loadpatents
Patent applications and USPTO patent grants for Liang; Jin-Lin.The latest application filed is for "method of forming shallow trench isolation structure".
Patent | Date |
---|---|
Method of forming shallow trench isolation structure Grant 9,368,387 - Yu , et al. June 14, 2 | 2016-06-14 |
Method Of Forming Shallow Trench Isolation Structure App 20160005669 - YU; Tai-Yung ;   et al. | 2016-01-07 |
Silicon wafer reclamation process Grant 8,696,930 - Yu , et al. April 15, 2 | 2014-04-15 |
Control Wafer Reclamation Process App 20110223767 - Liang; Jin-Lin ;   et al. | 2011-09-15 |
Method and system for improving wet chemical bath process stability and productivity in semiconductor manufacturing Grant 7,910,014 - Yu , et al. March 22, 2 | 2011-03-22 |
Silicon Wafer Reclamation Process App 20110062375 - Yu; Tai-Yung ;   et al. | 2011-03-17 |
Method Of Forming Shallow Trench Isolation Structure App 20110014726 - YU; Tai-Yung ;   et al. | 2011-01-20 |
Silicon wafer reclamation process Grant 7,851,374 - Yu , et al. December 14, 2 | 2010-12-14 |
Control Wafer Reclamation Process App 20090233447 - Liang; Jin-Lin ;   et al. | 2009-09-17 |
Silicon Wafer Reclamation Process App 20090111269 - Yu; Tai-Yung ;   et al. | 2009-04-30 |
Method And System For Improving Wet Chemical Bath Process Stability And Productivity In Semiconductor Manufacturing App 20090087929 - Yu; Tai-Yung ;   et al. | 2009-04-02 |
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