Levine; Ernest N.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Levine; Ernest N..The latest application filed is for "dual damascene interconnect structure using low stress fluorosilicate insulator with copper conductors".

Company Profile

0.5.3

Levine; Ernest N. - Poughkeepsie NY
LEVINE, ERNEST N - POUGHKEEPSIE NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Dual damascene interconnect structure using low stress fluorosilicate insulator with copper conductors Grant 7,034,400 - Barth , et al. April 25, 2	2006-04-25
Dual damascene interconnect structure using low stress fluorosilicate insulator with copper conductors App 20040061235 - Barth, Edward P. ; et al.	2004-04-01
Dual Damascene Interconnect Structure Using Low Stress Flourosilicate Insulator With Copper Conductors App 20020076917 - BARTH, EDWARD P ; et al.	2002-06-20
Metal deposition process for metal lines over topography App 20020017726 - Dave, Parth P. ; et al.	2002-02-14
Micro-surface fabrication process Grant 6,335,151 - Ausschnitt , et al. January 1, 2	2002-01-01
Low temperature via fill using liquid phase transport Grant 6,177,348 - Gambino , et al. January 23, 2	2001-01-23
Integrated circuit having crack stop for interlevel dielectric layers Grant 6,091,131 - Cook , et al. July 18, 2	2000-07-18
Energy relieving crack stop Grant 5,834,829 - Dinkel , et al. November 10, 1	1998-11-10

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