322 - Hougham, Gareth Geoffrey ; et al.	2004-06-10
Stacked via-stud with improved reliability in copper metallurgy App 20040101663 - Agarwala, Birendra N. ; et al.	2004-05-27

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