| Patent | Date |
|---|
Semiconductor device and method of manufacture
Grant 11,456,240 - Yu , et al. September 27, 2 | 2022-09-27 |
Integrated circuit component and package structure having the same
Grant 11,450,579 - Liu , et al. September 20, 2 | 2022-09-20 |
Structure With Interconnection Die And Method Of Making Same
App 20220293524 - Tsai; Hao-Yi ; et al. | 2022-09-15 |
Semiconductor Package And Method Of Fabricating The Same
App 20220293483 - Tsai; Hao-Yi ; et al. | 2022-09-15 |
Die Stack Structure And Manufacturing Method Thereof
App 20220293568 - Yu; Chen-Hua ; et al. | 2022-09-15 |
Integrated circuit package and method
Grant 11,443,995 - Yu , et al. September 13, 2 | 2022-09-13 |
Three-dimensional stacking structure and manufacturing method thereof
Grant 11,417,629 - Chen , et al. August 16, 2 | 2022-08-16 |
Die stack structure and manufacturing method thereof
Grant 11,380,653 - Yu , et al. July 5, 2 | 2022-07-05 |
Package Structure And Method Of Fabricating The Same
App 20220189918 - Chen; Ming-Fa ; et al. | 2022-06-16 |
Die Stack Structure, Semiconductor Structure And Method Of Fabricating The Same
App 20220181301 - Chen; Ming-Fa ; et al. | 2022-06-09 |
Package Structure And Method Of Manufacturing The Same
App 20220139882 - Chen; Ming-Fa ; et al. | 2022-05-05 |
Package structure and method of fabricating the same
Grant 11,322,477 - Chen , et al. May 3, 2 | 2022-05-03 |
Semiconductor structure and method of fabricating the same
Grant 11,264,362 - Chen , et al. March 1, 2 | 2022-03-01 |
Package structure and method of manufacturing the same
Grant 11,233,035 - Chen , et al. January 25, 2 | 2022-01-25 |
Method For Fabricating A Chip Package
App 20210391168 - Chen; Jie ; et al. | 2021-12-16 |
Package Structures And Methods Of Fabricating The Same
App 20210391322 - Chen; Ming-Fa ; et al. | 2021-12-16 |
Stacking Structure, Package Structure And Method Of Fabricating The Same
App 20210384164 - Chen; Ming-Fa ; et al. | 2021-12-09 |
Semiconductor Structure And Method Of Fabricating The Same
App 20210375826 - Chen; Ming-Fa ; et al. | 2021-12-02 |
Package Structure And Method Of Manufacturing The Same
App 20210375827 - Chen; Ming-Fa ; et al. | 2021-12-02 |
Semiconductor structure and method manufacturing the same
Grant 11,164,848 - Chen , et al. November 2, 2 | 2021-11-02 |
Manufacturing Method Of Semiconductor Structure
App 20210327807 - Chen; Ming-Fa ; et al. | 2021-10-21 |
Package
App 20210305214 - Chen; Ming-Fa ; et al. | 2021-09-30 |
Semiconductor Device And Method
App 20210305094 - Chen; Ming-Fa ; et al. | 2021-09-30 |
Semiconductor Packages
App 20210296251 - Chen; Ming-Fa ; et al. | 2021-09-23 |
Package Structure, Chip Structure And Method Of Fabricating The Same
App 20210296288 - Chen; Ming-Fa ; et al. | 2021-09-23 |
Integrated Circuit Package and Method
App 20210288030 - Chen; Ming-Fa ; et al. | 2021-09-16 |
Stacking structure, package structure and method of fabricating the same
Grant 11,114,413 - Chen , et al. September 7, 2 | 2021-09-07 |
Mask assembly and method for fabricating a chip package
Grant 11,107,680 - Chen , et al. August 31, 2 | 2021-08-31 |
Three-dimensional Stacking Structure And Manufacturing Method Thereof
App 20210249380 - Chen; Ming-Fa ; et al. | 2021-08-12 |
Semiconductor structure and manufacturing method thereof
Grant 11,069,608 - Chen , et al. July 20, 2 | 2021-07-20 |
Semiconductor Structure And Manufacturing Method Thereof
App 20210217710 - LIU; TZUAN-HORNG ; et al. | 2021-07-15 |
Package structure, chip structure and method of fabricating the same
Grant 11,063,019 - Chen , et al. July 13, 2 | 2021-07-13 |
Package and manufacturing method of reconstructed wafer
Grant 11,063,022 - Chen , et al. July 13, 2 | 2021-07-13 |
Integrated Circuit Component And Package Structure Having The Same
App 20210210395 - Liu; Tzuan-Horng ; et al. | 2021-07-08 |
Semiconductor packages and method of forming the same
Grant 11,056,438 - Chen , et al. July 6, 2 | 2021-07-06 |
Package Structure
App 20210202438 - Liu; Tzuan-Horng ; et al. | 2021-07-01 |
Integrated circuit package and method
Grant 11,024,605 - Chen , et al. June 1, 2 | 2021-06-01 |
Semiconductor Structures and Methods of Forming the Same
App 20210134730 - Yu; Chen-Hua ; et al. | 2021-05-06 |
Semiconductor structure and manufacturing method thereof
Grant 10,978,410 - Liu , et al. April 13, 2 | 2021-04-13 |
Integrated Circuit Package and Method
App 20210098323 - Yu; Chen-Hua ; et al. | 2021-04-01 |
Package Structure And Method Of Fabricating The Same
App 20210098420 - Chen; Ming-Fa ; et al. | 2021-04-01 |
Integrated circuit component and package structure having the same
Grant 10,957,610 - Liu , et al. March 23, 2 | 2021-03-23 |
Package And Manufacturing Method Of Reconstructed Wafer
App 20210082874 - Chen; Ming-Fa ; et al. | 2021-03-18 |
Package structure
Grant 10,950,576 - Liu , et al. March 16, 2 | 2021-03-16 |
Die Stack Structure And Manufacturing Method Thereof
App 20210066254 - Yu; Chen-Hua ; et al. | 2021-03-04 |
Semiconductor Structure And Manufacturing Method Thereof
App 20210057332 - Chen; Ming-Fa ; et al. | 2021-02-25 |
Package Structure, Chip Structure And Method Of Fabricating The Same
App 20210020602 - Chen; Ming-Fa ; et al. | 2021-01-21 |
Semiconductor Packages And Method Of Forming The Same
App 20200411445 - Chen; Ming-Fa ; et al. | 2020-12-31 |
Package And Manufacturing Method Thereof
App 20200411473 - Chen; Ming-Fa ; et al. | 2020-12-31 |
Stacking Structure, Package Structure And Method Of Fabricating The Same
App 20200411476 - Chen; Ming-Fa ; et al. | 2020-12-31 |
Semiconductor Structure And Method Manufacturing The Same
App 20200402960 - Chen; Ming-Fa ; et al. | 2020-12-24 |
Semiconductor Structure And Method Manufacturing The Same
App 20200402942 - Chen; Ming-Fa ; et al. | 2020-12-24 |
Semiconductor structures and methods of forming the same
Grant 10,867,929 - Yu , et al. December 15, 2 | 2020-12-15 |
Integrated circuit package and method
Grant 10,867,879 - Yu , et al. December 15, 2 | 2020-12-15 |
Semiconductor Device and Method of Manufacture
App 20200388563 - Yu; Chen-Hua ; et al. | 2020-12-10 |
Integrated Circuit Package and Method
App 20200381396 - Chen; Ming-Fa ; et al. | 2020-12-03 |
Interposer Test Structures and Methods
App 20200350221 - Liu; Tzuan-Horng ; et al. | 2020-11-05 |
Semiconductor device packaging structure having through interposer vias and through substrate vias
Grant 10,756,010 - Yu , et al. A | 2020-08-25 |
Interposer test structures and methods
Grant 10,734,295 - Liu , et al. | 2020-08-04 |
Semiconductor Structures And Methods Of Forming The Same
App 20200185330 - Yu; Chen-Hua ; et al. | 2020-06-11 |
Semiconductor Structure And Manufacturing Method Thereof
App 20200126933 - LIU; TZUAN-HORNG ; et al. | 2020-04-23 |
Semiconductor Device and Method of Manufacture
App 20200118915 - Yu; Chen-Hua ; et al. | 2020-04-16 |
Integrated Circuit Package and Method
App 20200105635 - Yu; Chen-Hua ; et al. | 2020-04-02 |
Package Structure
App 20200051955 - Liu; Tzuan-Horng ; et al. | 2020-02-13 |
Integrated Circuit Component And Package Structure Having The Same
App 20200043816 - Liu; Tzuan-Horng ; et al. | 2020-02-06 |
Semiconductor structure and manufacturing method thereof
Grant 10,510,691 - Liu , et al. Dec | 2019-12-17 |
Method of manufacturing semiconductor device packaging structure having through interposer vias and through substrate vias
Grant 10,510,650 - Yu , et al. Dec | 2019-12-17 |
3dic Structure And Method Of Manufacturing The Same
App 20190355696 - Liu; Tzuan-Horng ; et al. | 2019-11-21 |
Integrated circuit component and package structure having the same
Grant 10,483,174 - Liu , et al. Nov | 2019-11-19 |
3DIC structure and method of manufacturing the same
Grant 10,468,379 - Liu , et al. No | 2019-11-05 |
Semiconductor Device and Method of Manufacture
App 20190244947 - Yu; Chen-Hua ; et al. | 2019-08-08 |
Configurable routing for packaging applications
Grant 10,262,939 - Lu , et al. | 2019-04-16 |
Mask Assembly And Method For Fabricating A Chip Package
App 20190067001 - Chen; Jie ; et al. | 2019-02-28 |
Interposer Test Structures and Methods
App 20190057912 - Liu; Tzuan-Horng ; et al. | 2019-02-21 |
Semiconductor Structure And Manufacturing Method Thereof
App 20190051621 - LIU; Tzuan-Horng ; et al. | 2019-02-14 |
Interposer test structures and methods
Grant 10,090,213 - Liu , et al. October 2, 2 | 2018-10-02 |
Mechanism for forming patterned metal pad connected to multiple through silicon vias (TSVs)
Grant 9,978,637 - Liu , et al. May 22, 2 | 2018-05-22 |
Interposer Test Structures and Methods
App 20170178983 - Liu; Tzuan-Horng ; et al. | 2017-06-22 |
Methods of manufacturing a package
Grant 9,653,531 - Yen , et al. May 16, 2 | 2017-05-16 |
Methods and apparatus of packaging with interposers
Grant 9,627,223 - Lu , et al. April 18, 2 | 2017-04-18 |
Configurable Routing for Packaging Applications
App 20170098607 - Lu; Chung-Yu ; et al. | 2017-04-06 |
Interposer test structures and methods
Grant 9,589,857 - Liu , et al. March 7, 2 | 2017-03-07 |
Passivation layer for packaged chip
Grant 9,570,366 - Jeng , et al. February 14, 2 | 2017-02-14 |
Configurable routing for packaging applications
Grant 9,530,730 - Lu , et al. December 27, 2 | 2016-12-27 |
Methods and Apparatus of Packaging with Interposers
App 20160204079 - Lu; Chung-Yu ; et al. | 2016-07-14 |
Methods and apparatus of packaging with interposers
Grant 9,305,808 - Lu , et al. April 5, 2 | 2016-04-05 |
Interposer Test Structures and Methods
App 20150380324 - Liu; Tzuan-Horng ; et al. | 2015-12-31 |
Interposer test structures and methods
Grant 9,128,123 - Liu , et al. September 8, 2 | 2015-09-08 |
Semiconductor device having conductive pads and a method of manufacturing the same
Grant 9,129,818 - Kuo , et al. September 8, 2 | 2015-09-08 |
Methods and Apparatus of Packaging with Interposers
App 20150249019 - Lu; Chung-Yu ; et al. | 2015-09-03 |
Methods and apparatus of packaging with interposers
Grant 9,064,705 - Lu , et al. June 23, 2 | 2015-06-23 |
Configurable Routing for Packaging Applications
App 20150130082 - Lu; Chung-Yu ; et al. | 2015-05-14 |
Mechanism for Forming Patterned Metal Pad connected to Multiple Through Silicon Vias (TSVs)
App 20150102482 - Liu; Tzuan-Horng ; et al. | 2015-04-16 |
Reducing delamination between an underfill and a buffer layer in a bond structure
Grant 8,963,328 - Yang , et al. February 24, 2 | 2015-02-24 |
Methods Of Manufacturing A Package
App 20150031184 - Yen; Hsiao-Tsung ; et al. | 2015-01-29 |
Multi-direction design for bump pad structures
Grant 8,916,971 - Chen , et al. December 23, 2 | 2014-12-23 |
Methods and apparatus for inductors and transformers in packages
Grant 8,896,094 - Yen , et al. November 25, 2 | 2014-11-25 |
Multi-Direction Design for Bump Pad Structures
App 20140220776 - Chen; Chih-Hua ; et al. | 2014-08-07 |
Methods and Apparatus for Inductors and Transformers in Packages
App 20140203397 - Yen; Hsiao-Tsung ; et al. | 2014-07-24 |
Methods and Apparatus of Packaging with Interposers
App 20140167269 - Lu; Chung-Yu ; et al. | 2014-06-19 |
Dummy metal design for packaging structures
Grant 8,753,971 - Liu , et al. June 17, 2 | 2014-06-17 |
Multi-direction design for bump pad structures
Grant 8,729,700 - Chen , et al. May 20, 2 | 2014-05-20 |
Semiconductor Device Having Conductive Pads And A Method Of Manufacturing The Same
App 20140131862 - KUO; Chen-Cheng ; et al. | 2014-05-15 |
Reducing Delamination Between an Underfill and a Buffer Layer in a Bond Structure
App 20140087522 - Yang; Ching-Jung ; et al. | 2014-03-27 |
Package-on-package structures with reduced bump bridging
Grant 8,669,651 - Yang , et al. March 11, 2 | 2014-03-11 |
Semiconductor device having conductive pads and a method of manufacturing the same
Grant 8,659,170 - Kuo , et al. February 25, 2 | 2014-02-25 |
Passivation Layer For Packaged Chip
App 20140014959 - JENG; Shin-Puu ; et al. | 2014-01-16 |
Reducing delamination between an underfill and a buffer layer in a bond structure
Grant 8,610,267 - Yang , et al. December 17, 2 | 2013-12-17 |
Passivation layer for packaged chip
Grant 8,558,229 - Jeng , et al. October 15, 2 | 2013-10-15 |
Multi-direction design for bump pad structures
Grant 8,546,941 - Chen , et al. October 1, 2 | 2013-10-01 |
Multi-Direction Design for Bump Pad Structures
App 20130249091 - Chen; Chih-Hua ; et al. | 2013-09-26 |
Passivation Layer For Packaged Chip
App 20130147032 - JENG; Shin-Puu ; et al. | 2013-06-13 |
Increasing dielectric strength by optimizing dummy metal distribution
Grant 8,434,041 - Chen , et al. April 30, 2 | 2013-04-30 |
Interposer Test Structures and Methods
App 20120305916 - Liu; Tzuan-Horng ; et al. | 2012-12-06 |
Semiconductor device having pad structure with stress buffer layer
Grant 8,283,781 - Wu , et al. October 9, 2 | 2012-10-09 |
Package structure and method for reducing dielectric layer delamination
Grant 8,227,916 - Wei , et al. July 24, 2 | 2012-07-24 |
Increasing Dielectric Strength by Optimizing Dummy Metal Distribution
App 20120180018 - Chen; Hsien-Wei ; et al. | 2012-07-12 |
Dummy Metal Design for Packaging Structures
App 20120178252 - Liu; Tzuan-Horng ; et al. | 2012-07-12 |
Dummy metal design for packaging structures
Grant 8,193,639 - Liu , et al. June 5, 2 | 2012-06-05 |
Semiconductor Device Having Pad Structure With Stress Buffer Layer
App 20120061823 - WU; Wei-Cheng ; et al. | 2012-03-15 |
Reducing Delamination Between an Underfill and a Buffer layer in a Bond Structure
App 20120018875 - Yang; Ching-Jung ; et al. | 2012-01-26 |
Package-on-Package Structures with Reduced Bump Bridging
App 20120018877 - Yang; Chung-Ying ; et al. | 2012-01-26 |
Dummy Metal Design for Packaging Structures
App 20110241202 - Liu; Tzuan-Horng ; et al. | 2011-10-06 |
Multi-Direction Design for Bump Pad Structures
App 20110186988 - Chen; Chih-Hua ; et al. | 2011-08-04 |
Semiconductor Device Having Conductive Pads And A Method Of Manufacturing The Same
App 20110175220 - KUO; Chen-Cheng ; et al. | 2011-07-21 |
Package Structure And Method For Reducing Dielectric Layer Delamination
App 20110018128 - WEI; Hsiu-Ping ; et al. | 2011-01-27 |
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