Lewandowski; Eric P.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lewandowski; Eric P..The latest application filed is for "permanent wafer handlers with through silicon vias for thermalization and qubit modification".

Company Profile

10.21.24

Lewandowski; Eric P. - White Plains NY
Lewandowski; Eric P - Morristown NJ
Lewandowski; Eric P. - Morristown NJ
Lewandowski; Eric P - White Plains NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Permanent wafer handlers with through silicon vias for thermalization and qubit modification Grant 11,158,781 - Nah , et al. October 26, 2	2021-10-26
Permanent Wafer Handlers With Through Silicon Vias For Thermalization And Qubit Modification App 20210159382 - Nah; Jae-Woong ; et al.	2021-05-27
Delivery device including reactive material for programmable discrete delivery of a substance Grant 10,881,788 - Dang , et al. January 5, 2	2021-01-05
Stud bumps for post-measurement qubit frequency modification Grant 10,692,831 - Bronn , et al.	2020-06-23
Cathode for thin film microbattery Grant 10,686,164 - Andry , et al.	2020-06-16
Two-component bump metallization Grant 10,629,797 - Abraham , et al.	2020-04-21
Method of forming a homogeneous solid metallic anode for a thin film microbattery Grant 10,622,590 - Andry , et al.	2020-04-14
Two-component bump metallization Grant 10,608,158 - Abraham , et al.	2020-03-31
Method for forming solder bumps using sacrificial layer Grant 10,535,592 - Lewandowski , et al. Ja	2020-01-14
Two-component Bump Metallization App 20190131510 - Abraham; David W. ; et al.	2019-05-02
Two-component Bump Metallization App 20190103542 - Abraham; David W. ; et al.	2019-04-04
Molten Solder Injection Head with Vacuum Filter and Differential Gauge System App 20190091786 - Nah; Jae-Woong ; et al.	2019-03-28
Homogeneous Solid Metallic Anode For Thin Film Microbattery App 20190019997 - Andry; Paul S. ; et al.	2019-01-17
Cathode For Thin Film Microbattery App 20180331329 - Andry; Paul S. ; et al.	2018-11-15
Homogeneous solid metallic anode for thin film microbattery Grant 10,096,802 - Andry , et al. October 9, 2	2018-10-09
Cathode for thin film microbattery Grant 10,069,116 - Andry , et al. September 4, 2	2018-09-04
Method For Forming Solder Bumps Using Sacrificial Layer App 20180218971 - Lewandowski; Eric P. ; et al.	2018-08-02
Method For Forming Solder Bumps Using Sacrificial Layer App 20180218970 - Lewandowski; Eric P. ; et al.	2018-08-02
Method for forming solder bumps using sacrificial layer Grant 9,953,908 - Lewandowski , et al. April 24, 2	2018-04-24
Cathode For Thin Film Microbattery App 20180040859 - Andry; Paul S. ; et al.	2018-02-08
Cathode for thin film microbattery Grant 9,806,299 - Andry , et al. October 31, 2	2017-10-31
Controlling fragmentation of chemically strengthened glass Grant 9,738,560 - Cabral, Jr. , et al. August 22, 2	2017-08-22
Method For Forming Solder Bumps Using Sacrificial Layer App 20170125329 - Lewandowski; Eric P. ; et al.	2017-05-04
Delivery Device Including Reactive Material For Programmable Discrete Delivery Of A Substance App 20170119960 - DANG; BING ; et al.	2017-05-04
Controlling fragmentation of chemically strengthened glass Grant 9,586,857 - Cabral, Jr. , et al. March 7, 2	2017-03-07
Wafer level overmold for three dimensional surfaces Grant 9,508,566 - Andry , et al. November 29, 2	2016-11-29
Thin, flexible microsystem with integrated energy source Grant 9,472,789 - Andry , et al. October 18, 2	2016-10-18
Controlling Fragmentation Of Chemically Strengthened Glass App 20160264456 - Cabral, JR.; Cyril ; et al.	2016-09-15
Controlling Fragmentation Of Chemically Strengthened Glass App 20160137548 - Cabral, JR.; Cyril ; et al.	2016-05-19
Injection of a filler material with homogeneous distribution of anisotropic filler particles through implosion Grant 9,321,245 - Gaynes , et al. April 26, 2	2016-04-26
Wafer Level Overmold for Three Dimensional Surfaces App 20160049344 - Andry; Paul S. ; et al.	2016-02-18
Low alpha particle emission electrically-conductive coating Grant 9,181,440 - Gaynes , et al. November 10, 2	2015-11-10
Cathode For Thin Film Microbattery App 20150288023 - Andry; Paul S. ; et al.	2015-10-08
Homogeneous Solid Metallic Anode For Thin Film Microbattery App 20150288024 - Andry; Paul S. ; et al.	2015-10-08
Thin, Flexible Microsystem With Integrated Energy Source App 20150287960 - Andry; Paul S. ; et al.	2015-10-08
Reactive Bonding Of A Flip Chip Package App 20150137366 - Fritz; Gregory M. ; et al.	2015-05-21
Reactive bonding of a flip chip package Grant 8,987,130 - Fritz , et al. March 24, 2	2015-03-24
Injection Of A Filler Material With Homogeneous Distribution Of Anisotropic Filler Particles Through Implosion App 20140377572 - Gaynes; Michael A. ; et al.	2014-12-25
Injection Of A Filler Material With Homogeneous Distribution Of Anisotropic Filler Particles Through Implosion App 20140377571 - Gaynes; Michael A. ; et al.	2014-12-25
Low alpha particle emission electrically-conductive coating Grant 8,815,725 - Gaynes , et al. August 26, 2	2014-08-26
Low Alpha Particle Emission Electrically-conductive Coating App 20140203427 - Gaynes; Michael A. ; et al.	2014-07-24
Low Alpha Particle Emission Electrically-conductive Coating App 20140205780 - Gaynes; Michael A. ; et al.	2014-07-24
Reactive Bonding Of A Flip Chip Package App 20130320529 - Fritz; Gregory M. ; et al.	2013-12-05

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