| Patent | Date |
|---|
Image Sensor Device
App 20210043670 - JANGJIAN; Shiu-Ko ; et al. | 2021-02-11 |
Method of manufacturing semiconductor structure
Grant 10,867,889 - Fang , et al. December 15, 2 | 2020-12-15 |
Image sensor device and fabricating method thereof
Grant 10,818,716 - Jangjian , et al. October 27, 2 | 2020-10-27 |
Image Sensor Device And Fabricating Method Thereof
App 20190348458 - JANGJIAN; Shiu-Ko ; et al. | 2019-11-14 |
Image sensor device and fabricating method thereof
Grant 10,367,021 - Jangjian , et al. July 30, 2 | 2019-07-30 |
Method Of Manufacturing Semiconductor Structure
App 20190019743 - FANG; LI-YEN ; et al. | 2019-01-17 |
Semiconductor structure and manufacturing method thereof
Grant 10,074,594 - Fang , et al. September 11, 2 | 2018-09-11 |
Through via structure for step coverage improvement
Grant 9,991,204 - Fang , et al. June 5, 2 | 2018-06-05 |
Method of manufacturing semiconductor device with recess
Grant 9,859,124 - Fang , et al. January 2, 2 | 2018-01-02 |
Through Via Structure For Step Coverage Improvement
App 20170287841 - FANG; Li-Yen ; et al. | 2017-10-05 |
Through via structure for step coverage improvement
Grant 9,711,454 - Fang , et al. July 18, 2 | 2017-07-18 |
Semiconducator image sensor having color filters formed over a high-K dielectric grid
Grant 9,601,535 - Jian , et al. March 21, 2 | 2017-03-21 |
Through Via Structure For Step Coverage Improvement
App 20170062343 - FANG; Li-Yen ; et al. | 2017-03-02 |
Semiconductor Structure And Manufacturing Method Thereof
App 20160307823 - FANG; LI-YEN ; et al. | 2016-10-20 |
Method Of Manufacturing Semiconductor Device With Recess
App 20160307761 - FANG; LI-YEN ; et al. | 2016-10-20 |
Sensing product and method of making
Grant 9,419,155 - Chang , et al. August 16, 2 | 2016-08-16 |
Backside Illuminated Image Sensor And Method Of Manufacturing The Same
App 20150279880 - JANGJIAN; SHIU-KO ; et al. | 2015-10-01 |
Image Sensor Device And Fabricating Method Thereof
App 20150171125 - JANGJIAN; Shiu-Ko ; et al. | 2015-06-18 |
High-K Dielectric Grid Structure for Semiconductor Device
App 20140263956 - Jian; Shiu-Ko Jang ; et al. | 2014-09-18 |
Back side illumination (BSI) sensors, manufacturing methods thereof, and semiconductor device manufacturing methods
Grant 8,815,630 - JangJian , et al. August 26, 2 | 2014-08-26 |
Back Side Illumination (bsi) Sensors, Manufacturing Methods Thereof, And Semiconductor Device Manufacturing Methods
App 20140235008 - JangJian; Shiu-Ko ; et al. | 2014-08-21 |
Semiconductor device and method of formation
Grant 8,642,439 - Nian , et al. February 4, 2 | 2014-02-04 |
Semiconductor Device and Method of Formation
App 20130264615 - Nian; Jun-Nan ; et al. | 2013-10-10 |
Sensing Product And Method Of Making
App 20130175653 - CHANG; Shih-Chieh ; et al. | 2013-07-11 |
Semiconductor Device and Method of Formation
App 20130126950 - Nian; Jun-Nan ; et al. | 2013-05-23 |
Semiconductor device and method of formation
Grant 8,435,893 - Nian , et al. May 7, 2 | 2013-05-07 |
Oxygen plasma reduction to eliminate precursor overflow in BPTEOS film deposition
Grant 7,955,993 - Lan , et al. June 7, 2 | 2011-06-07 |
Oxygen Plasma Reduction To Eliminate Precursor Overflow In Bpteos Film Deposition
App 20100311252 - Lan; Chin Kun ; et al. | 2010-12-09 |
Semiconductor Device
App 20100230815 - Tsao; Jung-Chih ; et al. | 2010-09-16 |
Via structure and process for forming the same
Grant 7,417,321 - Tsao , et al. August 26, 2 | 2008-08-26 |
Multi-layer interconnect structure for semiconductor devices
Grant 7,368,379 - Tsao , et al. May 6, 2 | 2008-05-06 |
Metal-oxide-metal structure with improved capacitive coupling area
App 20080061343 - Lan; Chin Kun ; et al. | 2008-03-13 |
Copper plating of semiconductor devices using single intermediate low power immersion step
Grant 7,312,149 - Chen , et al. December 25, 2 | 2007-12-25 |
Test device and method for laser alignment calibration
Grant 7,304,728 - Chang , et al. December 4, 2 | 2007-12-04 |
Semiconductor Devices And Fabrication Method Thereof
App 20070252277 - Tsao; Jung-Chih ; et al. | 2007-11-01 |
Low-k dielectric layer, semiconductor device, and method for fabricating the same
App 20070205516 - Chen; Kei-Wei ; et al. | 2007-09-06 |
Via structure and process for forming the same
App 20070152342 - Tsao; Jung-Chih ; et al. | 2007-07-05 |
Semiconductor device
App 20070126120 - Tsao; Jung-Chih ; et al. | 2007-06-07 |
Plating apparatuses and processes
App 20070084730 - Chen; Kei-Wei ; et al. | 2007-04-19 |
Interconnect structure for semiconductor devices
App 20070034517 - Tsao; Jung-Chih ; et al. | 2007-02-15 |
Electropolishing method for removing particles from wafer surface
Grant 7,128,821 - Lin , et al. October 31, 2 | 2006-10-31 |
Method of forming barrier layer with reduced resistivity and improved reliability in copper damascene process
Grant 7,071,100 - Chen , et al. July 4, 2 | 2006-07-04 |
Test device and method for laser alignment calibration
App 20060055928 - Chang; Shih-Tzung ; et al. | 2006-03-16 |
Method and structure for improving adhesion between intermetal dielectric layer and cap layer
App 20050253268 - Hsu, Shao-Ta ; et al. | 2005-11-17 |
Copper plating of semiconductor devices using intermediate immersion step
App 20050250327 - Chen, Chao-Lung ; et al. | 2005-11-10 |
Novel ECP method for preventing the formation of voids and contamination in vias
App 20050236181 - Chen, Kei-Wei ; et al. | 2005-10-27 |
Method of forming barrier layer with reduced resistivity and improved reliability in copper damascene process
App 20050191855 - Chen, Kei-Wei ; et al. | 2005-09-01 |
Electropolishing method for removing particles from wafer surface
App 20050155869 - Lin, Shih-Ho ; et al. | 2005-07-21 |
Catch-pin water support for process chamber
Grant 6,863,491 - Cheng , et al. March 8, 2 | 2005-03-08 |
Method and system for slurry usage reduction in chemical mechanical polishing
Grant 6,769,959 - Chen , et al. August 3, 2 | 2004-08-03 |
Novel method to reduce stress for copper CMP
App 20040147116 - Chen, Kei-Wei ; et al. | 2004-07-29 |
Catch-pin water support for process chamber
App 20040131460 - Cheng, Hsi-Kuei ; et al. | 2004-07-08 |
Hoop support for semiconductor wafer
Grant 6,695,921 - Cheng , et al. February 24, 2 | 2004-02-24 |
Apparatus and method for removing coating layers from alignment marks
Grant 6,682,605 - Cheng , et al. January 27, 2 | 2004-01-27 |
Hoop Support For Semiconductor Wafer
App 20030230237 - Cheng, Hsi-Kuei ; et al. | 2003-12-18 |
Method for improving thickness uniformity on a semiconductor wafer during chemical mechanical polishing
Grant 6,626,741 - Wang , et al. September 30, 2 | 2003-09-30 |
Method and system for slurry usage reduction in chemical mechanical polishing
App 20030143924 - Chen, Kei-Wei ; et al. | 2003-07-31 |
Apparatus and method for removing coating layers from alignment marks
App 20030127107 - Cheng, Aaron ; et al. | 2003-07-10 |
Use of a capping layer to reduce particle evolution during sputter pre-clean procedures
Grant 6,531,382 - Cheng , et al. March 11, 2 | 2003-03-11 |
Method for improving thickness uniformity on a semiconductor wafer during chemical mechanical polishing
App 20030017784 - Wang, Ting-Chun ; et al. | 2003-01-23 |
Method for fabricating diamond conditioning disc and disc fabricated
App 20020194790 - Wang, Ting-Chun ; et al. | 2002-12-26 |
Rule to determine CMP polish time
App 20020090745 - Lin, Hway-Chi ; et al. | 2002-07-11 |
Methods to reduce metal bridges and line shorts in integrated circuits
Grant 6,372,645 - Liu , et al. April 16, 2 | 2002-04-16 |
| 