Lin; Pu-Ju

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lin; Pu-Ju.The latest application filed is for "wiring board with embedded interposer substrate and method of fabricating the same".

Company Profile

15.13.27

Lin; Pu-Ju - Hsinchu City TW
Lin; Pu-Ju - Hsinchu TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Wiring Board With Embedded Interposer Substrate And Method Of Fabricating The Same App 20220285255 - Peng; Yan-Jia ; et al.	2022-09-08
Light Emitting Diode Package Structure And Manufacturing Method Thereof And Manufacturing Method Of Display Device App 20220271208 - Li; Jeng-Ting ; et al.	2022-08-25
Electronic device bonding structure and fabrication method thereof Grant 11,424,216 - Hsu , et al. August 23, 2	2022-08-23
Circuit Board Structure And Manufacturing Method Thereof App 20220256717 - Lau; John Hon-Shing ; et al.	2022-08-11
Package structure and manufacturing method thereof Grant 11,410,933 - Lau , et al. August 9, 2	2022-08-09
Chip package structure Grant 11,410,971 - Tseng , et al. August 9, 2	2022-08-09
Package structure with structure reinforcing element and manufacturing method thereof Grant 11,410,940 - Lin , et al. August 9, 2	2022-08-09
Package Structure And Manufacturing Method Thereof App 20220246810 - Tseng; Tzyy-Jang ; et al.	2022-08-04
Chip Packaging Structure And Manufacturing Method Thereof App 20220208630 - Yang; Kai-Ming ; et al.	2022-06-30
Chip Package Structure And Manufacturing Method Thereof App 20220208631 - Lin; Pu-Ju ; et al.	2022-06-30
Mask structure and manufacturing method thereof Grant 11,366,381 - Lin , et al. June 21, 2	2022-06-21
Chip package structure and manufacturing method thereof Grant 11,362,057 - Lin , et al. June 14, 2	2022-06-14
Vapor Chamber Device And Manufacturing Method Thereof App 20220146207 - LIN; Pu-Ju ; et al.	2022-05-12
Circuit Substrate Structure And Manufacturing Method Thereof App 20220130781 - Tseng; Tzyy-Jang ; et al.	2022-04-28
Package Structure And Manufacturing Method Thereof App 20220108953 - Lau; John Hon-Shing ; et al.	2022-04-07
Circuit Board Structure And Manufacturing Method Thereof App 20220069489 - Lau; John Hon-Shing ; et al.	2022-03-03
Circuit Board Structure And Manufacturing Method Thereof App 20220071010 - TSENG; Tzyy-Jang ; et al.	2022-03-03
Chip Package And Method Of Manufacturing The Same App 20220068742 - WU; Cheng-Hui ; et al.	2022-03-03
Electronic Device Bonding Structure And Fabrication Method Thereof App 20220068872 - Hsu; Chia-Fu ; et al.	2022-03-03
Chip Package Structure App 20220059498 - Tseng; Tzyy-Jang ; et al.	2022-02-24
Wiring board and manufacturing method thereof Grant 11,166,387 - Yang , et al. November 2, 2	2021-11-02
Chip Package Structure And Manufacturing Method Thereof App 20210296291 - Lin; Pu-Ju ; et al.	2021-09-23
Wiring Board And Manufacturing Method Thereof App 20210282275 - Yang; Kai-Ming ; et al.	2021-09-09
Vapor Chamber Structure And Manufacturing Method Thereof App 20210251107 - Tain; Ra-Min ; et al.	2021-08-12
Vapor Chamber Structure And Manufacturing Method Thereof App 20210247147 - Tain; Ra-Min ; et al.	2021-08-12
Package Structure With Structure Reinforcing Element And Manufacturing Method Thereof App 20210159191 - LIN; Pu-Ju ; et al.	2021-05-27
Manufacturing Method Of Carrier Structure App 20210136931 - Tseng; Tzyy-Jang ; et al.	2021-05-06
Chip Package Structure And Manufacturing Method Thereof App 20210118839 - Lin; Pu-Ju ; et al.	2021-04-22
Package structure with structure reinforcing element and manufacturing method thereof Grant 10,957,658 - Lin , et al. March 23, 2	2021-03-23
Package structure and method of manufacturing the same Grant 10,950,535 - Wang , et al. March 16, 2	2021-03-16
Carrier structure and manufacturing method thereof Grant 10,925,172 - Tseng , et al. February 16, 2	2021-02-16
Package Structure With Structure Reinforcing Element And Manufacturing Method Thereof App 20200266155 - LIN; Pu-Ju ; et al.	2020-08-20
Package structure with structure reinforcing element and manufacturing method thereof Grant 10,685,922 - Lin , et al.	2020-06-16
Package Structure And Method Of Manufacturing The Same App 20200176369 - WANG; Chun-Min ; et al.	2020-06-04
Stacked structure and method for manufacturing the same Grant 10,588,214 - Tseng , et al.	2020-03-10
Stacked Structure And Method For Manufacturing The Same App 20190373713 - TSENG; Tzyy-Jang ; et al.	2019-12-05
Mask Structure And Manufacturing Method Thereof App 20190250502 - Lin; Pu-Ju ; et al.	2019-08-15
Manufacturing method of circuit substrate and mask structure and manufacturing method thereof Grant 10,324,370 - Lin , et al.	2019-06-18
Package Structure And Manufacturing Method Thereof App 20190139907 - LIN; Pu-Ju ; et al.	2019-05-09
Manufacturing Method Of Circuit Substrate And Mask Structure And Manufacturing Method Thereof App 20180070452 - Lin; Pu-Ju ; et al.	2018-03-08

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