| Patent | Date |
|---|
Package Structure, Electronic Device And Method For Manufacturing Package Structure
App 20220157742 - LEE; Yu-Ying | 2022-05-19 |
Semiconductor Device Package And A Method Of Manufacturing The Same
App 20220123192 - Wu; Mei-Yi ; et al. | 2022-04-21 |
Semiconductor device package and a method of manufacturing the same
Grant 11,211,536 - Wu , et al. December 28, 2 | 2021-12-28 |
Substrate, semiconductor package thereof and process of making same
Grant 10,879,159 - Chen , et al. December 29, 2 | 2020-12-29 |
Semiconductor Device Package
App 20200350239 - LEE; Yu-Ying | 2020-11-05 |
Semiconductor Device Package And A Method Of Manufacturing The Same
App 20200259058 - A1 | 2020-08-13 |
Semiconductor device package
Grant 10,741,482 - Lee A | 2020-08-11 |
Semiconductor package device having glass transition temperature greater than binding layer temperature
Grant 10,734,337 - Chen , et al. | 2020-08-04 |
Semiconductor device package and a method of manufacturing the same
Grant 10,665,765 - Wu , et al. | 2020-05-26 |
Substrate having a conductive structure within photo-sensitive resin
Grant 10,515,884 - Chen , et al. Dec | 2019-12-24 |
Embedded trace substrate structure and semiconductor package structure including the same
Grant 10,483,196 - Lee Nov | 2019-11-19 |
Semiconductor device package with a conductive post
Grant 10,446,411 - Chen , et al. Oc | 2019-10-15 |
Semiconductor Device Package
App 20190206775 - LEE; Yu-Ying | 2019-07-04 |
Semiconductor Package Device And Method Of Manufacturing The Same
App 20190198469 - CHEN; Kuang-Hsiung ; et al. | 2019-06-27 |
Semiconductor package device having glass transition temperature greater than binding layer temperature
Grant 10,224,298 - Chen , et al. | 2019-03-05 |
Semiconductor Device Package And A Method Of Manufacturing The Same
App 20180350626 - CHEN; Tien-Szu ; et al. | 2018-12-06 |
Semiconductor package structure and fabrication method thereof
Grant 10,103,110 - Chen , et al. October 16, 2 | 2018-10-16 |
Substrate Structure, Semiconductor Package Structure And Method For Manufacturing The Same
App 20180240745 - LEE; Yu-Ying | 2018-08-23 |
Semiconductor Device Package And A Method Of Manufacturing The Same
App 20180233643 - WU; Mei-Yi ; et al. | 2018-08-16 |
Semiconductor device with a conductive post
Grant 10,049,893 - Chen , et al. August 14, 2 | 2018-08-14 |
Semiconductor substrate and manufacturing method thereof
Grant 10,049,976 - Chen , et al. August 14, 2 | 2018-08-14 |
Semiconductor substrate structure, semiconductor package and method of manufacturing the same
Grant 10,002,843 - Chen , et al. June 19, 2 | 2018-06-19 |
Semiconductor substrate and semiconductor package structure
Grant 9,984,989 - Chen , et al. May 29, 2 | 2018-05-29 |
Semiconductor Package Structure And Fabrication Method Thereof
App 20180145037 - CHEN; Tien-Szu ; et al. | 2018-05-24 |
Semiconductor Package Device And Method Of Manufacturing The Same
App 20180068962 - CHEN; Kuang-Hsiung ; et al. | 2018-03-08 |
Semiconductor package structure and fabrication method thereof
Grant 9,911,702 - Chen , et al. March 6, 2 | 2018-03-06 |
Semiconductor Device Package And A Method Of Manufacturing The Same
App 20170330870 - CHEN; Tien-Szu ; et al. | 2017-11-16 |
Semiconductor Substrate Structure, Semiconductor Package And Method Of Manufacturing The Same
App 20160284659 - CHEN; Tien-Szu ; et al. | 2016-09-29 |
Semiconductor Substrate Structure, Semiconductor Package And Method Of Manufacturing The Same
App 20160240462 - CHEN; Tien-Szu ; et al. | 2016-08-18 |
Semiconductor Substrate And Manufacturing Method Thereof
App 20160225708 - CHEN; Tien-Szu ; et al. | 2016-08-04 |
Semiconductor Substrate And Semiconductor Package Structure
App 20160079194 - Chen; Tien-Szu ; et al. | 2016-03-17 |
Substrate, Semiconductor Package Thereof And Process Of Making Same
App 20150318235 - CHEN; Tien-Szu ; et al. | 2015-11-05 |
Heat dissipating semiconductor device packages and related methods
Grant 9,054,118 - Chen , et al. June 9, 2 | 2015-06-09 |
Semiconductor Package Structure And Fabrication Method Thereof
App 20140327125 - CHEN; Tien-Szu ; et al. | 2014-11-06 |
Heat Dissipating Semiconductor Device Packages And Related Methods
App 20140308778 - Chen; Kuang-Hsiung ; et al. | 2014-10-16 |
Heat dissipating semiconductor device packages
Grant 8,779,581 - Chen , et al. July 15, 2 | 2014-07-15 |
Semiconductor device packages with protective layer and related methods
Grant 8,592,962 - Chen , et al. November 26, 2 | 2013-11-26 |
Heat Dissipating Semiconductor Device Packages And Related Methods
App 20120112338 - Chen; Kuang-Hsiung ; et al. | 2012-05-10 |
Semiconductor Device Packages With Protective Layer And Related Methods
App 20120104584 - Chen; Kuang-Hsiung ; et al. | 2012-05-03 |
| 