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Semiconductor structure and method for forming the same
Grant 11,456,263 - Wei , et al. September 27, 2 | 2022-09-27 |
Wide Channel Semiconductor Device
App 20220293650 - WEI; Chia-Yu ; et al. | 2022-09-15 |
Upper Conductive Structure Having Multilayer Stack To Decrease Fabrication Costs And Increase Performance
App 20220246567 - Lin; Tzu-Yu ; et al. | 2022-08-04 |
Wide channel gate structure
Grant 11,380,721 - Wei , et al. July 5, 2 | 2022-07-05 |
Semiconductor Structure And Method Of Fabricating The Same
App 20220165675 - Huang; Tzu-Sung ; et al. | 2022-05-26 |
Signal Receiving Device And Bias Voltage Calibration Circuit Thereof
App 20220149825 - Lin; Yen Liang ; et al. | 2022-05-12 |
Integrated Circuit Package and Method
App 20220139839 - Yu; Chen-Hua ; et al. | 2022-05-05 |
Cmos Image Sensor Having Indented Photodiode Structure
App 20220077206 - Wei; Chia-Yu ; et al. | 2022-03-10 |
Anchor Structures And Methods For Uniform Wafer Planarization And Bonding
App 20220052100 - Wei; Chia-Yu ; et al. | 2022-02-17 |
Semiconductor structure and method of fabricating the same
Grant 11,244,906 - Huang , et al. February 8, 2 | 2022-02-08 |
Integrated circuit package and method
Grant 11,227,837 - Yu , et al. January 18, 2 | 2022-01-18 |
Single photon avalanche diode
Grant 11,189,743 - Wei , et al. November 30, 2 | 2021-11-30 |
Semiconductor Structure And Method Of Fabricating The Same
App 20210366833 - Huang; Tzu-Sung ; et al. | 2021-11-25 |
CMOS image sensor having indented photodiode structure
Grant 11,183,523 - Wei , et al. November 23, 2 | 2021-11-23 |
Anchor structures and methods for uniform wafer planarization and bonding
Grant 11,152,417 - Wei , et al. October 19, 2 | 2021-10-19 |
Semiconductor package and manufacturing method thereof
Grant 11,133,269 - Lu , et al. September 28, 2 | 2021-09-28 |
Integrated Circuit Package and Method
App 20210225723 - Huang; Tzu-Sung ; et al. | 2021-07-22 |
Semiconductor Packages And Methods Of Forming The Same
App 20210225812 - Yu; Chen-Hua ; et al. | 2021-07-22 |
Method Of Forming Image Sensor Device
App 20210202564 - WEI; Chia-Yu ; et al. | 2021-07-01 |
Integrated Circuit Package and Method
App 20210193582 - Yu; Chen-Hua ; et al. | 2021-06-24 |
Semiconductor structure
Grant 11,018,179 - Wei , et al. May 25, 2 | 2021-05-25 |
Semiconductor structure
Grant 11,004,811 - Chen , et al. May 11, 2 | 2021-05-11 |
Semiconductor Package And Manufacturing Method Thereof
App 20210118811 - Lu; Chun-Ti ; et al. | 2021-04-22 |
Scheme for connector site spacing and resulting structures
Grant 10,985,114 - Chen , et al. April 20, 2 | 2021-04-20 |
Building Footprint
App 20210103726 - Lin; Yen-Liang ; et al. | 2021-04-08 |
Semiconductor packages and methods of forming the same
Grant 10,971,477 - Yu , et al. April 6, 2 | 2021-04-06 |
Integrated circuit package and method
Grant 10,950,519 - Huang , et al. March 16, 2 | 2021-03-16 |
Image sensor device and method of forming the same
Grant 10,943,942 - Wei , et al. March 9, 2 | 2021-03-09 |
Bump Structure Having A Side Recess And Semiconductor Structure Including The Same
App 20210035938 - Chang; Chih-Horng ; et al. | 2021-02-04 |
Primitive-based 3d Building Modeling, Sensor Simulation, And Estimation
App 20210027532 - LIN; Yen-Liang ; et al. | 2021-01-28 |
Semiconductor Package and Method
App 20210005554 - Huang; Tzu-Sung ; et al. | 2021-01-07 |
Package-on-package structure
Grant 10,879,221 - Lu , et al. December 29, 2 | 2020-12-29 |
Semiconductor Structure
App 20200388584 - CHEN; VINCENT ; et al. | 2020-12-10 |
Integrated Circuit Package and Method
App 20200381325 - Huang; Tzu-Sung ; et al. | 2020-12-03 |
Package-on-package Structure
App 20200365569 - Lu; Chun-Ti ; et al. | 2020-11-19 |
Bump structure having a side recess and semiconductor structure including the same
Grant 10,833,033 - Chang , et al. November 10, 2 | 2020-11-10 |
Wireless Charging Devices Having Wireless Charging Coils and Methods of Manufacture Thereof
App 20200350782 - Yu; Chen-Hua ; et al. | 2020-11-05 |
Semiconductor Structure And Method For Forming The Same
App 20200321294 - WEI; Chia-Yu ; et al. | 2020-10-08 |
CMOS image sensor having indented photodiode structure
Grant 10,790,321 - Wei , et al. September 29, 2 | 2020-09-29 |
Semiconductor Structure
App 20200303435 - WEI; CHIA-YU ; et al. | 2020-09-24 |
Semiconductor package and method
Grant 10,784,203 - Huang , et al. Sept | 2020-09-22 |
Semiconductor structure
Grant 10,763,229 - Chen , et al. Sep | 2020-09-01 |
Wireless charging devices having wireless charging coils and methods of manufacture thereof
Grant 10,720,788 - Yu , et al. | 2020-07-21 |
Novel Single Photon Avalanche Diode
App 20200212244 - WEI; Chia-Yu ; et al. | 2020-07-02 |
Semiconductor structure and method for forming the same
Grant 10,692,826 - Wei , et al. | 2020-06-23 |
Semiconductor structure
Grant 10,686,005 - Wei , et al. | 2020-06-16 |
Wide Channel Gate Structure
App 20200185440 - WEI; Chia-Yu ; et al. | 2020-06-11 |
Single photon avalanche diode
Grant 10,629,765 - Wei , et al. | 2020-04-21 |
Semiconductor Structure
App 20200075516 - CHEN; VINCENT ; et al. | 2020-03-05 |
Cmos Image Sensor Having Indented Photodiode Structure
App 20200058689 - Wei; Chia-Yu ; et al. | 2020-02-20 |
Design Scheme for Connector Site Spacing and Resulting Structures
App 20200058601 - Chen; Yu-Feng ; et al. | 2020-02-20 |
Wide channel gate structure and method of forming
Grant 10,566,361 - Wei , et al. Feb | 2020-02-18 |
Apparatus for mixing solution
Grant 10,545,082 - Ho , et al. Ja | 2020-01-28 |
Scheme for connector site spacing and resulting structures
Grant 10,504,856 - Chen , et al. Dec | 2019-12-10 |
Visual anomaly detection system
Grant 10,475,174 - Lim , et al. Nov | 2019-11-12 |
Semiconductor structure
Grant 10,475,755 - Chen , et al. Nov | 2019-11-12 |
Bump Structure Having A Side Recess And Semiconductor Structure Including The Same
App 20190326240 - Chang; Chih-Horng ; et al. | 2019-10-24 |
Bump structure having a side recess and semiconductor structure including the same
Grant 10,388,622 - Chang , et al. A | 2019-08-20 |
Trace Design for Bump-on-Trace (BOT) Assembly
App 20190252347 - Lin; Yen-Liang ; et al. | 2019-08-15 |
Semiconductor Packages and Methods of Forming the Same
App 20190244935 - Yu; Chen-Hua ; et al. | 2019-08-08 |
Semiconductor Structure
App 20190165011 - WEI; CHIA-YU ; et al. | 2019-05-30 |
Redistribution Layer (rdl) Layouts For Integrated Circuits
App 20190164924 - Li; Cheng-Yuan ; et al. | 2019-05-30 |
Anchor Structures And Methods For Uniform Wafer Planarization And Bonding
App 20190157334 - WEI; Chia-Yu ; et al. | 2019-05-23 |
Image Sensor Device And Method Of Forming The Same
App 20190148450 - WEI; Chia-Yu ; et al. | 2019-05-16 |
Semiconductor Package and Method
App 20190148301 - Huang; Tzu-Sung ; et al. | 2019-05-16 |
Trace design for bump-on-trace (BOT) assembly
Grant 10,269,759 - Lin , et al. | 2019-04-23 |
Equipment damage prediction system using neural networks
Grant 10,268,913 - Lim , et al. | 2019-04-23 |
Semiconductor packages and methods of forming the same
Grant 10,269,773 - Yu , et al. | 2019-04-23 |
Semiconductor Device and Method for Fabricating the Same
App 20190109086 - Li; Cheng-Yuan ; et al. | 2019-04-11 |
Cmos Image Sensor Having Indented Photodiode Structure
App 20190103428 - Wei; Chia-Yu ; et al. | 2019-04-04 |
Semiconductor Packages and Methods of Forming the Same
App 20190103379 - Yu; Chen-Hua ; et al. | 2019-04-04 |
Semiconductor Structure And Method For Forming The Same
App 20190096830 - WEI; Chia-Yu ; et al. | 2019-03-28 |
Semiconductor Structure
App 20190067222 - CHEN; VINCENT ; et al. | 2019-02-28 |
Semiconductor structure
Grant 10,204,956 - Wei , et al. Feb | 2019-02-12 |
Semiconductor structure and manufacturing method thereof
Grant 10,177,189 - Wei , et al. J | 2019-01-08 |
Novel Single Photon Avalanche Diode
App 20190006548 - WEI; Chia-Yu ; et al. | 2019-01-03 |
Semiconductor device having conductive bumps of varying heights
Grant 10,163,844 - Lin , et al. Dec | 2018-12-25 |
Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices
Grant 10,153,243 - Tseng , et al. Dec | 2018-12-11 |
Method of manufacturing a semiconductor structure
Grant 10,115,685 - Chen , et al. October 30, 2 | 2018-10-30 |
Visual Anomaly Detection System
App 20180293734 - Lim; Ser Nam ; et al. | 2018-10-11 |
Semiconductor Structure
App 20180294295 - WEI; CHIA-YU ; et al. | 2018-10-11 |
Equipment Damage Prediction System
App 20180286034 - Lim; Ser Nam ; et al. | 2018-10-04 |
Method Of Manufacturing A Semiconductor Structure
App 20180226368 - CHEN; VINCENT ; et al. | 2018-08-09 |
Integrated circuit packaging substrate, semiconductor package, and manufacturing method
Grant 10,043,774 - Lin , et al. August 7, 2 | 2018-08-07 |
Wide Channel Gate Structure And Method Of Forming
App 20180166481 - WEI; Chia-Yu ; et al. | 2018-06-14 |
Analysis Apparatus
App 20180128726 - Lin; Yen-Liang ; et al. | 2018-05-10 |
Semiconductor structure and manufacturing method thereof
Grant 9,953,936 - Chen , et al. April 24, 2 | 2018-04-24 |
Conductive contacts having varying widths and method of manufacturing same
Grant 9,953,939 - Lin , et al. April 24, 2 | 2018-04-24 |
Semiconductor structure and manufacturing method of the same
Grant 9,935,073 - Lin , et al. April 3, 2 | 2018-04-03 |
Bump-on-trace interconnection structure for flip-chip packages
Grant 9,917,035 - Tseng , et al. March 13, 2 | 2018-03-13 |
Bump Structure Having A Side Recess And Semiconductor Structure Including The Same
App 20180053741 - Chang; Chih-Horng ; et al. | 2018-02-22 |
Semiconductor device with reduced leakage current and fabricating method thereof
Grant 9,893,107 - Wei , et al. February 13, 2 | 2018-02-13 |
Bump structure having a side recess and semiconductor structure including the same
Grant 9,824,992 - Chang , et al. November 21, 2 | 2017-11-21 |
Semiconductor Structure And Manufacturing Method Thereof
App 20170309659 - WEI; CHIA-YU ; et al. | 2017-10-26 |
Semiconductor Device Having Conductive Bumps Of Varying Heights
App 20170263583 - LIN; YEN-LIANG ; et al. | 2017-09-14 |
Semiconductor structure and manufacturing method thereof
Grant 9,748,301 - Wei , et al. August 29, 2 | 2017-08-29 |
Semiconductor Devices, Methods of Manufacture Thereof, and Packaged Semiconductor Devices
App 20170229421 - Tseng; Yu-Jen ; et al. | 2017-08-10 |
Semiconductor Structure And Manufacturing Method Of The Same
App 20170213804 - LIN; YEN-LIANG ; et al. | 2017-07-27 |
Trace Design for Bump-on-Trace (BOT) Assembly
App 20170186723 - Lin; Yen-Liang ; et al. | 2017-06-29 |
Semiconductor device having conductive bumps of varying heights
Grant 9,679,862 - Lin , et al. June 13, 2 | 2017-06-13 |
Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices
Grant 9,646,923 - Tseng , et al. May 9, 2 | 2017-05-09 |
Semiconductor Structure And Manufacturing Method Thereof
App 20170126047 - CHEN; VINCENT ; et al. | 2017-05-04 |
Semiconductor structure and manufacturing method of the same
Grant 9,633,965 - Lin , et al. April 25, 2 | 2017-04-25 |
System and method for monitoring particles in solution
Grant 9,625,365 - Ho , et al. April 18, 2 | 2017-04-18 |
Wireless Charging Devices, Methods of Manufacture Thereof, and Charging Methods
App 20170104356 - Yu; Chen-Hua ; et al. | 2017-04-13 |
Semiconductor Device With Reduced Leakage Current And Fabricating Method Thereof
App 20170084657 - WEI; Chia-Yu ; et al. | 2017-03-23 |
Apparatus And Method For Mixing Solution
App 20170065941 - Ho; Hsin-Chia ; et al. | 2017-03-09 |
Conductive Contacts Having Varying Widths And Method Of Manufacturing Same
App 20170069587 - Lin; Yen-Liang ; et al. | 2017-03-09 |
Bump Structure Having A Side Recess And Semiconductor Structure Including The Same
App 20170062371 - Chang; Chih-Horng ; et al. | 2017-03-02 |
Methods and apparatus for bump-on-trace chip packaging
Grant 9,583,367 - Huang , et al. February 28, 2 | 2017-02-28 |
Design Scheme for Connector Site Spacing and Resulting Structures
App 20170047298 - Chen; Yu-Feng ; et al. | 2017-02-16 |
Semiconductor device, integrated circuit structure using the same, and manufacturing method thereof
Grant 9,559,069 - Chen , et al. January 31, 2 | 2017-01-31 |
Method of forming bump structure having a side recess and semiconductor structure including the same
Grant 9,520,379 - Chang , et al. December 13, 2 | 2016-12-13 |
Conductive contacts having varying widths and method of manufacturing same
Grant 9,508,668 - Lin , et al. November 29, 2 | 2016-11-29 |
Scheme for connector site spacing and resulting structures
Grant 9,484,317 - Chen , et al. November 1, 2 | 2016-11-01 |
Integrated Circuit Packaging Substrate, Semiconductor Package, And Manufacturing Method
App 20160240502 - LIN; Yu-Wei ; et al. | 2016-08-18 |
Semiconductor Device, Integrated Circuit Structure Using The Same, And Manufacturing Method Thereof
App 20160225729 - CHEN; Yu-Feng ; et al. | 2016-08-04 |
Image Sensor Device With White Pixel Improvement
App 20160211293 - WEI; Chia-Yu ; et al. | 2016-07-21 |
Semiconductor Structure And Manufacturing Method Thereof
App 20160204146 - WEI; CHIA-YU ; et al. | 2016-07-14 |
Image sensor device with white pixel improvement
Grant 9,379,151 - Wei , et al. June 28, 2 | 2016-06-28 |
Bump Structure Having A Side Recess And Semiconductor Structure Including The Same
App 20160181223 - Chang; Chih-Horng ; et al. | 2016-06-23 |
Semiconductor Device And Method Of Manufacturing The Same
App 20160155715 - LIN; YEN-LIANG ; et al. | 2016-06-02 |
Bump structure having a side recess and semiconductor structure including the same
Grant 9,318,458 - Chang , et al. April 19, 2 | 2016-04-19 |
Design Scheme for Connector Site Spacing and Resulting Structures
App 20160071812 - Chen; Yu-Feng ; et al. | 2016-03-10 |
Semiconductor Structure And Manufacturing Method Of The Same
App 20160043051 - LIN; Yen-Liang ; et al. | 2016-02-11 |
Methods and Apparatus for bump-on-trace Chip Packaging
App 20160035591 - Huang; Chang-Chia ; et al. | 2016-02-04 |
Integrated inductor
Grant 9,219,106 - Lin , et al. December 22, 2 | 2015-12-22 |
Apparatus And Method For Mixing Solution And System And Method For Monitoring Particles In Solution
App 20150330886 - Ho; Hsin-Chia ; et al. | 2015-11-19 |
Scheme for connector site spacing and resulting structures
Grant 9,190,348 - Chen , et al. November 17, 2 | 2015-11-17 |
Conductive Contacts Having Varying Widths And Method Of Manufacturing Same
App 20150325542 - Lin; Yen-Liang ; et al. | 2015-11-12 |
Bump Structure Having A Side Recess And Semiconductor Structure Including The Same
App 20150318253 - CHANG; Chih-Horng ; et al. | 2015-11-05 |
Methods and apparatus for bump-on-trace chip packaging
Grant 9,165,796 - Lin , et al. October 20, 2 | 2015-10-20 |
Bump structure having a single side recess
Grant 9,105,533 - Chang , et al. August 11, 2 | 2015-08-11 |
Conductive contacts having varying widths and method of manufacturing same
Grant 9,105,530 - Lin , et al. August 11, 2 | 2015-08-11 |
Trace Design for Bump-on-Trace (BOT) Assembly
App 20150187719 - Lin; Yen-Liang ; et al. | 2015-07-02 |
Bump Structure Having A Single Side Recess
App 20150084186 - CHANG; Chih-Horng ; et al. | 2015-03-26 |
Structure and method for bump to landing trace ratio
Grant 8,981,576 - Yu , et al. March 17, 2 | 2015-03-17 |
Elongated bumps in integrated circuit devices
Grant 8,922,006 - Lin , et al. December 30, 2 | 2014-12-30 |
Elongated bumps in integrated circuit devices
Grant 08922006 - | 2014-12-30 |
Methods and Apparatus for bump-on-trace Chip Packaging
App 20140346673 - Lin; Yen-Liang ; et al. | 2014-11-27 |
Bump structures
Grant 8,853,853 - Chang , et al. October 7, 2 | 2014-10-07 |
Design Scheme for Connector Site Spacing and Resulting Structures
App 20140291838 - Chen; Yu-Feng ; et al. | 2014-10-02 |
Semiconductor Devices, Methods of Manufacture Thereof, and Packaged Semiconductor Devices
App 20140167253 - Tseng; Yu-Jen ; et al. | 2014-06-19 |
Structure and Method for Bump to Landing Trace Ratio
App 20140131865 - Yu; Chen-Hua ; et al. | 2014-05-15 |
Bump-on-trace Interconnection Structure For Flip-chip Packages
App 20140110847 - TSENG; Yu-Jen ; et al. | 2014-04-24 |
Metal Bump and Method of Manufacturing Same
App 20140077365 - Lin; Yen-Liang ; et al. | 2014-03-20 |
Structure and method for bump to landing trace ratio
Grant 8,643,196 - Yu , et al. February 4, 2 | 2014-02-04 |
Methods and Apparatus for bump-on-trace Chip Packaging
App 20130277828 - Huang; Chang-Chia ; et al. | 2013-10-24 |
Elongated Bumps in Integrated Circuit Devices
App 20130256874 - Lin; Yen-Liang ; et al. | 2013-10-03 |
Integrated Inductor
App 20130032923 - Lin; Yen-Liang ; et al. | 2013-02-07 |
Bump Structures
App 20130026619 - CHANG; Chih-Horng ; et al. | 2013-01-31 |
Structure And Method For Bump To Landing Trace Ratio
App 20130026614 - Yu; Chen-Hua ; et al. | 2013-01-31 |
Architecture for Supporting Modulized Full Operation Junction Ultra High Voltage (UHV) Light Emitting Diode (LED) Device
App 20120306390 - Li; Chang-Je ; et al. | 2012-12-06 |
Replaceable Hollow Fiber Membrane Filter Device
App 20110036764 - LIN; Yen-Liang | 2011-02-17 |
System and method for converting digital image signals
App 20090109332 - Lin; Yen-Liang | 2009-04-30 |
Wireless LAN medium access controller supporting mode change and mode change method therreof
App 20080253344 - Lin; Yen-Liang ; et al. | 2008-10-16 |
Wireless LAN medium access controller supporting mode change and mode change method thereof
App 20060088016 - Lin; Yen-Liang ; et al. | 2006-04-27 |
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