Liu; Wen-Chun
Patent Applications and Registrations
Patent applications and USPTO patent grants for Liu; Wen-Chun.The latest application filed is for "package structure".
- Liu; Wen-Chun - Taichung TW
- Liu; Wen-Chun - Taichung City TW
- LIU; Wen-Chun - Hsinchu TW
- Liu; Wen Chun - Chesterfield MO US
- Liu; Wen-Chun - Kaohsiung TW
- Liu, Wen-Chun - Pingtung City TW
- Liu; Wen-Chun - Pingtung Hsien TW
| Patent | Date |
|---|---|
| Package structure and manufacturing method of package structure Grant 10,256,180 - Liu , et al. | 2019-04-09 |
| Package structure Grant 10,134,668 - Liu , et al. November 20, 2 | 2018-11-20 |
| Package Structure App 20180294218 - Liu; Wen-Chun ; et al. | 2018-10-11 |
| Semiconductor structure Grant 10,090,256 - Liu , et al. October 2, 2 | 2018-10-02 |
| Package structure Grant 9,859,193 - Liu , et al. January 2, 2 | 2018-01-02 |
| Recombinant H7 Hemagglutinin And Use Thereof App 20170342113 - WU; Suh-Chin ; et al. | 2017-11-30 |
| Package structure Grant 9,801,282 - Liu October 24, 2 | 2017-10-24 |
| Package Structure App 20170256479 - Liu; Wen-Chun ; et al. | 2017-09-07 |
| Carrier slide-bar device in arc motion Grant 9,753,358 - Hsin September 5, 2 | 2017-09-05 |
| Package Structure And Manufacturing Method Of Package Structure App 20170194241 - Liu; Wen-Chun ; et al. | 2017-07-06 |
| Recombinant neuraminidase and uses thereof Grant 9,688,965 - Wu , et al. June 27, 2 | 2017-06-27 |
| Deglycosylated hemagglutinin and manufacture thereof Grant 9,644,008 - Wu , et al. May 9, 2 | 2017-05-09 |
| Semiconductor Structure App 20170077045 - Liu; Wen-Chun ; et al. | 2017-03-16 |
| Package Structure App 20160353575 - Liu; Wen-Chun | 2016-12-01 |
| Package structure Grant 9,508,634 - Liu November 29, 2 | 2016-11-29 |
| Package substrate structure Grant 9,451,694 - Huang , et al. September 20, 2 | 2016-09-20 |
| Package Structure App 20160233152 - Liu; Wen-Chun | 2016-08-11 |
| Recombinant Neuraminidase And Uses Thereof App 20160067328 - WU; Suh-Chin ; et al. | 2016-03-10 |
| Package Substrate Structure App 20150373849 - Huang; Chih-Kung ; et al. | 2015-12-24 |
| Package Structure App 20150364448 - Huang; Chih-Kung ; et al. | 2015-12-17 |
| Deglycosylated Hemagglutinin And Manufacture Thereof App 20150183833 - WU; Suh-Chin ; et al. | 2015-07-02 |
| Influenza Virus-like Particles Comprising Adjuvant-fused M2 Protein To Enhance The Immunogenicity Of Vaccine App 20140221628 - Wu; Suh-Chin ; et al. | 2014-08-07 |
| Package having array of metal pegs linked by printed circuit lines Grant 6,762,118 - Liu , et al. July 13, 2 | 2004-07-13 |
| Method for making multi-chip packages and single chip packages simultaneously and structures from thereof App 20030224542 - Liu, Wen-Chun | 2003-12-04 |
| Encapsulated Semiconductor Die Package, And Method For Making Same App 20020140113 - Liu, Wen-Chun ; et al. | 2002-10-03 |
| Built-in micro-speaker for wireless communication device App 20020127976 - Liu, Wen-Chun | 2002-09-12 |
| Package having array of metal pegs linked by printed circuit lines App 20020089053 - Liu, Wen-Chun ; et al. | 2002-07-11 |
| Heat dissipation module for a BGA IC App 20020020926 - Liu, Wen-Chun ; et al. | 2002-02-21 |
| Lead frame type semiconductor package Grant 6,278,182 - Liu , et al. August 21, 2 | 2001-08-21 |
| Lead frame with heat slug Grant 6,262,475 - Liu , et al. July 17, 2 | 2001-07-17 |
| Lead frame structure Grant 6,204,553 - Liu , et al. March 20, 2 | 2001-03-20 |
| Lead frame structure for preventing the warping of semiconductor package body Grant 6,078,099 - Liu , et al. June 20, 2 | 2000-06-20 |
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