| Patent | Date |
|---|
Method for forming chip package structure with heat conductive layer
Grant 11,450,588 - Chi , et al. September 20, 2 | 2022-09-20 |
Packages with Multiple Encapsulated Substrate Blocks
App 20220262694 - Chen; Chen-Shien ; et al. | 2022-08-18 |
Post-passivation interconnect structure
Grant 11,417,610 - Chen , et al. August 16, 2 | 2022-08-16 |
Heterogeneous Bonding Structure and Method Forming Same
App 20220238353 - Lii; Mirng-Ji ; et al. | 2022-07-28 |
Bonding structures in semiconductor packaged device and method of forming same
Grant 11,393,771 - Liu , et al. July 19, 2 | 2022-07-19 |
Semiconductor packages with crack preventing structure
Grant 11,342,291 - Chuang , et al. May 24, 2 | 2022-05-24 |
Display Device And Manufacturing Method Thereof
App 20220149141 - Wu; Sheng-Yu ; et al. | 2022-05-12 |
Semiconductor Device And Manufacturing Method Thereof
App 20220140197 - Yen; Chen-En ; et al. | 2022-05-05 |
Conical-shaped or tier-shaped pillar connections
Grant 11,315,896 - Kuo , et al. April 26, 2 | 2022-04-26 |
Semiconductor Device
App 20220077094 - WU; Sheng-Yu ; et al. | 2022-03-10 |
Package on package structure and method for forming the same
Grant 11,264,342 - Yu , et al. March 1, 2 | 2022-03-01 |
Package structure and method of fabricating the same
Grant 11,244,919 - Hsiao , et al. February 8, 2 | 2022-02-08 |
Display device and manufacturing method thereof
Grant 11,239,305 - Wu , et al. February 1, 2 | 2022-02-01 |
Semiconductor device structure with bonding pad and method for forming the same
Grant 11,222,859 - Hsu , et al. January 11, 2 | 2022-01-11 |
Package structures and methods for forming the same
Grant 11,211,261 - Meng , et al. December 28, 2 | 2021-12-28 |
Semiconductor Device With Conductive Pad
App 20210384152 - YEN; Chen-En ; et al. | 2021-12-09 |
Semiconductor structure and manufacturing method thereof
Grant 11,177,355 - Yu , et al. November 16, 2 | 2021-11-16 |
Semiconductor device and bump formation process
Grant 11,177,228 - Wu , et al. November 16, 2 | 2021-11-16 |
Wafer Level Package Structure and Method of Forming Same
App 20210351076 - Yu; Chen-Hua ; et al. | 2021-11-11 |
Semiconductor Device Structure With Bonding Pad And Method For Forming The Same
App 20210351144 - HSU; Chien-Hao ; et al. | 2021-11-11 |
Semiconductor Device and Method of Forming Same
App 20210351139 - Tseng; Chih-Hsiang ; et al. | 2021-11-11 |
Thermal performance structure for semiconductor packages and method of forming same
Grant 11,158,614 - Cheng , et al. October 26, 2 | 2021-10-26 |
Integrated circuit package and methods of forming same
Grant 11,152,344 - Yu , et al. October 19, 2 | 2021-10-19 |
Fan-out interconnect structure and method for forming same
Grant 11,133,274 - Yu , et al. September 28, 2 | 2021-09-28 |
Metal Bumps and Method Forming Same
App 20210288009 - Cheng; Ming-Da ; et al. | 2021-09-16 |
Semiconductor Device Structure With Magnetic Element
App 20210280477 - WANG; Mill-Jer ; et al. | 2021-09-09 |
Multi-Layer Structures and Methods of Forming
App 20210265165 - Hsueh; Chang-Jung ; et al. | 2021-08-26 |
Semiconductor device and method for forming the same
Grant 11,101,233 - Yen , et al. August 24, 2 | 2021-08-24 |
Semiconductor Structure And Manufacturing Method Thereof
App 20210233883 - CHANG; KUO-CHIN ; et al. | 2021-07-29 |
Semiconductor device and method of forming same
Grant 11,075,173 - Tseng , et al. July 27, 2 | 2021-07-27 |
Wafer level package structure and method of forming same
Grant 11,069,573 - Yu , et al. July 20, 2 | 2021-07-20 |
Metal bumps and method forming same
Grant 11,024,593 - Cheng , et al. June 1, 2 | 2021-06-01 |
Semiconductor device structure with magnetic element in testing region
Grant 11,018,065 - Wang , et al. May 25, 2 | 2021-05-25 |
Process for Tuning Via Profile in Dielectric Material
App 20210151550 - Tzeng; Chun Kai ; et al. | 2021-05-20 |
Multi-layer structures and methods of forming
Grant 11,004,685 - Hsueh , et al. May 11, 2 | 2021-05-11 |
Package Structure With Cavity Substrate And Method For Forming The Same
App 20210125961 - TSAI; Po-Hao ; et al. | 2021-04-29 |
Connector Structure and Method of Forming Same
App 20210118833 - Chen; Chen-Shien ; et al. | 2021-04-22 |
Chip Package Structure With Heat Conductive Layer And Method For Forming The Same
App 20210118767 - CHI; Shin ; et al. | 2021-04-22 |
Semiconductor structure and manufacturing method thereof
Grant 10,985,124 - Chang , et al. April 20, 2 | 2021-04-20 |
Semiconductor Device Structure With Magnetic Element In Testing Region
App 20210057293 - WANG; Mill-Jer ; et al. | 2021-02-25 |
Packages with Stacked Dies and Methods of Forming the Same
App 20210050332 - Lee; Chien-Hsun ; et al. | 2021-02-18 |
Process for tuning via profile in dielectric material
Grant 10,910,466 - Tzeng , et al. February 2, 2 | 2021-02-02 |
Display Device And Manufacturing Method Thereof
App 20210028266 - Wu; Sheng-Yu ; et al. | 2021-01-28 |
Substrate design for semiconductor packages and method of forming same
Grant 10,867,949 - Cheng , et al. December 15, 2 | 2020-12-15 |
Connector structure and method of forming same
Grant 10,861,811 - Chen , et al. December 8, 2 | 2020-12-08 |
Semiconductor Packages With Crack Preventing Structure
App 20200357760 - CHUANG; Yao-Chun ; et al. | 2020-11-12 |
Packages with stacked dies and methods of forming the same
Grant 10,825,798 - Lee , et al. November 3, 2 | 2020-11-03 |
Forming Bonding Structures By Using Template Layer as Templates
App 20200328153 - Lii; Mirng-Ji ; et al. | 2020-10-15 |
Fan-Out Interconnect Structure and Method for Forming Same
App 20200328169 - Yu; Chen-Hua ; et al. | 2020-10-15 |
Methods for Making Multi-Die Package With Bridge Layer
App 20200266074 - Chang; Wei Sen ; et al. | 2020-08-20 |
Substrate design for semiconductor packages and method of forming same
Grant 10,714,359 - Cheng , et al. | 2020-07-14 |
Forming bonding structures by using template layer as templates
Grant 10,700,001 - Lii , et al. | 2020-06-30 |
Fan-out interconnect structure and method for forming same
Grant 10,700,025 - Yu , et al. | 2020-06-30 |
Multi-layer Structures And Methods Of Forming
App 20200176254 - Hsueh; Chang-Jung ; et al. | 2020-06-04 |
Package On Package Structure And Method For Forming The Same
App 20200152587 - Yu; Chen-Hua ; et al. | 2020-05-14 |
Methods for making multi-die package with bridge layer
Grant 10,643,861 - Chang , et al. | 2020-05-05 |
Semiconductor Device And Method Of Forming Same
App 20200135664 - Tseng; Chih-Hsiang ; et al. | 2020-04-30 |
Post-passivation Interconnect Structure
App 20200135659 - CHEN; Hsien-Wei ; et al. | 2020-04-30 |
Process for Tuning Via Profile in Dielectric Material
App 20200127078 - Tzeng; Chun Kai ; et al. | 2020-04-23 |
Bonding Structures In Semiconductor Packaged Device And Method Of Forming Same
App 20200105682 - Liu; Haochun ; et al. | 2020-04-02 |
Metal Bumps and Method Forming Same
App 20200105696 - Cheng; Ming-Da ; et al. | 2020-04-02 |
Chip Structure And Method For Forming The Same
App 20200058589 - SHUE; Hong-Seng ; et al. | 2020-02-20 |
Package on package structure and method for forming the same
Grant 10,559,546 - Yu , et al. Feb | 2020-02-11 |
Substrate Design For Semiconductor Packages And Method Of Forming Same
App 20200013635 - Cheng; Jung Wei ; et al. | 2020-01-09 |
Post-passivation interconnect structure
Grant 10,522,481 - Chen , et al. Dec | 2019-12-31 |
Package-on-package (PoP) structure including stud bulbs
Grant 10,510,731 - Yu , et al. Dec | 2019-12-17 |
Package Structure And Method Of Fabricating The Same
App 20190371754 - Hsiao; Ching-Wen ; et al. | 2019-12-05 |
Method For Manufacturing Semiconductor Device
App 20190371718 - TSENG; HUA-WEI ; et al. | 2019-12-05 |
Integrated Circuit Package and Methods of Forming Same
App 20190341376 - Yu; Chen-Hua ; et al. | 2019-11-07 |
Semiconductor Structure And Manufacturing Method Thereof
App 20190326244 - CHANG; KUO-CHIN ; et al. | 2019-10-24 |
Semiconductor Device And Bump Formation Process
App 20190295977 - WU; Sheng-Yu ; et al. | 2019-09-26 |
Connector Structure and Method of Forming Same
App 20190279953 - Chen; Chen-Shien ; et al. | 2019-09-12 |
Connector structure and method of forming same
Grant 10,388,620 - Chen , et al. A | 2019-08-20 |
Programmable Inductor
App 20190252117 - Yu; Chen-Hua ; et al. | 2019-08-15 |
Semiconductor Structure And Manufacturing Method Thereof
App 20190237553 - YU; CHEN-HUA ; et al. | 2019-08-01 |
Integrated circuit package and methods of forming same
Grant 10,354,983 - Yu , et al. July 16, 2 | 2019-07-16 |
Semiconductor device and bump formation process
Grant 10,319,695 - Wu , et al. | 2019-06-11 |
Semiconductor structure and manufacturing method thereof
Grant 10,319,692 - Chiang , et al. | 2019-06-11 |
Package-on-package structure with organic interposer
Grant 10,319,607 - Wu , et al. | 2019-06-11 |
System and method for an improved interconnect structure
Grant 10,312,204 - Chen , et al. | 2019-06-04 |
Package On Package Structure And Method For Forming The Same
App 20190131261 - Yu; Chen-Hua ; et al. | 2019-05-02 |
Package structure and method of fabricating the same
Grant 10,276,525 - Hsiao , et al. | 2019-04-30 |
Package-On-Package (PoP) Structure Including Stud Bulbs
App 20190123027 - Yu; Chen-Hua ; et al. | 2019-04-25 |
Semiconductor structure and manufacturing method thereof
Grant 10,269,904 - Yu , et al. | 2019-04-23 |
Programmable inductor
Grant 10,269,489 - Yu , et al. | 2019-04-23 |
Post-passivation Interconnect Structure
App 20190074255 - CHEN; Hsien-Wei ; et al. | 2019-03-07 |
Package on package structure and method for forming the same
Grant 10,177,104 - Yu , et al. J | 2019-01-08 |
Semiconductor Device And Bump Formation Process
App 20190006303 - WU; Sheng-Yu ; et al. | 2019-01-03 |
System and Method for an Improved Interconnect Structure
App 20180374807 - Chen; Hsien-Wei ; et al. | 2018-12-27 |
Method for manufacturing semiconductor structure
Grant 10,163,734 - Yu , et al. Dec | 2018-12-25 |
Semiconductor structure and manufacturing method thereof
Grant 10,163,842 - Kuo , et al. Dec | 2018-12-25 |
Package-on-package (PoP) structure including stud bulbs
Grant 10,157,893 - Yu , et al. Dec | 2018-12-18 |
Conical-Shaped or Tier-Shaped Pillar Connections
App 20180358316 - Kuo; Tin-Hao ; et al. | 2018-12-13 |
Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices
Grant 10,153,243 - Tseng , et al. Dec | 2018-12-11 |
Methods for stud bump formation
Grant 10,147,693 - Hwang , et al. De | 2018-12-04 |
Package Structures and Methods for Forming the Same
App 20180342404 - Meng; Hsien-Liang ; et al. | 2018-11-29 |
Method of fabricating a post-passivation interconnect structure
Grant 10,121,749 - Chen , et al. November 6, 2 | 2018-11-06 |
Substrate Design for Semiconductor Packages and Method of Forming Same
App 20180301351 - Cheng; Jung Wei ; et al. | 2018-10-18 |
Semiconductor Structure And Manufacturing Method Thereof
App 20180301430 - Kuo; Chien-Hung ; et al. | 2018-10-18 |
Interconnect structure for CIS flip-chip bonding and methods for forming the same
Grant 10,090,345 - Yu , et al. October 2, 2 | 2018-10-02 |
Packages with Stacked Dies and Methods of Forming the Same
App 20180277519 - Lee; Chien-Hsun ; et al. | 2018-09-27 |
System and method for an improved fine pitch joint
Grant 10,062,659 - Chen , et al. August 28, 2 | 2018-08-28 |
Substrate design for semiconductor packages and method of forming same
Grant 10,056,267 - Cheng , et al. August 21, 2 | 2018-08-21 |
Conical-shaped or tier-shaped pillar connections
Grant 10,056,345 - Kuo , et al. August 21, 2 | 2018-08-21 |
Package structures and methods for forming the same
Grant 10,049,894 - Meng , et al. August 14, 2 | 2018-08-14 |
Bonding Structures and Methods Forming the Same
App 20180226342 - Lii; Mirng-Ji ; et al. | 2018-08-09 |
System and method for an improved interconnect structure
Grant 10,043,770 - Chen , et al. August 7, 2 | 2018-08-07 |
Substrate design for semiconductor packages and method of forming same
Grant 10,026,671 - Yu , et al. July 17, 2 | 2018-07-17 |
Package on package devices and methods of packaging semiconductor dies
Grant 10,020,286 - Chen , et al. July 10, 2 | 2018-07-10 |
Package Structure And Method Of Fabricating The Same
App 20180151524 - Hsiao; Ching-Wen ; et al. | 2018-05-31 |
Packages with stacked dies and methods of forming the same
Grant 9,984,999 - Lee , et al. May 29, 2 | 2018-05-29 |
Wafer Level Package Structure and Method of Forming Same
App 20180138089 - Yu; Chen-Hua ; et al. | 2018-05-17 |
Hybrid interconnect for chip stacking
Grant 9,935,081 - Pan , et al. April 3, 2 | 2018-04-03 |
Bonding structures and methods forming the same
Grant 9,935,047 - Lii , et al. April 3, 2 | 2018-04-03 |
Semiconductor structure and manufacturing method of the same
Grant 9,935,073 - Lin , et al. April 3, 2 | 2018-04-03 |
Semiconductor device packages and methods
Grant 9,935,038 - Wang , et al. April 3, 2 | 2018-04-03 |
Bump-on-trace interconnection structure for flip-chip packages
Grant 9,917,035 - Tseng , et al. March 13, 2 | 2018-03-13 |
Package-On-Package (PoP) Structure Including Stud Bulbs
App 20180047709 - Yu; Chen-Hua ; et al. | 2018-02-15 |
Wafer level package structure and method of forming same
Grant 9,870,946 - Yu , et al. January 16, 2 | 2018-01-16 |
Wafer having pad structure
Grant 9,831,140 - Chen , et al. November 28, 2 | 2017-11-28 |
Method Of Fabricating A Post-passivation Interconnect Structure
App 20170338188 - CHEN; Hsien-Wei ; et al. | 2017-11-23 |
Package on-package (PoP) structure including stud bulbs
Grant 9,812,427 - Yu , et al. November 7, 2 | 2017-11-07 |
Method For Manufacturing Semiconductor Structure
App 20170316987 - YU; CHEN-HUA ; et al. | 2017-11-02 |
Package On Package Structure And Method For Forming The Same
App 20170287865 - Yu; Chen-Hua ; et al. | 2017-10-05 |
Rigid interconnect structures in package-on-package assemblies
Grant 9,768,105 - Lii , et al. September 19, 2 | 2017-09-19 |
Substrate design for semiconductor packages and method of forming same
Grant 9,768,090 - Liang , et al. September 19, 2 | 2017-09-19 |
Thermal Performance Structure For Semiconductor Packages And Method Of Forming Same
App 20170250166 - Cheng; Jung Wei ; et al. | 2017-08-31 |
Integrated Circuit Package And Methods Of Forming Same
App 20170250170 - Yu; Chen-Hua ; et al. | 2017-08-31 |
Connector Structure and Method of Forming Same
App 20170243846 - Chen; Chen-Shien ; et al. | 2017-08-24 |
Methods For Making Multi-die Package With Bridge Layer
App 20170236724 - Chang; Wei Sen ; et al. | 2017-08-17 |
Semiconductor Devices, Methods of Manufacture Thereof, and Packaged Semiconductor Devices
App 20170229421 - Tseng; Yu-Jen ; et al. | 2017-08-10 |
Method for manufacturing semiconductor structure
Grant 9,728,427 - Yu , et al. August 8, 2 | 2017-08-08 |
Semiconductor Structure And Manufacturing Method Of The Same
App 20170213804 - LIN; YEN-LIANG ; et al. | 2017-07-27 |
Package on package structure and method for forming the same
Grant 9,711,470 - Yu , et al. July 18, 2 | 2017-07-18 |
System And Method For An Improved Interconnect Structure
App 20170186713 - Chen; Hsien-Wei ; et al. | 2017-06-29 |
Semiconductor device
Grant 9,666,530 - Chen , et al. May 30, 2 | 2017-05-30 |
Integrated circuit package and methods of forming same
Grant 9,653,442 - Yu , et al. May 16, 2 | 2017-05-16 |
Thermal performance structure for semiconductor packages and method of forming same
Grant 9,653,443 - Cheng , et al. May 16, 2 | 2017-05-16 |
Semiconductor Device And Method Of Forming The Same
App 20170133339 - LII; MIRNG-JI ; et al. | 2017-05-11 |
Connector structure and method of forming same
Grant 9,646,943 - Chen , et al. May 9, 2 | 2017-05-09 |
Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices
Grant 9,646,923 - Tseng , et al. May 9, 2 | 2017-05-09 |
Multi-die package with bridge layer and method for making the same
Grant 9,640,521 - Chang , et al. May 2, 2 | 2017-05-02 |
Packaging devices and methods of manufacture thereof
Grant 9,633,963 - Chen , et al. April 25, 2 | 2017-04-25 |
Semiconductor structure and manufacturing method of the same
Grant 9,633,965 - Lin , et al. April 25, 2 | 2017-04-25 |
System and method for an improved interconnect structure
Grant 9,633,870 - Chen , et al. April 25, 2 | 2017-04-25 |
Bonding Structures And Methods Forming The Same
App 20170110401 - Lii; Mirng-Ji ; et al. | 2017-04-20 |
Semiconductor Structure And Manufacturing Method Thereof
App 20170103955 - CHIANG; YUNG-PING ; et al. | 2017-04-13 |
Post-passivation interconnect structure
Grant 9,613,914 - Chen , et al. April 4, 2 | 2017-04-04 |
Package having substrate with embedded metal trace overlapped by landing pad
Grant 9,559,076 - Lii , et al. January 31, 2 | 2017-01-31 |
Package-On-Package (PoP) Structure Including Stud Bulbs and Method
App 20170025391 - Yu; Chen-Hua ; et al. | 2017-01-26 |
Semiconductor structure with oval shaped conductor
Grant 9,543,259 - Chiang , et al. January 10, 2 | 2017-01-10 |
Semiconductor package and method of forming the same
Grant 9,536,818 - Lin , et al. January 3, 2 | 2017-01-03 |
Package having substrate with embedded metal trace overlapped by landing pad
Grant 9,536,850 - Yu , et al. January 3, 2 | 2017-01-03 |
3D package with through substrate vias
Grant 9,530,759 - Yu , et al. December 27, 2 | 2016-12-27 |
Single mask package apparatus
Grant 9,530,757 - Yu , et al. December 27, 2 | 2016-12-27 |
Conical-Shaped or Tier-Shaped Pillar Connections
App 20160358876 - Kuo; Tin-Hao ; et al. | 2016-12-08 |
Package on-Package (PoP) structure including stud bulbs and method
Grant 9,502,394 - Yu , et al. November 22, 2 | 2016-11-22 |
Methods for forming apparatus for stud bump formation
Grant 9,498,851 - Lin , et al. November 22, 2 | 2016-11-22 |
Interconnect Structure for CIS Flip-Chip Bonding and Methods for Forming the Same
App 20160300874 - Yu; Chen-Hua ; et al. | 2016-10-13 |
MIM capacitor and method forming the same
Grant 9,461,106 - Yang , et al. October 4, 2 | 2016-10-04 |
Fan-Out Interconnect Structure and Method for Forming Same
App 20160284654 - Yu; Chen-Hua ; et al. | 2016-09-29 |
MIM Capacitor and Method Forming the Same
App 20160276426 - Yang; Ching-Jung ; et al. | 2016-09-22 |
Connecting function chips to a package to form package-on-package
Grant 9,449,941 - Tsai , et al. September 20, 2 | 2016-09-20 |
Package Structures and Methods for Forming the Same
App 20160268145 - Meng; Hsien-Liang ; et al. | 2016-09-15 |
Semiconductor device with post-passivation interconnect structure and method of forming the same
Grant 9,443,812 - Chen , et al. September 13, 2 | 2016-09-13 |
Packaging Devices and Methods of Manufacture Thereof
App 20160254238 - Chen; Hsien-Wei ; et al. | 2016-09-01 |
Packages with Stacked Dies and Methods of Forming the Same
App 20160247786 - Lee; Chien-Hsun ; et al. | 2016-08-25 |
Conical-shaped or tier-shaped pillar connections
Grant 9,425,136 - Kuo , et al. August 23, 2 | 2016-08-23 |
Method of forming package-on-package (PoP) structure having a chip package with a plurality of dies attaching to first side of an interposer with a die formed thereon
Grant 9,418,978 - Yu , et al. August 16, 2 | 2016-08-16 |
3D Package With Through Substrate Vias
App 20160218090 - Yu; Chen-Hua ; et al. | 2016-07-28 |
Package Having Substrate With Embedded Metal Trace Overlapped by Landing Pad
App 20160211239 - Lii; Mirng-Ji ; et al. | 2016-07-21 |
Semiconductor device having trench adjacent to receiving area and method of forming the same
Grant 9,397,056 - Wang , et al. July 19, 2 | 2016-07-19 |
Package on package structure
Grant 9,397,060 - Yu , et al. July 19, 2 | 2016-07-19 |
Interconnect structure for CIS flip-chip bonding and methods for forming the same
Grant 9,397,137 - Yu , et al. July 19, 2 | 2016-07-19 |
Method For Manufacturing Semiconductor Structure
App 20160204042 - YU; CHEN-HUA ; et al. | 2016-07-14 |
Fan-out interconnect structure and method for forming same
Grant 9,368,460 - Yu , et al. June 14, 2 | 2016-06-14 |
Package structures and methods for forming the same
Grant 9,362,236 - Meng , et al. June 7, 2 | 2016-06-07 |
Packaging devices and methods of manufacture thereof
Grant 9,355,978 - Chen , et al. May 31, 2 | 2016-05-31 |
System and Method for an Improved Fine Pitch Joint
App 20160148889 - Chen; Cheng-Ting ; et al. | 2016-05-26 |
Packages with stacked dies and methods of forming the same
Grant 9,343,433 - Lee , et al. May 17, 2 | 2016-05-17 |
System and Method for an Improved Interconnect Structure
App 20160133482 - Chen; Hsien-Wei ; et al. | 2016-05-12 |
Pop joint through interposer
Grant 9,337,135 - Lii , et al. May 10, 2 | 2016-05-10 |
Semiconductor Structure And Manufacturing Method Thereof
App 20160126324 - YU; CHEN-HUA ; et al. | 2016-05-05 |
Device packaging
Grant 9,331,023 - Liu , et al. May 3, 2 | 2016-05-03 |
Method for manufacturing semiconductor structure
Grant 9,324,587 - Yu , et al. April 26, 2 | 2016-04-26 |
Package On Package Structure And Method For Forming The Same
App 20160111385 - Yu; Chen-Hua ; et al. | 2016-04-21 |
Pop Joint Through Interposer
App 20160104668 - Lii; Mirng-Ji ; et al. | 2016-04-14 |
Semiconductor Structure And Manufacturing Method Thereof
App 20160099221 - CHIANG; YUNG-PING ; et al. | 2016-04-07 |
Package having substrate with embedded metal trace overlapped by landing pad
Grant 9,305,890 - Lii , et al. April 5, 2 | 2016-04-05 |
3D package with through substrate vias
Grant 9,305,877 - Yu , et al. April 5, 2 | 2016-04-05 |
Package and Method for Making the Same
App 20160093597 - Chang; Wei Sen ; et al. | 2016-03-31 |
Apparatus for package reinforcement using molding underfill
Grant 9,287,143 - Chen , et al. March 15, 2 | 2016-03-15 |
Semiconductor Device And Manufacturing Method Thereof
App 20160064340 - TSENG; HUA-WEI ; et al. | 2016-03-03 |
System and method for an improved interconnect structure
Grant 9,275,925 - Chen , et al. March 1, 2 | 2016-03-01 |
Package-on-package Structure With Organic Interposer
App 20160056087 - Wu; Jiun Yi ; et al. | 2016-02-25 |
Hybrid Interconnect for Chip Stacking
App 20160056125 - Pan; Kuo Lung ; et al. | 2016-02-25 |
System and method for an improved fine pitch joint
Grant 9,263,839 - Chen , et al. February 16, 2 | 2016-02-16 |
Semiconductor Structure And Manufacturing Method Of The Same
App 20160043051 - LIN; Yen-Liang ; et al. | 2016-02-11 |
Package on Package Devices and Methods of Packaging Semiconductor Dies
App 20160035709 - Chen; Yung Ching ; et al. | 2016-02-04 |
Wafer-level chip scale package with re-workable underfill
Grant 9,240,387 - Chen , et al. January 19, 2 | 2016-01-19 |
Integrated inductor
Grant 9,219,106 - Lin , et al. December 22, 2 | 2015-12-22 |
Package on package structures and methods for forming the same
Grant 9,219,030 - Yu , et al. December 22, 2 | 2015-12-22 |
Method of Forming Package-On-Package (PoP) Structure
App 20150357320 - Yu; Chen-Hua ; et al. | 2015-12-10 |
Semiconductor Device Having Trench Adjacent To Receiving Area And Method Of Forming The Same
App 20150348923 - WANG; YEN-PING ; et al. | 2015-12-03 |
Package on Package Structure
App 20150340349 - Yu; Chen-Hua ; et al. | 2015-11-26 |
Wafer Having Pad Structure
App 20150318225 - CHEN; Ying-Ju ; et al. | 2015-11-05 |
Package on package devices and methods of packaging semiconductor dies
Grant 9,171,790 - Yu , et al. October 27, 2 | 2015-10-27 |
Low profile interposer with stud structure
Grant 9,165,875 - Yu , et al. October 20, 2 | 2015-10-20 |
Single Mask Package Apparatus
App 20150255435 - Yu; Chen-Hua ; et al. | 2015-09-10 |
Package-on-package (PoP) structure having at least one package comprising one die being disposed in a core material between first and second surfaces of the core material
Grant 9,123,763 - Yu , et al. September 1, 2 | 2015-09-01 |
Thermal Performance Structure for Semiconductor Packages and Method of Forming Same
App 20150235993 - Cheng; Jung Wei ; et al. | 2015-08-20 |
Substrate Design For Semiconductor Packages And Method Of Forming Same
App 20150235989 - Yu; Chen-Hua ; et al. | 2015-08-20 |
Substrate Design for Semiconductor Packages and Method of Forming Same
App 20150235915 - Liang; Yu-Min ; et al. | 2015-08-20 |
Substrate Design For Semiconductor Packages And Method Of Forming Same
App 20150235990 - Cheng; Jung Wei ; et al. | 2015-08-20 |
Method For Manufacturing Semiconductor Structure
App 20150235874 - YU; CHEN-HUA ; et al. | 2015-08-20 |
Methods for Stud Bump Formation and Apparatus for Performing the Same
App 20150235975 - Hwang; Chien Ling ; et al. | 2015-08-20 |
Semiconductor Device with Post-Passivation Interconnect Structure and Method of Forming the Same
App 20150228598 - Chen; Hsien-Wei ; et al. | 2015-08-13 |
Packages with Stacked Dies and Methods of Forming the Same
App 20150214191 - Lee; Chien-Hsun ; et al. | 2015-07-30 |
Pad structure having contact bars extending into substrate and wafer having the pad structure
Grant 9,093,411 - Chen , et al. July 28, 2 | 2015-07-28 |
Semiconductor Package and Methods of Forming Same
App 20150206866 - Yu; Chen-Hua ; et al. | 2015-07-23 |
Integrated Circuit Package and Methods of Forming Same
App 20150206865 - Yu; Chen-Hua ; et al. | 2015-07-23 |
Package Having Substrate With Embedded Metal TraceOverlapped by Landing Pad
App 20150200172 - Lii; Mirng-Ji ; et al. | 2015-07-16 |
Packaging methods and structures for semiconductor devices
Grant 9,082,636 - Lin , et al. July 14, 2 | 2015-07-14 |
Wafer Level Package Structure And Method Of Forming Same
App 20150187743 - Yu; Chen-Hua ; et al. | 2015-07-02 |
Single mask package apparatus and method
Grant 9,041,215 - Yu , et al. May 26, 2 | 2015-05-26 |
Package-On-Package (PoP) Structure Including Stud Bulbs and Method
App 20150132889 - Yu; Chen-Hua ; et al. | 2015-05-14 |
Packaged Semiconductor Device
App 20150123267 - LII; MIRNG-JI ; et al. | 2015-05-07 |
Apparatus for stud bump formation
Grant 9,021,682 - Hwang , et al. May 5, 2 | 2015-05-05 |
Semiconductor device with post-passivation interconnect structure and method of forming the same
Grant 9,013,038 - Chen , et al. April 21, 2 | 2015-04-21 |
Methods for Forming Apparatus for Stud Bump Formation
App 20150102091 - Lin; Yeong-Jyh ; et al. | 2015-04-16 |
Method of making a semiconductor device having a post-passivation interconnect structure
Grant 9,006,891 - Liang , et al. April 14, 2 | 2015-04-14 |
Semiconductor structure and manufacturing method thereof
Grant 8,987,915 - Yu , et al. March 24, 2 | 2015-03-24 |
Structure and method for bump to landing trace ratio
Grant 8,981,576 - Yu , et al. March 17, 2 | 2015-03-17 |
Semiconductor Structure And Manufacturing Method Thereof
App 20150061162 - YU; CHEN-HUA ; et al. | 2015-03-05 |
Guard ring design for maintaining signal integrity
Grant 8,970,001 - Lii , et al. March 3, 2 | 2015-03-03 |
Interconnect Structure for CIS Flip-Chip Bonding and Methods for Forming the Same
App 20150056737 - Yu; Chen-Hua ; et al. | 2015-02-26 |
Reducing delamination between an underfill and a buffer layer in a bond structure
Grant 8,963,328 - Yang , et al. February 24, 2 | 2015-02-24 |
Packaging Methods and Structures for Semiconductor Devices
App 20150044819 - Lin; Chih-Wei ; et al. | 2015-02-12 |
Methods for forming apparatus for stud bump formation
Grant 8,936,730 - Lin , et al. January 20, 2 | 2015-01-20 |
Multiple die packaging interposer structure and method
Grant 8,916,956 - Yu , et al. December 23, 2 | 2014-12-23 |
Package-on-package (PoP) structure including stud bulbs and method
Grant 8,912,651 - Yu , et al. December 16, 2 | 2014-12-16 |
Interconnect structure for CIS flip-chip bonding and methods for forming the same
Grant 8,890,274 - Yu , et al. November 18, 2 | 2014-11-18 |
Packaging methods and structures for semiconductor devices
Grant 8,884,431 - Lin , et al. November 11, 2 | 2014-11-11 |
Programmable Inductor
App 20140266542 - Yu; Chen-Hua ; et al. | 2014-09-18 |
System and Method for an Improved Interconnect Structure
App 20140262468 - Chen; Hsien-Wei ; et al. | 2014-09-18 |
Fan-Out Interconnect Structure and Method for Forming Same
App 20140264930 - Yu; Chen-Hua ; et al. | 2014-09-18 |
Semiconductor Device With Post-passivation Interconnect Structure And Method Of Forming The Same
App 20140264837 - Chen; Hsien-Wei ; et al. | 2014-09-18 |
Single Mask Package Apparatus and Method
App 20140264927 - Yu; Chen-Hua ; et al. | 2014-09-18 |
Package Structures and Methods for Forming the Same
App 20140252594 - Meng; Hsien-Liang ; et al. | 2014-09-11 |
Packaging Devices and Methods of Manufacture Thereof
App 20140252610 - Chen; Hsien-Wei ; et al. | 2014-09-11 |
Package Having Substrate with Embedded Metal Trace Overlapped by Landing Pad
App 20140252598 - Yu; Chen-Hua ; et al. | 2014-09-11 |
Package on Package Structure
App 20140246785 - Yu; Chen-Hua ; et al. | 2014-09-04 |
Package on package devices and methods of packaging semiconductor dies
Grant 8,823,180 - Wang , et al. September 2, 2 | 2014-09-02 |
System and method for forming uniform rigid interconnect structures
Grant 8,796,132 - Sung , et al. August 5, 2 | 2014-08-05 |
Guard Ring Design for Maintaining Signal Integrity
App 20140183690 - Lii; Mirng-Ji ; et al. | 2014-07-03 |
System and Method for an Improved Fine Pitch Joint
App 20140187103 - Chen; Cheng-Ting ; et al. | 2014-07-03 |
Wafer level package structure and fabrication methods
Grant 8,759,964 - Pu , et al. June 24, 2 | 2014-06-24 |
Semiconductor Devices, Methods of Manufacture Thereof, and Packaged Semiconductor Devices
App 20140167253 - Tseng; Yu-Jen ; et al. | 2014-06-19 |
Apparatus and Method for Package Reinforcement
App 20140159223 - Chen; Hsien-Wei ; et al. | 2014-06-12 |
Cleaning residual molding compound on solder bumps
Grant 8,748,306 - Lei , et al. June 10, 2 | 2014-06-10 |
Package on package structure
Grant 8,749,043 - Yu , et al. June 10, 2 | 2014-06-10 |
Forming wafer-level chip scale package structures with reduced number of seed layers
Grant 8,735,273 - Lu , et al. May 27, 2 | 2014-05-27 |
Structure and Method for Bump to Landing Trace Ratio
App 20140131865 - Yu; Chen-Hua ; et al. | 2014-05-15 |
Carrier Wafers, Methods of Manufacture Thereof, and Packaging Methods
App 20140127857 - Chen; Chen-Shien ; et al. | 2014-05-08 |
Bump structure with barrier layer on post-passivation interconnect
Grant 8,716,858 - Lu , et al. May 6, 2 | 2014-05-06 |
Bump-on-trace Interconnection Structure For Flip-chip Packages
App 20140110847 - TSENG; Yu-Jen ; et al. | 2014-04-24 |
Multiple die packaging interposer structure and method
Grant 8,703,539 - Yu , et al. April 22, 2 | 2014-04-22 |
Methods for forming through vias
Grant 8,685,798 - Shao , et al. April 1, 2 | 2014-04-01 |
Multiple Die Packaging Interposer Structure and Method
App 20140084459 - Yu; Chen-Hua ; et al. | 2014-03-27 |
Reducing Delamination Between an Underfill and a Buffer Layer in a Bond Structure
App 20140087522 - Yang; Ching-Jung ; et al. | 2014-03-27 |
Package-on-package structures with reduced bump bridging
Grant 8,669,651 - Yang , et al. March 11, 2 | 2014-03-11 |
Methods for Forming Apparatus for Stud Bump Formation
App 20140061153 - Lin; Yeong-Jyh ; et al. | 2014-03-06 |
Method for designing a package and substrate layout
Grant 8,664,041 - Tseng , et al. March 4, 2 | 2014-03-04 |
Method Of Making A Semiconductor Device Having A Post-passivation Interconnect Structure
App 20140045326 - LIANG; Shih-Wei ; et al. | 2014-02-13 |
Package on Package Devices and Methods of Forming Same
App 20140042621 - Yu; Chen-Hua ; et al. | 2014-02-13 |
Package on package devices and methods of forming same
Grant 8,642,393 - Yu , et al. February 4, 2 | 2014-02-04 |
Structure and method for bump to landing trace ratio
Grant 8,643,196 - Yu , et al. February 4, 2 | 2014-02-04 |
Package on Package Devices and Methods of Packaging Semiconductor Dies
App 20140021605 - Yu; Chen-Hua ; et al. | 2014-01-23 |
Interconnect Structure for CIS Flip-Chip Bonding and Methods for Forming the Same
App 20140015086 - Yu; Chen-Hua ; et al. | 2014-01-16 |
System and Method for Forming Uniform Rigid Interconnect Structures
App 20140004660 - Sung; Ming-Chung ; et al. | 2014-01-02 |
Multiple Die Packaging Interposer Structure and Method
App 20140001612 - Yu; Chen-Hua ; et al. | 2014-01-02 |
Measurement of electrical and mechanical characteristics of low-K dielectric in a semiconductor device
Grant 08618827 - | 2013-12-31 |
Measurement of electrical and mechanical characteristics of low-K dielectric in a semiconductor device
Grant 8,618,827 - Shao , et al. December 31, 2 | 2013-12-31 |
Reducing delamination between an underfill and a buffer layer in a bond structure
Grant 8,610,267 - Yang , et al. December 17, 2 | 2013-12-17 |
Post-passivation interconnect structure
Grant 8,581,400 - Liang , et al. November 12, 2 | 2013-11-12 |
Low Profile Interposer with Stud Structure
App 20130285237 - Yu; Chen-Hua ; et al. | 2013-10-31 |
Rigid Interconnect Structures in Package-on-Package Assemblies
App 20130277841 - Lii; Mirng-Ji ; et al. | 2013-10-24 |
Methods for Forming Through Vias
App 20130273698 - Shao; Tung-Liang ; et al. | 2013-10-17 |
Package On Package Structures And Methods For Forming The Same
App 20130270700 - YU; Chen-Hua ; et al. | 2013-10-17 |
Trace Layout Method in Bump-on-Trace Structures
App 20130270693 - Tseng; Yu-Jen ; et al. | 2013-10-17 |
Conical-Shaped or Tier-Shaped Pillar Connections
App 20130270699 - Kuo; Tin-Hao ; et al. | 2013-10-17 |
Semiconductor Device Packages and Methods
App 20130270705 - Wang; Tsung-Ding ; et al. | 2013-10-17 |
Wafer level IC assembly method
Grant 8,551,813 - Lee , et al. October 8, 2 | 2013-10-08 |
Methods for stud bump formation and apparatus for performing the same
Grant 8,540,136 - Lin , et al. September 24, 2 | 2013-09-24 |
Wire Bonding Structures for Integrated Circuits
App 20130241058 - Yu; Chen-Hua ; et al. | 2013-09-19 |
Package on Package Structure
App 20130228932 - Yu; Chen-Hua ; et al. | 2013-09-05 |
Semiconductor package structures
Grant 8,524,595 - Lii , et al. September 3, 2 | 2013-09-03 |
UBM etching methods for eliminating undercut
Grant 8,501,613 - Lei , et al. August 6, 2 | 2013-08-06 |
Methods for Stud Bump Formation and Apparatus for Performing the Same
App 20130167373 - Hwang; Chien Ling ; et al. | 2013-07-04 |
Package on Package Devices and Methods of Packaging Semiconductor Dies
App 20130168856 - Wang; Tsung-Ding ; et al. | 2013-07-04 |
Apparatus and methods for forming through vias
Grant 8,476,770 - Shao , et al. July 2, 2 | 2013-07-02 |
Post-passivation Interconnect Structure
App 20130147033 - CHEN; Hsien-Wei ; et al. | 2013-06-13 |
Package-On-Package (PoP) Structure and Method
App 20130134588 - Yu; Chen-Hua ; et al. | 2013-05-30 |
Method for Stacking Devices and Structure Thereof
App 20130127049 - Wang; Dean ; et al. | 2013-05-23 |
Package-On-Package (PoP) Structure and Method
App 20130093097 - Yu; Chen-Hua ; et al. | 2013-04-18 |
Wafer-Level Chip Scale Package with Re-Workable Underfill
App 20130093084 - Chen; Hsien-Wei ; et al. | 2013-04-18 |
Post-passivation Interconnect Structure
App 20130093077 - LIANG; Shih-Wei ; et al. | 2013-04-18 |
Semiconductor Package And Method Of Forming The Same
App 20130093076 - LIN; Wei-Hung ; et al. | 2013-04-18 |
Multi-project wafer and method of making same
Grant 8,409,881 - Cheng , et al. April 2, 2 | 2013-04-02 |
Packaging Methods and Structures for Semiconductor Devices
App 20130062761 - Lin; Chih-Wei ; et al. | 2013-03-14 |
Method of forming electrical connections
Grant 8,377,816 - Liu , et al. February 19, 2 | 2013-02-19 |
Cleaning Residual Molding Compound On Solder Bumps
App 20130034956 - LEI; Yi-Yang ; et al. | 2013-02-07 |
Integrated Inductor
App 20130032923 - Lin; Yen-Liang ; et al. | 2013-02-07 |
Structure And Method For Bump To Landing Trace Ratio
App 20130026614 - Yu; Chen-Hua ; et al. | 2013-01-31 |
Forming Wafer-Level Chip Scale Package Structures with Reduced number of Seed Layers
App 20130009307 - Lu; Wen-Hsiung ; et al. | 2013-01-10 |
Apparatus and Methods for Forming Through Vias
App 20130009319 - Shao; Tung-Liang ; et al. | 2013-01-10 |
Connecting Function Chips To A Package To Form Package-On-Package
App 20130009303 - Tsai; Pei-Chun ; et al. | 2013-01-10 |
UBM Etching Methods for Eliminating Undercut
App 20130012014 - Lei; Yi-Yang ; et al. | 2013-01-10 |
Bump Structure With Barrier Layer On Post-passivation Interconnect
App 20120326298 - LU; Chen-Fa ; et al. | 2012-12-27 |
Method for stacking devices
Grant 8,334,170 - Wang , et al. December 18, 2 | 2012-12-18 |
Wafer Level Ic Assembly Method
App 20120288998 - Lee; Chien Hsiun ; et al. | 2012-11-15 |
Wafer level IC assembly method
Grant 8,247,267 - Lee , et al. August 21, 2 | 2012-08-21 |
Interconnect structures having lead-free solder bumps
Grant 8,169,076 - Lii , et al. May 1, 2 | 2012-05-01 |
Pad Structure Having Contact Bars Extending Into Substrate And Wafer Having The Pad Structure
App 20120091455 - CHEN; Ying-Ju ; et al. | 2012-04-19 |
Measurement Of Electrical And Mechanical Characteristics Of Low-k Dielectric In A Semiconductor Device
App 20120092033 - Shao; Tung-Liang ; et al. | 2012-04-19 |
Reducing Delamination Between an Underfill and a Buffer layer in a Bond Structure
App 20120018875 - Yang; Ching-Jung ; et al. | 2012-01-26 |
Package-on-Package Structures with Reduced Bump Bridging
App 20120018877 - Yang; Chung-Ying ; et al. | 2012-01-26 |
Chip holder with wafer level redistribution layer
Grant 8,049,323 - Chen , et al. November 1, 2 | 2011-11-01 |
Thermally enhanced wafer level package
Grant 8,039,315 - Lee , et al. October 18, 2 | 2011-10-18 |
Scribe line layout design
Grant 7,952,167 - Lee , et al. May 31, 2 | 2011-05-31 |
Multi-project Wafer And Method Of Making Same
App 20110049516 - CHENG; William ; et al. | 2011-03-03 |
Bonding Structures And Methods Of Forming Bonding Structures
App 20110042827 - LU; Szu Wei ; et al. | 2011-02-24 |
Method Of Forming Electrical Connections
App 20110027944 - LIU; Chung-Shi ; et al. | 2011-02-03 |
Interconnect Structures Having Lead-Free Solder Bumps
App 20100314756 - Lii; Mirng-Ji ; et al. | 2010-12-16 |
Bonding structures and methods of forming bonding structures
Grant 7,851,331 - Lu , et al. December 14, 2 | 2010-12-14 |
Multi-project wafer and method of making same
Grant 7,851,272 - Cheng , et al. December 14, 2 | 2010-12-14 |
Stratified underfill method for an IC package
Grant 7,846,769 - Lii , et al. December 7, 2 | 2010-12-07 |
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