Lin; Po-Chun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lin; Po-Chun.The latest application filed is for "circuit substrate, package structure and method of manufacturing the same".

Company Profile

21.62.76

Lin; Po-Chun - Hsinchu TW
Lin; Po-Chun - Taipei TW
Lin; Po-Chun - Changhua TW
Lin; Po-Chun - Hsinchu City TW
Lin; Po-Chun - Changhua County TW
LIN; Po-Chun - Changhua City TW
Lin; Po-Chun - Taichung TW
Lin; Po-Chun - Taichung City TW
LIN; Po-Chun - Taipei City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Circuit Substrate, Package Structure And Method Of Manufacturing The Same App 20220310499 - Chen; Shih-Wei ; et al.	2022-09-29
Semiconductor Package And Forming Method Thereof App 20220285566 - Tai; Chih-Hsuan ; et al.	2022-09-08
Semiconductor package and forming method thereof Grant 11,374,136 - Tai , et al. June 28, 2	2022-06-28
Chatbot orchestration Grant 11,159,457 - Liang , et al. October 26, 2	2021-10-26
Interruption point determination Grant 11,151,597 - Cheng , et al. October 19, 2	2021-10-19
Package Structure And Method Of Forming The Same App 20210280511 - Tai; Chih-Hsuan ; et al.	2021-09-09
Chatbot Orchestration App 20210144107 - Liang; Lin Chung ; et al.	2021-05-13
Package structure and method of forming the same Grant 11,004,786 - Tai , et al. May 11, 2	2021-05-11
Semiconductor Package And Forming Method Thereof App 20210098636 - Tai; Chih-Hsuan ; et al.	2021-04-01
Semiconductor apparatus and method for preparing the same Grant 10,923,455 - Lin , et al. February 16, 2	2021-02-16
Method for preparing a semiconductor apparatus Grant 10,825,794 - Lin , et al. November 3, 2	2020-11-03
Sensing module and image capturing apparatus Grant 10,811,545 - Wang , et al. October 20, 2	2020-10-20
Package Structure And Method Of Forming The Same App 20200294912 - Tai; Chih-Hsuan ; et al.	2020-09-17
Sensing Module And Image Capturing Apparatus App 20200266227 - Wang; Chiung-Han ; et al.	2020-08-20
Interruption Point Determination App 20200143412 - Cheng; Jen Ping ; et al.	2020-05-07
Semiconductor method for forming semiconductor structure having bump on tilting upper corner surface Grant 10,607,858 - Lin , et al.	2020-03-31
Method for manufacturing package structure having elastic bump Grant 10,580,665 - Lin	2020-03-03
Semiconductor structure Grant 10,566,294 - Lin , et al. Feb	2020-02-18
Interruption point determination Grant 10,552,862 - Cheng , et al. Fe	2020-02-04
Method for preparing a semiconductor package Grant 10,535,621 - Lin Ja	2020-01-14
Combing bump structure and manufacturing method thereof Grant 10,446,514 - Lin , et al. Oc	2019-10-15
Semiconductor chip and multi-chip package using thereof and method for manufacturing the same Grant 10,438,887 - Lin O	2019-10-08
Method for manufacturing a semiconductor structure Grant 10,431,559 - Lin O	2019-10-01
Stacked semiconductor structure Grant 10,373,932 - Lin , et al.	2019-08-06
Stacked package structure and manufacturing method thereof Grant 10,361,171 - Lin	2019-07-23
Semiconductor structure having bump on tilting upper corner surface Grant 10,290,512 - Lin , et al.	2019-05-14
Semiconductor Structure App 20190122996 - LIN; Po-Chun ; et al.	2019-04-25
Interruption Point Determination App 20190108550 - CHENG; JACQUELINE ; et al.	2019-04-11
Semiconductor Apparatus And Method For Preparing The Same App 20190109113 - LIN; Po-Chun ; et al.	2019-04-11
Package structure and manufacturing method thereof Grant 10,256,179 - Lin	2019-04-09
Method For Preparing A Semiconductor Structure App 20190096837 - LIN; Po Chun	2019-03-28
Package Structure And Manufacturing Method Thereof App 20190096797 - LIN; Po-Chun	2019-03-28
Stacked Package Structure And Manufacturing Method Thereof App 20190096850 - LIN; Po-Chun	2019-03-28
Method For Preparing A Semiconductor Package App 20190081018 - LIN; Po-Chun	2019-03-14
Semiconductor chip and multi-chip package using thereof Grant 10,229,877 - Lin	2019-03-12
Semiconductor Method For Forming Semiconductor Structure Having Bump On Tilting Upper Corner Surface App 20190074197 - LIN; Po-Chun ; et al.	2019-03-07
Semiconductor package and method for preparing the same Grant 10,192,841 - Lin Ja	2019-01-29
Method for preparing a semiconductor apparatus Grant 10,192,853 - Lin , et al. Ja	2019-01-29
Semiconductor structure and a manufacturing method thereof Grant 10,170,339 - Lin J	2019-01-01
Semiconductor structure Grant 10,170,340 - Lin J	2019-01-01
Semiconductor structure Grant 10,170,432 - Lin , et al. J	2019-01-01
Method For Preparing A Semiconductor Apparatus App 20180374818 - LIN; PO-CHUN ; et al.	2018-12-27
Method for manufacturing a semiconductor structure Grant 10,141,275 - Lin Nov	2018-11-27
Semiconductor Structure Having Bump On Tilting Upper Corner Surface App 20180337116 - LIN; Po-Chun ; et al.	2018-11-22
Combing Bump Structure And Manufacturing Method Thereof App 20180337154 - LIN; Po-Chun ; et al.	2018-11-22
Package Structure Having Bump With Protective Anti-oxidation Coating App 20180315725 - LIN; Po-Chun ; et al.	2018-11-01
Stacked Semiconductor Structure App 20180308823 - LIN; Po-Chun ; et al.	2018-10-25
Semiconductor Structure App 20180308803 - LIN; Po-Chun ; et al.	2018-10-25
Semiconductor structure and manufacturing method thereof Grant 10,103,114 - Lin October 16, 2	2018-10-16
Electronic structure Grant 10,076,034 - Lin September 11, 2	2018-09-11
Combing bump structure and manufacturing method thereof Grant 10,068,865 - Lin , et al. September 4, 2	2018-09-04
Semiconductor package and method for forming the same Grant 10,068,822 - Lin September 4, 2	2018-09-04
Method For Manufacturing Three Dimensional Integrated Circuit Package App 20180247919 - LIN; Po-Chun	2018-08-30
Semiconductor Structure And Manufacturing Method Thereof App 20180233484 - LIN; PO-CHUN ; et al.	2018-08-16
Semiconductor Apparatus And Method For Preparing The Same App 20180233479 - LIN; PO-CHUN ; et al.	2018-08-16
Semiconductor Structure And Manufacturing Method Thereof App 20180233485 - LIN; Po-Chun ; et al.	2018-08-16
Die Device, Semiconductor Device And Method For Making The Same App 20180233486 - LIN; PO-CHUN ; et al.	2018-08-16
Semiconductor Apparatus And Method For Preparing The Same App 20180233480 - LIN; PO-CHUN ; et al.	2018-08-16
Die device, semiconductor device and method for making the same Grant 10,050,021 - Lin , et al. August 14, 2	2018-08-14
Method For Preparing A Semiconductor Apparatus App 20180226380 - LIN; PO-CHUN ; et al.	2018-08-09
Package Structure And Manufacturing Method Thereof App 20180226372 - LIN; Po-Chun	2018-08-09
Package Structure And Manufacturing Method Thereof App 20180226332 - LIN; Po-Chun	2018-08-09
Method for forming semiconductor package Grant 10,037,937 - Lin July 31, 2	2018-07-31
Method For Preparing A Semiconductor Package App 20180204814 - LIN; PO-CHUN ; et al.	2018-07-19
Semiconductor Package And Method For Preparing The Same App 20180190607 - LIN; PO-CHUN	2018-07-05
Three Dimensional Integrated Circuit Package And Method For Manufacturing Thereof App 20180175004 - LIN; Po-Chun	2018-06-21
Semiconductor Stacking Structure And Method For Manufacturing Thereof App 20180166362 - LIN; Po-Chun	2018-06-14
Semiconductor Package App 20180166419 - LIN; PO-CHUN	2018-06-14
Semiconductor Structure And A Manufacturing Method Thereof App 20180166426 - LIN; PO CHUN	2018-06-14
Method For Preparing A Wafer Level Chip-on-chip Semiconductor Structure App 20180166418 - LIN; PO-CHUN	2018-06-14
Wafer Level Chip-on-chip Semiconductor Structure App 20180166417 - LIN; PO-CHUN	2018-06-14
Semiconductor structure with through substrate via and manufacturing method thereof Grant 9,991,215 - Lin June 5, 2	2018-06-05
Semiconductor package and manufacturing method thereof Grant 9,984,995 - Lin May 29, 2	2018-05-29
Semiconductor structure and manufacturing method thereof Grant 9,984,987 - Lin May 29, 2	2018-05-29
Stacked Package Structure And Manufacturing Method Thereof App 20180145049 - LIN; Po-Chun	2018-05-24
Semiconductor Package And Manufacturing Method Thereof App 20180138145 - LIN; Po-Chun	2018-05-17
Semiconductor Structure And Manufacturing Method Thereof App 20180138139 - LIN; PO CHUN	2018-05-17
Method For Forming Semiconductor Package App 20180130730 - LIN; Po-Chun	2018-05-10
Semiconductor apparatus and method for preparing the same Grant 9,966,363 - Lin , et al. May 8, 2	2018-05-08
Semiconductor Structure App 20180122653 - LIN; Po Chun	2018-05-03
Semiconductor structure and method for forming the same Grant 9,960,146 - Lin May 1, 2	2018-05-01
Electronic Structure App 20180116053 - LIN; Po-Chun	2018-04-26
Semiconductor Chip And Multi-chip Package Using Thereof And Method For Manufacturing The Same App 20180114753 - LIN; PO CHUN	2018-04-26
Method For Manufacturing A Semiconductor Structure App 20180114763 - LIN; PO CHUN	2018-04-26
Optical Package Structure App 20180114870 - LIN; Po-Chun	2018-04-26
Method For Manufacturing A Semiconductor Structure App 20180114764 - LIN; PO CHUN	2018-04-26
Semiconductor Structure And A Manufacturing Method Thereof App 20180114705 - LIN; Po Chun	2018-04-26
Semiconductor Package And Manufacturing Method Thereof App 20180096974 - LIN; Po-Chun	2018-04-05
Semiconductor Package And Method For Forming The Same App 20180096907 - LIN; Po-Chun	2018-04-05
Semiconductor package with lateral bump structure Grant 9,935,071 - Lin , et al. April 3, 2	2018-04-03
Semiconductor Structure And Manufacturing Method Thereof App 20180082963 - LIN; PO CHUN	2018-03-22
Semiconductor Structure And Manufacturing Method Thereof App 20180082967 - LIN; PO CHUN	2018-03-22
Semiconductor Package And Method For Fabricating The Same App 20180082934 - LIN; Po-Chun	2018-03-22
Semiconductor package and method for fabricating the same Grant 9,922,920 - Lin March 20, 2	2018-03-20
Semiconductor apparatus and method for preparing the same Grant 9,905,549 - Lin , et al. February 27, 2	2018-02-27
Carbon fiber washer Grant 9,897,133 - Cheng , et al. February 20, 2	2018-02-20
Multi-chip semiconductor package, vertically-stacked devices and manufacturing thereof Grant 9,893,037 - Lin , et al. February 13, 2	2018-02-13
Stacked package structure and manufacturing method thereof Grant 9,893,035 - Lin February 13, 2	2018-02-13
Semiconductor device and method for manufacturing the same Grant 9,892,985 - Lin February 13, 2	2018-02-13
Semiconductor Structure And Manufacturing Method Thereof App 20180040575 - LIN; PO CHUN	2018-02-08
Conductive connection structure having stress buffer layer Grant 9,881,867 - Lin January 30, 2	2018-01-30
Semiconductor Device And Method For Manufacturing The Same App 20180019174 - LIN; PO CHUN	2018-01-18
Chip And Method Of Manufacturing Chips App 20180015569 - LIN; Po-Chun	2018-01-18
Semiconductor Chip And Multi-chip Package Using Thereof App 20170373003 - LIN; PO CHUN	2017-12-28
Chip package having tilted through silicon via Grant 9,831,155 - Lin November 28, 2	2017-11-28
Chip package and a manufacturing method thereof Grant 9,812,414 - Lin November 7, 2	2017-11-07
Wire bonding method and wire bonding structure Grant 9,799,624 - Lin October 24, 2	2017-10-24
Carbon Fiber Washer App 20170298980 - Cheng; Yi-Ching ; et al.	2017-10-19
Semiconductor Device And Method For Forming The Same App 20170294380 - LIN; Po-Chun	2017-10-12
Semiconductor device and method for forming the same Grant 9,786,593 - Lin October 10, 2	2017-10-10
Chip Package Having Tilted Through Silicon Via App 20170263536 - LIN; PO CHUN	2017-09-14
Interposer, semiconductor package with the same and method for preparing a semiconductor package with the same Grant 9,761,535 - Lin September 12, 2	2017-09-12
Semiconductor structure Grant 9,711,442 - Lin July 18, 2	2017-07-18
Semiconductor structure and manufacturing method thereof Grant 9,704,818 - Lin July 11, 2	2017-07-11
Optical waveguide having several dielectric layers and at least one metal cladding layer Grant 9,664,852 - Lin May 30, 2	2017-05-30
Method of manufacturing through silicon via stacked structure Grant 9,536,785 - Lin January 3, 2	2017-01-03
Wire bonding method Grant 9,508,673 - Lin November 29, 2	2016-11-29
Wire Bonding Method App 20160247777 - Lin; Po-Chun	2016-08-25
Wire bonding method and chip structure Grant 9,362,254 - Lin June 7, 2	2016-06-07
Chip package and method for forming the same Grant 9,305,902 - Lin April 5, 2	2016-04-05
Method Of Manufacturing Through Silicon Via Stacked Structure App 20160093532 - Lin; Po-Chun	2016-03-31
Chip Package And Method For Forming The Same App 20160093593 - LIN; PO CHUN	2016-03-31
Through silicon via stacked structure and a method of manufacturing the same Grant 9,281,242 - Lin March 8, 2	2016-03-08
Chip package Grant 9,252,105 - Lin February 2, 2	2016-02-02
Chip package and method for forming the same Grant 9,240,381 - Lin January 19, 2	2016-01-19
Mobile Device, Service Device, And Methods Thereof App 20150304794 - LUO; Dan ; et al.	2015-10-22
Integrated circuit device Grant 9,147,642 - Lin September 29, 2	2015-09-29
Chip Package App 20150200163 - LIN; PO CHUN	2015-07-16
Integrated Circuit Device App 20150115462 - LIN; Po-Chun	2015-04-30
Chip Package And Method For Forming The Same App 20150084205 - LIN; PO CHUN	2015-03-26
Package Substrate And Chip Package Using The Same App 20150041182 - Lin; Po-Chun ; et al.	2015-02-12
Through Silicon Via Stacked Structure And A Method Of Manufacturing The Same App 20140117556 - Lin; Po-Chun	2014-05-01
Package Substrate And Chip Package Using The Same App 20140118978 - Lin; Po-Chun ; et al.	2014-05-01
Semiconductor Package Structure App 20130341807 - Lin; Po-Chun	2013-12-26