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name:-0.034449100494385
name:-0.023035049438477
name:-0.00068998336791992
Liu; Jingbao Patent Filings

Liu; Jingbao

Patent Applications and Registrations

Patent applications and USPTO patent grants for Liu; Jingbao.The latest application filed is for "temperature enhanced electrostatic chucking in plasma processing apparatus".

Company Profile
0.20.21
  • Liu; Jingbao - Sunnyvale CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Apparatus for controlling the flow of a gas in a process chamber
Grant 9,443,753 - Palagashvili , et al. September 13, 2
2016-09-13
Method and apparatus for shaping a magnetic field in a magnetic field-enhanced plasma reactor
Grant 8,936,696 - Lindley , et al. January 20, 2
2015-01-20
Chamber with uniform flow and plasma distribution
Grant 8,840,725 - Palagashvili , et al. September 23, 2
2014-09-23
Temperature Enhanced Electrostatic Chucking In Plasma Processing Apparatus
App 20140034241 - Belostotskiy; Sergy G. ;   et al.
2014-02-06
Temperature enhanced electrostatic chucking in plasma processing apparatus
Grant 8,580,693 - Belostotskiy , et al. November 12, 2
2013-11-12
Plasma etch reactor with distribution of etch gases across a wafer surface and a polymer oxidizing gas in an independently fed center gas zone
Grant 8,187,415 - Kim , et al. May 29, 2
2012-05-29
Temperature Enhanced Electrostatic Chucking In Plasma Processing Apparatus
App 20120052690 - BELOSTOTSKIY; Sergey G. ;   et al.
2012-03-01
Apparatus For Controlling The Flow Of A Gas In A Process Chamber
App 20120024479 - PALAGASHVILI; DAVID ;   et al.
2012-02-02
Chamber With Uniform Flow And Plasma Distribution
App 20110162803 - PALAGASHVILI; DAVID ;   et al.
2011-07-07
Method And Apparatus For Shaping A Magnetic Field In A Magnetic Field-enhanced Plasma Reactor
App 20110115589 - LINDLEY; ROGER ALAN ;   et al.
2011-05-19
Method and apparatus for shaping a magnetic field in a magnetic field-enhanced plasma reactor
Grant 7,879,186 - Lindley , et al. February 1, 2
2011-02-01
Plasma control using dual cathode frequency mixing
Grant 7,838,430 - Shannon , et al. November 23, 2
2010-11-23
Halogen-free amorphous carbon mask etch having high selectivity to photoresist
Grant 7,807,064 - Kim , et al. October 5, 2
2010-10-05
Plasma control using dual cathode frequency mixing and controlling the level of polymer formation
Grant 7,736,914 - Liu , et al. June 15, 2
2010-06-15
Plasma Control Using Dual Cathode Frequency Mixing
App 20090142859 - LIU; JINGBAO ;   et al.
2009-06-04
Method And Apparatus For Shaping A Magnetic Field In A Magnetic Field-enhanced Plasma Reactor
App 20090008033 - Lindley; Roger Alan ;   et al.
2009-01-08
Method of controlling sidewall profile by using intermittent, periodic introduction of cleaning species into the main plasma etching species
App 20080286979 - Shin; Taeho ;   et al.
2008-11-20
Halogen-free Amorphous Carbon Mask Etch Having High Selectivity To Photoresist
App 20080230511 - Kim; Jong Mun ;   et al.
2008-09-25
Method and apparatus for shaping a magnetic field in a magnetic field-enhanced plasma reactor
Grant 7,422,654 - Lindley , et al. September 9, 2
2008-09-09
Methods For Etching High Aspect Ratio Features
App 20080203056 - WANG; JUDY ;   et al.
2008-08-28
Apparatus for uniformly etching a dielectric layer
Grant 7,316,761 - Doan , et al. January 8, 2
2008-01-08
Plasma etch process using etch uniformity control by using compositionally independent gas feed
App 20070249173 - Kim; Jong Mun ;   et al.
2007-10-25
Plasma etch reactor with distribution of etch gases across a wafer surface and a polymer oxidizing gas in an independently fed center gas zone
App 20070247075 - Kim; Jong Mun ;   et al.
2007-10-25
Method of controlling silicon-containing polymer build up during etching by using a periodic cleaning step
App 20070243714 - Shin; Taeho ;   et al.
2007-10-18
Plasma Control Using Dual Cathode Frequency Mixing
App 20070000611 - Shannon; Steven C. ;   et al.
2007-01-04
Ashable layers for reducing critical dimensions of integrated circuit features
Grant 7,105,442 - Shan , et al. September 12, 2
2006-09-12
Plasma control using dual cathode frequency mixing
App 20050090118 - Shannon, Steven C. ;   et al.
2005-04-28
Method and apparatus for shaping a magnetic field in a magnetic field-enhanced plasma reactor
App 20040182516 - Lindley, Roger Alan ;   et al.
2004-09-23
Flash step preparatory to dielectric etch
Grant 6,787,475 - Wang , et al. September 7, 2
2004-09-07
Apparatus for uniformly etching a dielectric layer
App 20040149394 - Doan, Kenny L. ;   et al.
2004-08-05
Ashable layers for reducing critical dimensions of integrated circuit features
App 20030219988 - Shan, Hongqing ;   et al.
2003-11-27
Magnetically enhanced plasma oxide etch using hexafluorobutadiene
Grant 6,613,689 - Liu , et al. September 2, 2
2003-09-02
Flash step preparatory to dielectric etch
App 20030045116 - Wang, Zhuxu ;   et al.
2003-03-06
Magnetically enhanced plasma oxide etch using hexafluorobutadiene
App 20020173162 - Liu, Jingbao ;   et al.
2002-11-21
Magnetically enhanced plasma etch process using a heavy fluorocarbon etching gas
Grant 6,451,703 - Liu , et al. September 17, 2
2002-09-17
Etch method using a dielectric etch chamber with expanded process window
Grant 6,403,491 - Liu , et al. June 11, 2
2002-06-11

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