LI; Fu-Jen
Patent Applications and Registrations
Patent applications and USPTO patent grants for LI; Fu-Jen.The latest application filed is for "semiconductor device package with warpage control structure".
- LI; Fu-Jen - Hsinchu City TW
- Li; Fu-Jen - Hsinchu TW
- Li; Fu-Jen - Hsin-Chu TW
| Patent | Date |
|---|---|
| Semiconductor Device Package With Warpage Control Structure App 20220262746 - YEW; Ming-Chih ; et al. | 2022-08-18 |
| Semiconductor device package with warpage control structure Grant 11,329,006 - Yew , et al. May 10, 2 | 2022-05-10 |
| Semiconductor Packages And Method Of Manufacturing The Same App 20220122909 - Tseng; Shu-Jung ; et al. | 2022-04-21 |
| Methods for selectively forming identification mark on semiconductor wafer Grant 11,121,093 - Peng , et al. September 14, 2 | 2021-09-14 |
| Packages with multi-thermal interface materials and methods of fabricating the same Grant 11,088,109 - Lin , et al. August 10, 2 | 2021-08-10 |
| Semiconductor Device Package With Warpage Control Structure App 20200312790 - YEW; Ming-Chih ; et al. | 2020-10-01 |
| Semiconductor device package with warpage control structure Grant 10,685,920 - Yew , et al. | 2020-06-16 |
| Packages With Multi-thermal Interface Materials And Methods Of Fabricating The Same App 20200161275 - LIN; Chih-Hao ; et al. | 2020-05-21 |
| Mini identification mark in die-less region of semiconductor wafer Grant 10,643,951 - Peng , et al. | 2020-05-05 |
| Mini Identification Mark App 20200013726 - Peng; Yue-Lin ; et al. | 2020-01-09 |
| Mini Identification Mark App 20190019760 - Peng; Yue-Lin ; et al. | 2019-01-17 |
| Package-on-package structure with through molding via Grant 10,008,480 - Yew , et al. June 26, 2 | 2018-06-26 |
| Semiconductor Device Package With Warpage Control Structure App 20180082961 - YEW; Ming-Chih ; et al. | 2018-03-22 |
| Package-on-Package Structure with Through Molding Via App 20180026014 - Yew; Ming-Chih ; et al. | 2018-01-25 |
| Semiconductor device package with warpage control structure Grant 9,831,190 - Yew , et al. November 28, 2 | 2017-11-28 |
| Package-on-package structure with through molding via Grant 9,780,076 - Yew , et al. October 3, 2 | 2017-10-03 |
| Package-on-Package Structure with Through Molding Via App 20170069605 - Yew; Ming-Chih ; et al. | 2017-03-09 |
| Electrical connection for chip scale packaging Grant 9,548,281 - Yew , et al. January 17, 2 | 2017-01-17 |
| 3D packages and methods for forming the same Grant 9,543,284 - Yew , et al. January 10, 2 | 2017-01-10 |
| Electrical connection for chip scale packaging Grant 9,515,038 - Yew , et al. December 6, 2 | 2016-12-06 |
| Package-on-package structure with through molding via Grant 9,502,387 - Yew , et al. November 22, 2 | 2016-11-22 |
| Package-on-Package Structure with Through Molding Via App 20160118369 - Yew; Ming-Chih ; et al. | 2016-04-28 |
| 3D Packages and Methods for Forming the Same App 20160111409 - Yew; Ming-Chih ; et al. | 2016-04-21 |
| 3D packages and methods for forming the same Grant 9,252,076 - Yew , et al. February 2, 2 | 2016-02-02 |
| Package-on-package structure with through molding via Grant 9,237,647 - Yew , et al. January 12, 2 | 2016-01-12 |
| Electrical Connection for Chip Scale Packaging App 20150235976 - Yew; Ming-Chih ; et al. | 2015-08-20 |
| Electrical connection for chip scale packaging Grant 9,087,882 - Yew , et al. July 21, 2 | 2015-07-21 |
| Semiconductor Device Package With Warpage Control Structure App 20150194389 - Yew; Ming-Chih ; et al. | 2015-07-09 |
| Package-on-Package Structure with Through Molding Via App 20150070865 - Yew; Ming-Chih ; et al. | 2015-03-12 |
| 3D Packages and Methods for Forming the Same App 20150041987 - Yew; Ming-Chih ; et al. | 2015-02-12 |
| Semiconductor device package and method Grant 8,901,732 - Yew , et al. December 2, 2 | 2014-12-02 |
| Semiconductor Device Package and Method App 20140264815 - Yew; Ming-Chih ; et al. | 2014-09-18 |
| Electrical Connection for Chip Scale Packaging App 20140113447 - Yew; Ming-Chih ; et al. | 2014-04-24 |
| Electrical connection for chip scale packaging Grant 8,624,392 - Yew , et al. January 7, 2 | 2014-01-07 |
| Electrical Connection for Chip Scale Packaging App 20130087892 - Yew; Ming-Chih ; et al. | 2013-04-11 |
| Electrical Connection for Chip Scale Packaging App 20120306070 - Yew; Ming-Chih ; et al. | 2012-12-06 |
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