| Patent | Date |
|---|
FinFET SRAM cells with reduced fin pitch
Grant 11,437,385 - Wang , et al. September 6, 2 | 2022-09-06 |
Fin field effect transistor device structure
Grant 11,404,320 - Chang , et al. August 2, 2 | 2022-08-02 |
Transistors with varying width nanosheet
Grant 11,393,815 - Lin , et al. July 19, 2 | 2022-07-19 |
Methods and structures of novel contact feature
Grant 11,355,603 - Wu , et al. June 7, 2 | 2022-06-07 |
Interconnect Structure And Methods Thereof
App 20220130757 - CHANG; Shang-Wen ; et al. | 2022-04-28 |
Implanter calibration
Grant 11,264,204 - Lin , et al. March 1, 2 | 2022-03-01 |
Ion Implantation Method And Device
App 20220059320 - LIN; Yi-Hsiung ; et al. | 2022-02-24 |
Interconnect structure and methods thereof
Grant 11,222,842 - Chang , et al. January 11, 2 | 2022-01-11 |
Formation Method Of Semiconductor Device With Contact Structures
App 20210398852 - LIN; Yi-Hsiung ; et al. | 2021-12-23 |
Methods of Forming Contact Features in Field-Effect Transistors
App 20210358817 - Lin; Yi-Hsiung ; et al. | 2021-11-18 |
Integrated Circuit Device Including a Power Supply Line and Method of Forming the Same
App 20210343712 - Lin; Yi-Hsiung ; et al. | 2021-11-04 |
Ion implantation method
Grant 11,164,722 - Lin , et al. November 2, 2 | 2021-11-02 |
Semiconductor device with contact structures
Grant 11,127,631 - Lin , et al. September 21, 2 | 2021-09-21 |
Buried Metal Track and Methods Forming Same
App 20210242212 - Wang; Pochun ; et al. | 2021-08-05 |
Methods of forming contact features in field-effect transistors
Grant 11,081,403 - Lin , et al. August 3, 2 | 2021-08-03 |
Integrated circuit device including a power supply line and method of forming the same
Grant 11,063,041 - Lin , et al. July 13, 2 | 2021-07-13 |
Methods And Compositions For Treating Or Alleviating Bone-loss Related Disease Or Condition
App 20210162074 - Wang; Chau-Zen ; et al. | 2021-06-03 |
Capacitance reduction by metal cut design
Grant 11,004,738 - Lin , et al. May 11, 2 | 2021-05-11 |
Buried metal track and methods forming same
Grant 11,004,855 - Wang , et al. May 11, 2 | 2021-05-11 |
Methods of treating or alleviating joint diseases by administering an inhibitor of discoidin domain receptor 1 (DDR1)
Grant 10,946,021 - Wang , et al. March 16, 2 | 2021-03-16 |
Transistors With Varying Width Nanosheet
App 20210066291 - LIN; Yi-Hsiung ; et al. | 2021-03-04 |
Implanter Calibration
App 20210043422 - Lin; Yi-Hsiung ; et al. | 2021-02-11 |
Integrated circuit structure
Grant 10,879,176 - Lin , et al. December 29, 2 | 2020-12-29 |
Monolithic 3D Integration Inter-Tier Vias Insertion Scheme and Associated Layout Structure
App 20200402899 - Guo; Ta-Pen ; et al. | 2020-12-24 |
Metal Rail Conductors For Non-planar Semiconductor Devices
App 20200388706 - CHEN; Chih-Liang ; et al. | 2020-12-10 |
Integrated Circuit And Method Of Manufacturing Same
App 20200350250 - WANG; Pochun ; et al. | 2020-11-05 |
Implanter calibration
Grant 10,818,473 - Lin , et al. October 27, 2 | 2020-10-27 |
Air Cleaner
App 20200324239 - Lin; Yi-Hsiung | 2020-10-15 |
Fin Field Effect Transistor Device Structure
App 20200294860 - CHANG; Shang-Wen ; et al. | 2020-09-17 |
Metal rail conductors for non-planar semiconductor devices
Grant 10,763,365 - Chen , et al. Sep | 2020-09-01 |
Monolithic 3D integration inter-tier vias insertion scheme and associated layout structure
Grant 10,763,198 - Guo , et al. Sep | 2020-09-01 |
Integrated circuit and method of manufacturing same
Grant 10,734,321 - Wang , et al. | 2020-08-04 |
Methods of forming metal layer structures in semiconductor devices
Grant 10,727,113 - Hsiao , et al. | 2020-07-28 |
Fin field effect transistor device structure and method for forming the same
Grant 10,672,665 - Chang , et al. | 2020-06-02 |
Integrated Circuit Structure
App 20200135644 - LIN; Yi-Hsiung ; et al. | 2020-04-30 |
Integrated Circuit Device Including a Power Supply Line and Method of Forming the Same
App 20200135724 - Lin; Yi-Hsiung ; et al. | 2020-04-30 |
Methods And Structures Of Novel Contact Feature
App 20200127105 - Wu; Wei-Hao ; et al. | 2020-04-23 |
Methods of Forming Metal Layer Structures in Semiconductor Devices
App 20200111702 - Hsiao; Ethan ; et al. | 2020-04-09 |
Fin Field Effect Transistor Device Structure And Method For Forming The Same
App 20200105603 - CHANG; Shang-Wen ; et al. | 2020-04-02 |
FinFET SRAM Cells with Reduced Fin Pitch
App 20200098764 - Wang; Chih-Hao ; et al. | 2020-03-26 |
Capacitance Reduction By Metal Cut Design
App 20200098631 - Lin; Yi-Hsiung ; et al. | 2020-03-26 |
Implanter Calibration
App 20200058465 - LIN; Yi-Hsiung ; et al. | 2020-02-20 |
Ion Implantation Method
App 20200043700 - LIN; Yi-Hsiung ; et al. | 2020-02-06 |
Inhibitor And Activator Of Discoidin Domain Receptor 1 And Their Use
App 20200030332 - Wang; Chau-Zen ; et al. | 2020-01-30 |
Semiconductor Device With Contact Structures
App 20200020584 - LIN; Yi-Hsiung ; et al. | 2020-01-16 |
Methods of Forming Contact Features in Field-Effect Transistors
App 20200006160 - Lin; Yi-Hsiung ; et al. | 2020-01-02 |
Methods and structures of novel contact feature
Grant 10,522,633 - Wu , et al. Dec | 2019-12-31 |
Methods of forming metal layer structures in semiconductor devices
Grant 10,504,775 - Hsiao , et al. Dec | 2019-12-10 |
Methods of Forming Metal Layer Structures in Semiconductor Devices
App 20190371655 - Hsiao; Ethan ; et al. | 2019-12-05 |
Buried Metal Track and Methods Forming Same
App 20190341387 - Wang; Pochun ; et al. | 2019-11-07 |
Buried metal track and methods forming same
Grant 10,446,555 - Wang , et al. Oc | 2019-10-15 |
Metal Rail Conductors For Non-planar Semiconductor Devices
App 20190165177 - CHEN; Chih-Liang ; et al. | 2019-05-30 |
Monolithic 3D Integration Inter-Tier Vias Insertion Scheme and Associated Layout Structure
App 20190131230 - Guo; Ta-Pen ; et al. | 2019-05-02 |
Interconnect structure and methods thereof
Grant 10,276,491 - Chang , et al. | 2019-04-30 |
Integrated Circuit And Method Of Manufacturing Same
App 20190096811 - WANG; Pochun ; et al. | 2019-03-28 |
Buried Metal Track and Methods Forming Same
App 20190067290 - Wang; Pochun ; et al. | 2019-02-28 |
Monolithic 3D integration inter-tier vias insertion scheme and associated layout structure
Grant 10,170,404 - Guo , et al. J | 2019-01-01 |
Interconnect Structure and Methods Thereof
App 20180350738 - CHANG; Shang-Wen ; et al. | 2018-12-06 |
Vertical semiconductor device structure and method of forming
Grant 10,134,863 - Lin , et al. November 20, 2 | 2018-11-20 |
Re-grown gate structure and fabrication method thereof
Grant 10,096,597 - Huang , et al. October 9, 2 | 2018-10-09 |
Interconnect Structure And Methods Thereof
App 20180061753 - CHANG; Shang-Wen ; et al. | 2018-03-01 |
Method of forming masks
Grant 9,892,224 - Lin , et al. February 13, 2 | 2018-02-13 |
Methods and Structures of Novel Contact Feature
App 20170338319 - Wu; Wei-Hao ; et al. | 2017-11-23 |
Monolithic 3d Integration Inter-tier Vias Insertion Scheme And Associated Layout Structure
App 20170287826 - Guo; Ta-Pen ; et al. | 2017-10-05 |
Methods and structrues of novel contact feature
Grant 9,728,505 - Wu , et al. August 8, 2 | 2017-08-08 |
Monolithic 3D integration inter-tier vias insertion scheme and associated layout structure
Grant 9,691,695 - Guo , et al. June 27, 2 | 2017-06-27 |
Methods And Structrues Of Novel Contact Feature
App 20170141037 - Wu; Wei-Hao ; et al. | 2017-05-18 |
Monolithic 3d Integration Inter-tier Vias Insertion Scheme And Associated Layout Structure
App 20170062319 - Guo; Ta-Pen ; et al. | 2017-03-02 |
Method of Forming Butted Contact
App 20170053827 - Wang; Chih-Hao ; et al. | 2017-02-23 |
Method of forming butted contact
Grant 9,564,363 - Wang , et al. February 7, 2 | 2017-02-07 |
Vertical Semiconductor Device Structure and Method of Forming
App 20160365439 - Lin; Yi-Hsiung ; et al. | 2016-12-15 |
Method Of Forming Masks
App 20160283631 - LIN; Yi-Hsiung ; et al. | 2016-09-29 |
Systems and methods for intelligent dispatching for wafer processing
Grant 9,412,595 - Ho , et al. August 9, 2 | 2016-08-09 |
Systems And Methods For Intelligent Dispatching For Wafer Processing
App 20150170917 - HO; KUO-YUAN ; et al. | 2015-06-18 |
Semiconductor structure and method of manufacturing same
Grant 8,298,912 - Li , et al. October 30, 2 | 2012-10-30 |
Indoor Air Conditioner Able To Carry Out Washing And Cleaning Automatically
App 20110315345 - LIN; Yi-Hsiung | 2011-12-29 |
Semiconductor Structure And Method Of Manufacturing Same
App 20110183491 - LI; Wai-Kin ; et al. | 2011-07-28 |
Semiconductor structure and method of manufacturing same
Grant 7,960,036 - Li , et al. June 14, 2 | 2011-06-14 |
Cooler
Grant 7,815,173 - Lin October 19, 2 | 2010-10-19 |
Cooler
App 20090266517 - Lin; Yi-Hsiung | 2009-10-29 |
Cooler
App 20090188651 - LIN; Yi-Hsiung | 2009-07-30 |
Method of fabricating interconnections of microelectronic device using dual damascene process
Grant 7,553,758 - Park , et al. June 30, 2 | 2009-06-30 |
Auto-cleaning Device For An Indoor Air Conditioner
App 20090071182 - LIN; Yi-Hsiung | 2009-03-19 |
Methods of forming electrical interconnect structures using polymer residues to increase etching selectivity through dielectric layers
Grant 7,488,687 - Park , et al. February 10, 2 | 2009-02-10 |
Semiconductor Structure And Method Of Manufacturing Same
App 20090035588 - Li; Wai-Kin ; et al. | 2009-02-05 |
Two-step process for manufacturing deep trench
App 20080124935 - Chang; Hong-Long ; et al. | 2008-05-29 |
Multiple layer resist scheme implementing etch recipe particular to each layer
Grant 7,352,064 - Fuller , et al. April 1, 2 | 2008-04-01 |
Method of Fabricating Interconnections of Microelectronic Device Using Dual Damascene Process
App 20080070409 - Park; Wan-jae ; et al. | 2008-03-20 |
Methods of Forming Electrical Interconnect Structures Using Polymer Residues to Increase Etching Selectivity Through Dielectric Layers
App 20080064199 - Park; Wan Jae ; et al. | 2008-03-13 |
Method Of Formation Of A Damascene Structure
App 20080020327 - Yang; Chih-Chao ; et al. | 2008-01-24 |
Powder fuel engine
Grant 7,311,065 - Lin December 25, 2 | 2007-12-25 |
Powder Fuel Engine
App 20070266963 - Lin; Yi-Hsiung | 2007-11-22 |
Etching Method And Method Of Fabricating Opening
App 20070170147 - Lin; Yi-Hsiung ; et al. | 2007-07-26 |
Methods of forming contact structures in low-k materials using dual damascene processes
App 20070105362 - Kim; Jae Hak ; et al. | 2007-05-10 |
Automatic chargeable electromotive vehicle
App 20070052386 - Lin; Yi-Hsiung | 2007-03-08 |
Dual damascene structure and method
Grant 7,091,612 - Kumar , et al. August 15, 2 | 2006-08-15 |
Multiple Layer Resist Scheme Implementing Etch Recipe Particular to Each Layer
App 20060094230 - Fuller; Nicholas C.M. ; et al. | 2006-05-04 |
Method of patterning damascene structure in integrated circuit design
Grant 6,949,459 - Li , et al. September 27, 2 | 2005-09-27 |
In-situ liner formation during reactive ion etch
App 20050176237 - Standaert, Theodorus E. ; et al. | 2005-08-11 |
Method of patterning damascene structure in integrated circuit design
App 20050101128 - Gibb, Frederick W. III ; et al. | 2005-05-12 |
Dual damascene structure and method
App 20050077628 - Kumar, Kaushik ; et al. | 2005-04-14 |
Process for forming fusible links
Grant 6,750,129 - Yang , et al. June 15, 2 | 2004-06-15 |
Process For Forming Fusible Links
App 20040092091 - Yang, Gwo-Shii ; et al. | 2004-05-13 |
Embedded capacitor structure applied to logic integrated circuit
App 20030213990 - Tsai, Teng-Chun ; et al. | 2003-11-20 |
Method of forming embedded capacitor structure applied to logic integrated circuit
Grant 6,593,185 - Tsai , et al. July 15, 2 | 2003-07-15 |
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