Lin; Chun-Ying

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lin; Chun-Ying.The latest application filed is for "package structure and method of fabricating the same".

Company Profile

3.22.40

Lin; Chun-Ying - Yunlin County TW
Lin; Chun-Ying - Taichung TW
LIN; Chun-Ying - Taichung City TW
Lin; Chun Ying - Tainan County TW
Lin; Chun-Ying - Tuku Township TW
LIN; CHUN-YING - TAIPEI CITY TW
Lin; Chun-Ying - Tainan TW
Lin; Chun-Ying - Taipei County TW
Lin; Chun-Ying - Taipei TW
Lin; Chun-Ying - Kaohsiung City TW
Lin; Chun-Ying - Jhunan Township TW
Lin; Chun-Ying - Changhua TW
Lin, Chun-Ying - Tai-Chung Hsien TW
Lin; Chun-Ying - Tatu County Tai-Chung Hsien TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Package structure having a plurality of conductive balls with narrow width for ball waist Grant 10,535,593 - Chang , et al. Ja	2020-01-14
Package Structure And Method Of Fabricating The Same App 20190252304 - Chang; Pi-Lan ; et al.	2019-08-15
Package structure having a plurality of conductive balls having narrow width for the ball waist Grant 10,276,481 - Chang , et al.	2019-04-30
Package Structure And Method Of Fabricating The Same App 20180374785 - Chang; Pi-Lan ; et al.	2018-12-27
Range hood with an easily assembled and disassembled lamp Grant 9,328,930 - Lin May 3, 2	2016-05-03
Range Hood With An Easily Assembled And Disassembled Lamp App 20150184869 - LIN; Chun-Ying	2015-07-02
Leadframe for leadless package, structure and manufacturing method using the same Grant 8,106,494 - Lin , et al. January 31, 2	2012-01-31
Leadframe for leadless package, structure and manufacturing method using the same Grant 8,105,876 - Lin , et al. January 31, 2	2012-01-31
Methods of dicing a semiconductor structure Grant 8,048,778 - Ku , et al. November 1, 2	2011-11-01
Leadframe For Leadless Package, Structure And Manufacturing Method Using The Same App 20110136299 - Lin; Chun Ying ; et al.	2011-06-09
Leadframe For Leadless Package, Structure And Manufacturing Method Using The Same App 20110133322 - Lin; Chun Ying ; et al.	2011-06-09
Composition And Method Of Adipose Cell Differentiation Inhibition App 20110124742 - LEE; MENG-HWAN ; et al.	2011-05-26
Chip package Grant 7,932,531 - Lin , et al. April 26, 2	2011-04-26
Leadframe for leadless package, structure and manufacturing method using the same Grant 7,902,649 - Lin , et al. March 8, 2	2011-03-08
Manufacturing process for a chip package structure Grant 7,851,262 - Shen , et al. December 14, 2	2010-12-14
Quad flat non-leaded chip package Grant 7,851,896 - Shen , et al. December 14, 2	2010-12-14
Manufacturing process for a chip package structure Grant 7,851,270 - Shen , et al. December 14, 2	2010-12-14
Method of fabricating quad flat non-leaded package Grant 7,842,550 - Lin , et al. November 30, 2	2010-11-30
Manufacturing process for a quad flat non-leaded chip package structure Grant 7,803,667 - Shen , et al. September 28, 2	2010-09-28
Manufacturing process for a Quad Flat Non-leaded chip package structure Grant 7,803,666 - Shen , et al. September 28, 2	2010-09-28
Manufacturing process for a quad flat non-leaded chip package structure Grant 7,795,079 - Shen , et al. September 14, 2	2010-09-14
Manufacturing process for a chip package structure Grant 7,790,514 - Shen , et al. September 7, 2	2010-09-07
Chip-Stacked Package Structure App 20100155929 - Lin; Chun-Ying ; et al.	2010-06-24
Method Of Fabricating Quad Flat Non-leaded Package App 20100120201 - Lin; Chun-Ying ; et al.	2010-05-13
Chip-stacked package structure Grant 7,696,629 - Lin , et al. April 13, 2	2010-04-13
Composition And Method Of Adipose Cell Differentiation Inhibition App 20100041768 - LEE; MENG-HWAN ; et al.	2010-02-18
Manufacturing method of chip package Grant 7,642,137 - Lin , et al. January 5, 2	2010-01-05
Chip Package App 20090321918 - Lin; Chun-Ying ; et al.	2009-12-31
Flip Chip Quad Flat Non-leaded Package Structure And Manufacturing Method Thereof And Chip Package Structure App 20090189296 - Wu; Cheng-Ting ; et al.	2009-07-30
Leadframe For Leadless Package App 20090127684 - KUO; HENG CHANG ; et al.	2009-05-21
Leadframe For Leadless Package App 20090108424 - KUO; HENG CHANG ; et al.	2009-04-30
Leadframe For Leadless Package App 20090108419 - KUO; HENG CHANG ; et al.	2009-04-30
Compositions and methods for uterine relaxing Grant 7,514,106 - Wei , et al. April 7, 2	2009-04-07
Manufacturing Process For A Chip Package Structure App 20090068789 - Shen; Geng-Shin ; et al.	2009-03-12
Manufacturing Process For A Chip Package Structure App 20090068793 - Shen; Geng-Shin ; et al.	2009-03-12
Manufacturing Process For A Quad Flat Non-leaded Chip Package Structure App 20090068797 - Shen; Geng-Shin ; et al.	2009-03-12
Manufacturing Process For A Quad Flat Non-leaded Chip Package Structure App 20090068799 - Shen; Geng-Shin ; et al.	2009-03-12
Manufacturing Process For A Quad Flat Non-leaded Chip Package Structure App 20090068794 - Shen; Geng-Shin ; et al.	2009-03-12
Manufacturing Process For A Chip Package Structure App 20090068792 - Shen; Geng-Shin ; et al.	2009-03-12
Manufacturing Process For A Quad Flat Non-leaded Chip Package Structure App 20090064494 - Shen; Geng-Shin ; et al.	2009-03-12
Chip Package App 20080315417 - Shen; Geng-Shin ; et al.	2008-12-25
Quad Flat Non-leaded Chip Package App 20080315439 - Shen; Geng-Shin ; et al.	2008-12-25
Chip package structure and fabricating method thereof Grant 7,446,400 - Chen , et al. November 4, 2	2008-11-04
Chip-Stacked Package Structure App 20080265397 - Lin; Chun-Ying ; et al.	2008-10-30
Chip-Stacked Package Structure and Applications Thereof App 20080265400 - Pan; Yu-Tang ; et al.	2008-10-30
Leadframe For Leadless Package, Structure And Manufacturing Method Using The Same App 20080258279 - Lin; Chun Ying ; et al.	2008-10-23
Display Device and Method of Displaying Menus Thereon App 20080244457 - Tang; Sheng-En ; et al.	2008-10-02
Chip Package And Manufacturing Method Thereof App 20080157333 - Lin; Chun-Ying ; et al.	2008-07-03
Development of a low driving-voltage micro scratch drive actuator by ultra-low resistivity silicon wafer App 20080157625 - Horng; Alex ; et al.	2008-07-03
Novel layout design for micro scratch drive actuator App 20080157626 - Horng; Alex ; et al.	2008-07-03
Dual-layer Recordable Optical Disc And Manufacturing Method Thereof App 20080150176 - YEH; RU-LIN ; et al.	2008-06-26
Compositions and methods for uterine relaxing App 20080113049 - Wei; Chia-Li ; et al.	2008-05-15
Chip Package Structure And Fabricating Method Threrof App 20080006917 - Chen; Ya-Chi ; et al.	2008-01-10
Integrated circuit package and multi-layer lead frame utilized App 20070267756 - Mao; I-Hsin ; et al.	2007-11-22
Compositions and methods for uterine relaxing App 20070237839 - Wei; Chia-Li ; et al.	2007-10-11
Automatic Multimedia Searching Method And Multimedia Downloading System Thereof App 20070088747 - Cheng; Chih-Chuan ; et al.	2007-04-19
Bump structure and its forming method App 20070080452 - Chi; Chen-Ya- ; et al.	2007-04-12
Dual-layer recordable optical disc and manufacturing method thereof App 20060110570 - Yeh; Ru-Lin ; et al.	2006-05-25
Method and structure for intensifying track seeking signals from an optical disk Grant 6,961,302 - Wang , et al. November 1, 2	2005-11-01
Kitchen ventilator with recirculation function App 20040149278 - Lin, Chun-Ying	2004-08-05
Adjustable smoke inlet set for kitchen ventilator Grant 6,732,730 - Lin May 11, 2	2004-05-11
Method and structure for intensifying track seeking signals from an optical disk App 20030137923 - Wang, Shyh-yeu ; et al.	2003-07-24