| Patent | Date |
|---|
Liquid crystal alignment agent, liquid crystal alignment film and liquid crystal display element
Grant 11,453,826 - Xie , et al. September 27, 2 | 2022-09-27 |
Refrigerator
App 20220275675 - HUI; Bin ; et al. | 2022-09-01 |
Near Tier Decoupling Capacitors
App 20220271005 - Arvin; Charles Leon ; et al. | 2022-08-25 |
Optimized weight heat spreader for an electronic package
Grant 11,410,905 - Sikka , et al. August 9, 2 | 2022-08-09 |
Polygon integrated circuit (IC) packaging
Grant 11,410,894 - Arvin , et al. August 9, 2 | 2022-08-09 |
Control Method For Drawer Door Of Refrigerator And Refrigerator
App 20220214102 - HUI; Bin ; et al. | 2022-07-07 |
Liquid Crystal Alignment Agent, Liquid Crystal Alignment Film And Liquid Crystal Display Element
App 20220204854 - XIE; Wanlong ; et al. | 2022-06-30 |
Fatigue Failure Resistant Eletronic Package
App 20220157685 - Sikka; Kamal K. ; et al. | 2022-05-19 |
Aquatic weed planting plate for aquarium
Grant 11,304,378 - Jin , et al. April 19, 2 | 2022-04-19 |
Laminated stiffener to control the warpage of electronic chip carriers
Grant 11,302,651 - Sikka , et al. April 12, 2 | 2022-04-12 |
Asymmetric Die Bonding
App 20220093556 - Sakuma; Katsuyuki ; et al. | 2022-03-24 |
Hybrid TIMs for electronic package cooling
Grant 11,264,306 - Sikka , et al. March 1, 2 | 2022-03-01 |
High Bandwidth Module
App 20220059499 - Arvin; Charles Leon ; et al. | 2022-02-24 |
High bandwidth module
Grant 11,201,136 - Arvin , et al. December 14, 2 | 2021-12-14 |
Tamper-respondent assembly with structural material within sealed inner compartment
Grant 11,191,155 - Zhang , et al. November 30, 2 | 2021-11-30 |
High Bandwidth Module
App 20210288025 - Arvin; Charles Leon ; et al. | 2021-09-16 |
Active control of electronic package warpage
Grant 11,121,096 - Sakuma , et al. September 14, 2 | 2021-09-14 |
Door-in-door having display screen assembly and refrigerator having the same
Grant 11,098,946 - Liu , et al. August 24, 2 | 2021-08-24 |
Chip Corner Guard For Chip-package Interaction Failure Mitigation
App 20210233824 - Li; Shidong ; et al. | 2021-07-29 |
Lid/heat Spreader Having Targeted Flexibility
App 20210233825 - LI; SHIDONG ; et al. | 2021-07-29 |
Circuit Substrate With Mixed Pitch Wiring
App 20210183753 - Sakuma; Katsuyuki ; et al. | 2021-06-17 |
Mitigating Moisture-driven Degradation Of Features Designed To Prevent Structural Failure Of Semiconductor Wafers
App 20210118819 - IRUVANTI; SUSHUMNA ; et al. | 2021-04-22 |
Heterogeneous Lid Seal Band for Structural Stability in Multiple Integrated Circuit (IC) Device Modules
App 20210111093 - Sinha; Tuhin ; et al. | 2021-04-15 |
HYBRID TIMs FOR ELECTRONIC PACKAGE COOLING
App 20210098334 - Sikka; Kamal K. ; et al. | 2021-04-01 |
Polygon Integrated Circuit (ic) Packaging
App 20210074599 - Arvin; Charles L. ; et al. | 2021-03-11 |
Multiple chip carrier for bridge assembly
Grant 10,916,507 - Arvin , et al. February 9, 2 | 2021-02-09 |
Refrigerator And Control Method Thereof
App 20210025637 - LIU; MINGYONG ; et al. | 2021-01-28 |
Door-in-door Having Display Screen Assembly And Refrigerator Having The Same
App 20210018252 - LIU; MINGYONG ; et al. | 2021-01-21 |
Mitigating moisture-driven degradation of features designed to prevent structural failure of semiconductor wafers
Grant 10,892,233 - Iruvanti , et al. January 12, 2 | 2021-01-12 |
Surface light source assembly and refrigerator having the same
Grant 10,877,202 - Tang , et al. December 29, 2 | 2020-12-29 |
Aquatic Weed Planting Plate For Aquarium
App 20200352108 - Jin; Xin ; et al. | 2020-11-12 |
Heterogeneous thermal interface material for corner and or edge degradation mitigation
Grant 10,804,181 - Interrante , et al. October 13, 2 | 2020-10-13 |
Active Control Of Electronic Package Warpage
App 20200303322 - Sakuma; Katsuyuki ; et al. | 2020-09-24 |
Optimized Weight Heat Spreader For An Electronic Package
App 20200303279 - Sikka; Kamal K. ; et al. | 2020-09-24 |
Heterogeneous Thermal Interface Material for Corner and or Edge Degradation Mitigation
App 20200294880 - Interrante; Marcus E. ; et al. | 2020-09-17 |
Reduced-warpage laminate structure
Grant 10,685,919 - Lamorey , et al. | 2020-06-16 |
Multiple Chip Carrier For Bridge Assembly
App 20200176383 - Arvin; Charles L. ; et al. | 2020-06-04 |
Surface Light Source Assembly And Refrigerator Having The Same
App 20200142122 - TANG; HAIDONG ; et al. | 2020-05-07 |
Mitigating Moisture-driven Degradation Of Features Designed To Prevent Structural Failure Of Semiconductor Wafers
App 20200135662 - IRUVANTI; SUSHUMNA ; et al. | 2020-04-30 |
Integrated Circuit Chip Carrier with In-Plane Thermal Conductance Layer
App 20200135701 - Li; Shidong ; et al. | 2020-04-30 |
Method of forming an electronic package
Grant 10,636,746 - Sikka , et al. | 2020-04-28 |
Step pyramid shaped structure to reduce dicing defects
Grant 10,636,750 - Li , et al. | 2020-04-28 |
Step Pyramid Shaped Structure To Reduce Dicing Defects
App 20200118942 - Li; Shidong ; et al. | 2020-04-16 |
Reduction of laminate failure in integrated circuit (IC) device carrier
Grant 10,607,928 - Call , et al. | 2020-03-31 |
Lid attach optimization to limit electronic package warpage
Grant 10,593,564 - Iruvanti , et al. | 2020-03-17 |
Integrated Circuit Chip Carrier with In-Plane Thermal Conductance Layer
App 20200066680 - Li; Shidong ; et al. | 2020-02-27 |
Integrated circuit chip carrier with in-plane thermal conductance layer
Grant 10,566,313 - Li , et al. Feb | 2020-02-18 |
Cognitive Tool For Teaching Generlization Of Objects To A Person
App 20200051447 - Tunga; Krishna R. ; et al. | 2020-02-13 |
Laminated Stiffener To Control The Warpage Of Electronic Chip Carriers
App 20200013732 - Sikka; Kamal K. ; et al. | 2020-01-09 |
Interposer with lattice construction and embedded conductive metal structures
Grant 10,460,956 - Audet , et al. Oc | 2019-10-29 |
Laminated Stiffener To Control The Warpage Of Electronic Chip Carriers
App 20190267332 - SIKKA; Kamal K. ; et al. | 2019-08-29 |
Test cell for laminate and method
Grant 10,381,276 - Iruvanti , et al. A | 2019-08-13 |
Lid attach optimization to limit electronic package warpage
Grant 10,332,813 - Iruvanti , et al. | 2019-06-25 |
Assessing And Minimizing Integrated Circuit (ic) Chip Warpage During Manufacturing And Use
App 20190120708 - Kothandaraman; Chandrasekharan ; et al. | 2019-04-25 |
Test cell for laminate and method
Grant 10,249,548 - Iruvanti , et al. | 2019-04-02 |
Lid attach optimization to limit electronic package warpage
Grant 10,083,886 - Iruvanti , et al. September 25, 2 | 2018-09-25 |
Packaging for high speed chip to chip communication
Grant 10,083,919 - Li September 25, 2 | 2018-09-25 |
Limiting electronic package warpage
Grant 10,056,268 - Li August 21, 2 | 2018-08-21 |
Lid Attach Optimization To Limit Electronic Package Warpage
App 20180233381 - Iruvanti; Sushumna ; et al. | 2018-08-16 |
Lid attach optimization to limit electronic package warpage
Grant 10,049,896 - Iruvanti , et al. August 14, 2 | 2018-08-14 |
Packaging for high speed chip to chip communication
Grant 9,953,935 - Li April 24, 2 | 2018-04-24 |
Lid attach optimization to limit electronic package warpage
Grant 9,947,603 - Iruvanti , et al. April 17, 2 | 2018-04-17 |
Test Cell For Laminate And Method
App 20180076101 - Iruvanti; Sushumna ; et al. | 2018-03-15 |
Lid Attach Optimization To Limit Electronic Package Warpage
App 20180068916 - Iruvanti; Sushumna ; et al. | 2018-03-08 |
Lid Attach Optimization To Limit Electronic Package Warpage
App 20180068917 - Iruvanti; Sushumna ; et al. | 2018-03-08 |
Packaging For High Speed Chip To Chip Communication
App 20180061778 - Li; Shidong | 2018-03-01 |
Limiting Electronic Package Warpage
App 20180047590 - Li; Shidong | 2018-02-15 |
Limiting electronic package warpage with semiconductor chip lid and lid-ring
Grant 9,892,935 - Li February 13, 2 | 2018-02-13 |
Laminate substrates having radial cut metallic planes
Grant 9,818,682 - Blackshear , et al. November 14, 2 | 2017-11-14 |
Use of gelatin or deeply processed gelatin materials in preparation of hair quality-improving compositions
Grant 9,775,794 - Zhou , et al. October 3, 2 | 2017-10-03 |
Packaging For High Speed Chip To Chip Communication
App 20170179047 - Li; Shidong | 2017-06-22 |
Test Cell For Laminate And Method
App 20170178982 - Iruvanti; Sushumna ; et al. | 2017-06-22 |
Lid Attach Optimization To Limit Electronic Package Warpage
App 20170170086 - Iruvanti; Sushumna ; et al. | 2017-06-15 |
Lid Attach Optimization To Limit Electronic Package Warpage
App 20170170030 - Iruvanti; Sushumna ; et al. | 2017-06-15 |
Packaging For High Speed Chip To Chip Communication
App 20170162517 - Li; Shidong | 2017-06-08 |
Interposer with lattice construction and embedded conductive metal structures
Grant 9,673,064 - Audet , et al. June 6, 2 | 2017-06-06 |
Packaging for high speed chip to chip communication
Grant 9,666,539 - Li May 30, 2 | 2017-05-30 |
Reduced-warpage Laminate Structure
App 20170148749 - Lamorey; Mark C. ; et al. | 2017-05-25 |
Reduced-warpage laminate structure
Grant 9,613,915 - Lamorey , et al. April 4, 2 | 2017-04-04 |
Reduced-warpage laminate structure
Grant 9,543,255 - Lamorey , et al. January 10, 2 | 2017-01-10 |
Interposer With Lattice Construction And Embedded Conductive Metal Structures
App 20160372337 - Audet; Jean ; et al. | 2016-12-22 |
Limiting Electronic Package Warpage
App 20160351467 - Li; Shidong | 2016-12-01 |
Method to achieve ultra-high chip-to-chip alignment accuracy for wafer-to-wafer bonding process
Grant 9,466,538 - Skordas , et al. October 11, 2 | 2016-10-11 |
Interposer with lattice construction and embedded conductive metal structures
Grant 9,443,799 - Audet , et al. September 13, 2 | 2016-09-13 |
Use Of Gelatin Or Deeply Processed Gelatin Materials In Preparation Of Hair Quality-improving Compositions
App 20160213591 - Zhou; Xiangshan ; et al. | 2016-07-28 |
Interposer With Lattice Construction And Embedded Conductive Metal Structures
App 20160172288 - Audet; Jean ; et al. | 2016-06-16 |
Interposer With Lattice Construction And Embedded Conductive Metal Structures
App 20160172290 - Audet; Jean ; et al. | 2016-06-16 |
Laminate Substrates Having Radial Cut Metallic Planes
App 20160163611 - Blackshear; Edmund ; et al. | 2016-06-09 |
Reduced-warpage Laminate Structure
App 20160155708 - Lamorey; Mark C. ; et al. | 2016-06-02 |
Reduced-warpage Laminate Structure
App 20160157357 - Lamorey; Mark C. ; et al. | 2016-06-02 |
Electronic module assembly with patterned adhesive array
Grant 9,293,439 - Blackshear , et al. March 22, 2 | 2016-03-22 |
Electronic module assembly with patterned adhesive array
Grant 9,093,563 - Blackshear , et al. July 28, 2 | 2015-07-28 |
Multichip module with stiffening frame and associated covers
Grant 9,089,052 - Li , et al. July 21, 2 | 2015-07-21 |
Multichip module with stiffening frame and associated covers
Grant 9,089,051 - Li , et al. July 21, 2 | 2015-07-21 |
Electronic Module Assembly With Patterned Adhesive Array
App 20150093859 - Blackshear; Edmund ; et al. | 2015-04-02 |
Multichip Module With Stiffening Frame And Associated Covers
App 20150077944 - Li; Shidong ; et al. | 2015-03-19 |
Maintaining laminate flatness using magnetic retention during chip joining
Grant 8,940,550 - Fasano , et al. January 27, 2 | 2015-01-27 |
Electronic Module Assembly With Patterned Adhesive Array
App 20150014836 - Blackshear; Edmund ; et al. | 2015-01-15 |
Multichip Module With Stiffing Frame And Associated Covers
App 20150001701 - Li; Shidong ; et al. | 2015-01-01 |
Method and apparatus for constructing general wireless antenna systems
Grant 7,446,728 - Li November 4, 2 | 2008-11-04 |
Methods and apparatus for data and signal encryption and decryption by irregular subspace leaping
App 20070223686 - Li; Shidong | 2007-09-27 |
Method and apparatus for constructing general wireless antenna systems
App 20070188378 - Li; Shidong | 2007-08-16 |
Method for constructing mobile wireless antenna systems
Grant 6,911,954 - Li June 28, 2 | 2005-06-28 |
Method for constructing mobile wireless antenna systems
App 20030073465 - Li, Shidong | 2003-04-17 |
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