Liu; Nai-Wei
Patent Applications and Registrations
Patent applications and USPTO patent grants for Liu; Nai-Wei.The latest application filed is for "innovative air gap for antenna fan out package".
Company Profile
23.36.53
- Liu; Nai-Wei - Hsin-Chu TW
- Liu; Nai-Wei - Kaohsiung TW
- LIU; Nai-Wei - Hsinchu City TW
- Liu; Nai-Wei - Hsinchu TW
- Liu; Nai-Wei - Fengshan TW
- Liu; Nai-Wei - Fengshan City TW
- LIU; Nai-Wei - Kaohsiung City TW
- Liu; Nai-Wei - Kaohsiung County TW
- - Kaohsiung TW
Patent Activity
| Patent | Date |
|---|---|
| Chip scale package structure and method of forming the same Grant 11,450,606 - Chi , et al. September 20, 2 | 2022-09-20 |
| Semiconductor package structure Grant 11,410,936 - Lin , et al. August 9, 2 | 2022-08-09 |
| Innovative Air Gap For Antenna Fan Out Package App 20220173497 - Liu; Nai-Wei ; et al. | 2022-06-02 |
| Semiconductor Package And Method Of Forming The Same App 20220157732 - TSAI; Yi-Lin ; et al. | 2022-05-19 |
| Semiconductor Package Structure With Antenna App 20210327835 - Liu; Nai-Wei ; et al. | 2021-10-21 |
| Fan-out Package Structure With Integrated Antenna App 20210273317 - Liu; Nai-Wei ; et al. | 2021-09-02 |
| Semiconductor package structure with antenna Grant 11,081,453 - Liu , et al. August 3, 2 | 2021-08-03 |
| Fan-out package structure with integrated antenna Grant 11,043,730 - Liu , et al. June 22, 2 | 2021-06-22 |
| Semiconductor Package Including Lid Structure With Opening And Recess App 20210175137 - CHANG; Chia-Cheng ; et al. | 2021-06-10 |
| Semiconductor package with antenna and fabrication method thereof Grant 11,024,954 - Liu , et al. June 1, 2 | 2021-06-01 |
| Semiconductor package including lid structure with opening and recess Grant 10,957,611 - Chang , et al. March 23, 2 | 2021-03-23 |
| Semiconductor Package Structure Including Antenna App 20210035930 - CHI; Yen-Yao ; et al. | 2021-02-04 |
| PoP device Grant 10,867,897 - Chang , et al. December 15, 2 | 2020-12-15 |
| Fan-Out Package and Methods of Forming Thereof App 20200373264 - Shih; Wan-Ting ; et al. | 2020-11-26 |
| Semiconductor Package Structure App 20200365526 - LIN; Tzu-Hung ; et al. | 2020-11-19 |
| Chip Scale Package Structure And Method Of Forming The Same App 20200312732 - CHI; Yen-Yao ; et al. | 2020-10-01 |
| Semiconductor package structure Grant 10,784,211 - Lin , et al. Sept | 2020-09-22 |
| Fan-out package and methods of forming thereof Grant 10,741,511 - Shih , et al. A | 2020-08-11 |
| Stacked fan-out package structure Grant 10,692,789 - Liu , et al. | 2020-06-23 |
| Semiconductor Package Assembly Having A Conductive Electromagnetic Shield Layer App 20200168572 - Lin; Tzu-Hung ; et al. | 2020-05-28 |
| Chip Scale Package Structure And Method Of Forming The Same App 20200091070 - Chi; Yen-Yao ; et al. | 2020-03-19 |
| Semiconductor Package Structure With Antenna App 20200013735 - Liu; Nai-Wei ; et al. | 2020-01-09 |
| Semiconductor package device Grant 10,522,439 - Liu , et al. Dec | 2019-12-31 |
| Fan-Out Package and Methods of Forming Thereof App 20190355684 - Shih; Wan-Ting ; et al. | 2019-11-21 |
| Fan-out package structure and method for forming the same Grant 10483211 - | 2019-11-19 |
| Fan-out Package Structure With Integrated Antenna App 20190348748 - Liu; Nai-Wei ; et al. | 2019-11-14 |
| Semiconductor Package With Antenna And Fabrication Method Thereof App 20190348756 - Liu; Nai-Wei ; et al. | 2019-11-14 |
| Innovative Air Gap For Antenna Fan Out Package App 20190348747 - Liu; Nai-Wei ; et al. | 2019-11-14 |
| Semiconductor package assembly Grant 10,468,341 - Liu , et al. No | 2019-11-05 |
| Semiconductor Package Structure Having An Antenna Pattern Electrically Coupled To A First Redistribution Layer (rdl) App 20190252351 - Lin; Tzu-Hung ; et al. | 2019-08-15 |
| Fan-out package and methods of forming thereof Grant 10,366,960 - Shih , et al. July 30, 2 | 2019-07-30 |
| Semiconductor Package Assembly App 20190131233 - LIU; Nai-Wei ; et al. | 2019-05-02 |
| Semiconductor package with improved bandwidth Grant 10,217,723 - Lin , et al. Feb | 2019-02-26 |
| Semiconductor Package Including Lid Structure With Opening And Recess App 20190043771 - CHANG; Chia-Cheng ; et al. | 2019-02-07 |
| Semiconductor package assembly Grant 10,199,318 - Liu , et al. Fe | 2019-02-05 |
| Stacked Fan-out Package Structure App 20180323127 - Liu; Nai-Wei ; et al. | 2018-11-08 |
| Fan-out POP structure with inconsecutive polymer layer Grant 10,083,913 - Tsai , et al. September 25, 2 | 2018-09-25 |
| Semiconductor Package Device App 20180269124 - LIU; NAI-WEI ; et al. | 2018-09-20 |
| Semiconductor Package Structure App 20180269164 - LIN; Tzu-Hung ; et al. | 2018-09-20 |
| PoP Device App 20180233441 - Chang; Chin-Chuan ; et al. | 2018-08-16 |
| Semiconductor package device and manufacturing method thereof Grant 9,978,657 - Liu , et al. May 22, 2 | 2018-05-22 |
| PoP device Grant 9,953,907 - Chang , et al. April 24, 2 | 2018-04-24 |
| Semiconductor Package With Improved Bandwidth App 20180102343 - Lin; Tzu-Hung ; et al. | 2018-04-12 |
| Fan-out package structure having embedded package substrate Grant 9,941,260 - Lin , et al. April 10, 2 | 2018-04-10 |
| Fan-Out Package and Methods of Forming Thereof App 20180033747 - Shih; Wan-Ting ; et al. | 2018-02-01 |
| Semiconductor Package Assembly App 20170338175 - LIU; Nai-Wei ; et al. | 2017-11-23 |
| Fan-out package and methods of forming thereof Grant 9,824,989 - Shih , et al. November 21, 2 | 2017-11-21 |
| Fan-out Package Structure And Method For Forming The Same App 20170243826 - LIN; Tzu-Hung ; et al. | 2017-08-24 |
| Semiconductor Package Assembly App 20170141041 - LIN; Tzu-Hung ; et al. | 2017-05-18 |
| Fan-out Wafer Level Package Structure App 20170098589 - LIU; Nai-Wei ; et al. | 2017-04-06 |
| Stacked Fan-out Package Structure App 20170098629 - LIU; Nai-Wei ; et al. | 2017-04-06 |
| Semiconductor Package Structure And Method For Forming The Same App 20170098628 - LIU; Nai-Wei ; et al. | 2017-04-06 |
| Fan-out Package Structure Having Embedded Package Substrate App 20170077073 - LIN; Tzu-Hung ; et al. | 2017-03-16 |
| Structure And Layout Of Ball Grid Array Packages App 20170053884 - Lin; Tzu-Hung ; et al. | 2017-02-23 |
| Fan-out Package Structure Including Antenna App 20170040266 - LIN; Tzu-Hung ; et al. | 2017-02-09 |
| Fan-out POP Structure with Inconsecutive Polymer Layer App 20170025359 - Tsai; Yi-Lin ; et al. | 2017-01-26 |
| Interconnect structure for wafer level package Grant 9,553,000 - Yu , et al. January 24, 2 | 2017-01-24 |
| Semiconductor Package Device And Manufacturing Method Thereof App 20170011981 - LIU; NAI-WEI ; et al. | 2017-01-12 |
| Fan-out Package Structure Including Antenna App 20160329299 - LIN; Tzu-Hung ; et al. | 2016-11-10 |
| Fan-out POP Structure with Inconsecutive Polymer Layer App 20160307871 - Tsai; Yi-Lin ; et al. | 2016-10-20 |
| Semiconductor package device and manufacturing method thereof Grant 9,466,581 - Liu , et al. October 11, 2 | 2016-10-11 |
| Fan-out PoP structure with inconsecutive polymer layer Grant 9,461,018 - Tsai , et al. October 4, 2 | 2016-10-04 |
| Method and apparatus for a conductive pillar structure Grant 9,379,080 - Chang , et al. June 28, 2 | 2016-06-28 |
| Interconnect Structure for Wafer Level Package App 20160118272 - Yu; Chen-Hua ; et al. | 2016-04-28 |
| Method of packaging a semiconductor device Grant 9,312,148 - Lin , et al. April 12, 2 | 2016-04-12 |
| Fan-Out Package and Methods of Forming Thereof App 20160005702 - Shih; Wan-Ting ; et al. | 2016-01-07 |
| Interconnect structure for wafer level package Grant 9,230,902 - Yu , et al. January 5, 2 | 2016-01-05 |
| Method Of Packaging A Semiconductor Device App 20150187605 - LIN; Jing-Cheng ; et al. | 2015-07-02 |
| Method and Apparatus for a Conductive Pillar Structure App 20150187724 - Chang; Jung-Hua ; et al. | 2015-07-02 |
| Packaging methods and structures using a die attach film Grant 9,064,879 - Hung , et al. June 23, 2 | 2015-06-23 |
| Semiconductor Device And Manufacturing Method Thereof App 20150108634 - LIU; NAI-WEI ; et al. | 2015-04-23 |
| Packaged semiconductor device with a molding compound and a method of forming the same Grant 9,000,584 - Lin , et al. April 7, 2 | 2015-04-07 |
| Method and apparatus for a conductive pillar structure Grant 8,994,171 - Chang , et al. March 31, 2 | 2015-03-31 |
| Method of making a semiconductor device including barrier layers for copper interconnect Grant 8,975,749 - Liu , et al. March 10, 2 | 2015-03-10 |
| Interconnect Structure for Wafer Level Package App 20140339696 - Yu; Chen-Hua ; et al. | 2014-11-20 |
| Method and Apparatus for a Conductive Pillar Structure App 20140264828 - Chang; Jung-Hua ; et al. | 2014-09-18 |
| Interconnect structure for wafer level package Grant 8,829,676 - Yu , et al. September 9, 2 | 2014-09-09 |
| PoP Device App 20140210080 - Chang; Chin-Chuan ; et al. | 2014-07-31 |
| Method Of Making A Semiconductor Device Including Barrier Layers For Copper Interconnect App 20140127898 - LIU; Nai-Wei ; et al. | 2014-05-08 |
| Barrier layers for copper interconnect Grant 8,653,664 - Liu , et al. February 18, 2 | 2014-02-18 |
| Packaged Semiconductor Device And Method Of Packaging The Semiconductor Device App 20130168848 - LIN; Jing-Cheng ; et al. | 2013-07-04 |
| Packaging Methods and Structures Using a Die Attach Film App 20130062760 - Hung; Jui-Pin ; et al. | 2013-03-14 |
| Interconnect Structure for Wafer Level Package App 20130001776 - Yu; Chen-Hua ; et al. | 2013-01-03 |
| Barrier Layers For Copper Interconnect App 20110006429 - LIU; Nai-Wei ; et al. | 2011-01-13 |
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