LIU; Kuo-Chuan

Patent Applications and Registrations

Patent applications and USPTO patent grants for LIU; Kuo-Chuan.The latest application filed is for "testing holders for chip unit and die package".

Company Profile

4.33.35

LIU; Kuo-Chuan - Hsinchu City TW
Liu; Kuo-Chuan - Hsinchu TW
Liu; Kuo-Chuan - Hsin-Chu TW
Liu; Kuo-Chuan - Fremont CA
Liu; Kuo-Chuan - New Taipei N/A TW
Liu; Kuo-Chuan - New Taipei City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Testing Holders For Chip Unit And Die Package App 20220283221 - WANG; Mill-Jer ; et al.	2022-09-08
Semiconductor Device Package With Warpage Control Structure App 20220262746 - YEW; Ming-Chih ; et al.	2022-08-18
Testing holders for chip unit and die package Grant 11,340,291 - Wang , et al. May 24, 2	2022-05-24
Semiconductor device package with warpage control structure Grant 11,329,006 - Yew , et al. May 10, 2	2022-05-10
Testing Holders For Chip Unit And Die Package App 20200326370 - WANG; Mill-Jer ; et al.	2020-10-15
Semiconductor Device Package With Warpage Control Structure App 20200312790 - YEW; Ming-Chih ; et al.	2020-10-01
Testing holders for chip unit and die package Grant 10,698,026 - Wang , et al.	2020-06-30
Semiconductor device package with warpage control structure Grant 10,685,920 - Yew , et al.	2020-06-16
Testing Holders For Chip Unit And Die Package App 20180372796 - WANG; Mill-Jer ; et al.	2018-12-27
Package structure and method for forming same Grant 10,163,862 - Chen , et al. Dec	2018-12-25
Testing holders for chip unit and die package Grant 10,067,181 - Wang , et al. September 4, 2	2018-09-04
Package-on-package structure with through molding via Grant 10,008,480 - Yew , et al. June 26, 2	2018-06-26
Semiconductor Device Package With Warpage Control Structure App 20180082961 - YEW; Ming-Chih ; et al.	2018-03-22
Package-on-Package Structure with Through Molding Via App 20180026014 - Yew; Ming-Chih ; et al.	2018-01-25
Semiconductor device package with warpage control structure Grant 9,831,190 - Yew , et al. November 28, 2	2017-11-28
Package-on-package structure with through molding via Grant 9,780,076 - Yew , et al. October 3, 2	2017-10-03
Testing Holders For Chip Unit And Die Package App 20170248652 - WANG; Mill-Jer ; et al.	2017-08-31
Testing holders for chip unit and die package Grant 9,664,707 - Wang , et al. May 30, 2	2017-05-30
Package Structure and Method for Forming Same App 20170092623 - Chen; Hsien-Wei ; et al.	2017-03-30
Package-on-Package Structure with Through Molding Via App 20170069605 - Yew; Ming-Chih ; et al.	2017-03-09
3D packages and methods for forming the same Grant 9,543,284 - Yew , et al. January 10, 2	2017-01-10
Package Structure and Method for Forming Same App 20160379965 - Chen; Hsien-Wei ; et al.	2016-12-29
Testing Holders For Chip Unit And Die Package App 20160370407 - WANG; Mill-Jer ; et al.	2016-12-22
Package structure and method for forming same Grant 9,520,385 - Chen , et al. December 13, 2	2016-12-13
Method of forming encapsulated semiconductor device package Grant 9,502,323 - Lin , et al. November 22, 2	2016-11-22
Package-on-package structure with through molding via Grant 9,502,387 - Yew , et al. November 22, 2	2016-11-22
Testing holders for chip unit and die package Grant 9,453,877 - Wang , et al. September 27, 2	2016-09-27
Testing Holders For Chip Unit And Die Package App 20160223584 - WANG; Mill-Jer ; et al.	2016-08-04
Testing holders for chip unit and die package Grant 9,341,671 - Wang , et al. May 17, 2	2016-05-17
Package-on-Package Structure with Through Molding Via App 20160118369 - Yew; Ming-Chih ; et al.	2016-04-28
3D Packages and Methods for Forming the Same App 20160111409 - Yew; Ming-Chih ; et al.	2016-04-21
3D packages and methods for forming the same Grant 9,252,076 - Yew , et al. February 2, 2	2016-02-02
Package-on-package structure with through molding via Grant 9,237,647 - Yew , et al. January 12, 2	2016-01-12
Semiconductor Device Package With Warpage Control Structure App 20150194389 - Yew; Ming-Chih ; et al.	2015-07-09
Method And Apparatus For Supporting A Computer Chip On A Printed Circuit Board Assembly App 20150173177 - Nagar; Mohan R. ; et al.	2015-06-18
Semiconductor Device Package and Method App 20150123257 - Lin; Wen-Yi ; et al.	2015-05-07
Package-on-Package Structure with Through Molding Via App 20150070865 - Yew; Ming-Chih ; et al.	2015-03-12
Method and apparatus for supporting a computer chip on a printed circuit board assembly Grant 8,962,388 - Nagar , et al. February 24, 2	2015-02-24
3D Packages and Methods for Forming the Same App 20150041987 - Yew; Ming-Chih ; et al.	2015-02-12
Semiconductor device package and method Grant 8,941,248 - Lin , et al. January 27, 2	2015-01-27
Semiconductor device package and method Grant 8,901,732 - Yew , et al. December 2, 2	2014-12-02
Testing Holders For Chip Unit And Die Package App 20140266281 - Wang; Mill-Jer ; et al.	2014-09-18
Semiconductor Device Package and Method App 20140264815 - Yew; Ming-Chih ; et al.	2014-09-18
Semiconductor Device Package and Method App 20140264813 - Lin; Wen-Yi ; et al.	2014-09-18
Lid for an electrical hardware component Grant 8,736,044 - Ahmad , et al. May 27, 2	2014-05-27
Locking mechanism and an optical disk drive having the same Grant 8,453,167 - Liu , et al. May 28, 2	2013-05-28
Cover Module App 20120317886 - Liu; Kuo-Chuan ; et al.	2012-12-20
Method And Apparatus For Supporting A Computer Chip On A Printed Circuit Board Assembly App 20120113608 - Nagar; Mohan R. ; et al.	2012-05-10
Locking Mechanism And An Optical Disk Drive Having The Same App 20120110604 - Liu; Kuo-Chuan ; et al.	2012-05-03
Lid For An Electrical Hardware Component App 20120018872 - Ahmad; Mudasir ; et al.	2012-01-26
Method and apparatus for supporting a computer chip on a printed circuit board assembly Grant 8,081,484 - Nagar , et al. December 20, 2	2011-12-20
Method and apparatus for supporting a computer chip on a printed circuit board assembly App 20080130241 - Nagar; Mohan R. ; et al.	2008-06-05
Methods of forming lanthanum-modified lead zirconium titanate (PLZT) layers Grant 7,261,918 - Liu August 28, 2	2007-08-28
Optical-routing boards for opto-electrical systems and methods and apparatuses for manufacturing the same Grant 7,224,857 - Liu May 29, 2	2007-05-29
Methods of forming LaNiO.sub.3 conductive layers, ferro-electric devices with LaNiO.sub.3 layers, and precursor formation solutions Grant 7,083,869 - Liu , et al. August 1, 2	2006-08-01
Optical-routing boards for opto-electrical systems and methods and apparatuses for manufacturing the same App 20060133718 - Liu; Kuo-Chuan	2006-06-22
Methods of forming lanthanum-modified lead zirconium titanate (PLZT) layers, devices with PLZT layers, and precursor formation solutions App 20050281943 - Liu, Kuo-Chuan	2005-12-22
Methods of forming LaNiO3 conductive layers, ferro-electric devices with LaNiO3 layers, and precursor formation solutions App 20050211135 - Liu, Kuo-Chuan ; et al.	2005-09-29
Optical switch fabricated by a thin film process Grant 6,885,789 - Liu April 26, 2	2005-04-26
Method and system for joining and an ultra-high density interconnect Grant 6,884,313 - Liu , et al. April 26, 2	2005-04-26
Method for joining conductive structures and an electrical conductive article Grant 6,800,169 - Liu , et al. October 5, 2	2004-10-05
All optical switch fabricated by a thin film process App 20030228088 - Liu, Kuo-Chuan	2003-12-11
Method for joining conductive structures and an electrical conductive article App 20030019568 - Liu, Kuo-Chuan ; et al.	2003-01-30
Method for joining and an ultra-high density interconnect App 20020129894 - Liu, Kuo-Chuan ; et al.	2002-09-19
Structure and method for forming z-laminated multilayered packaging substrate App 20020119396 - Jiang, Hunt Hang ; et al.	2002-08-29