loadpatents
name:-0.0093460083007812
name:-0.0049130916595459
name:-0.00059604644775391
LEE; Young-Gue Patent Filings

LEE; Young-Gue

Patent Applications and Registrations

Patent applications and USPTO patent grants for LEE; Young-Gue.The latest application filed is for "chip package".

Company Profile
0.4.8
  • LEE; Young-Gue - Kyunggi-Do KR
  • Lee; Young Gue - Seoul KR
  • Lee; Young Gue - Seoul-si KR
  • Lee; Young-Gue - Paju-si KR
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Chip Package
App 20140346654 - CHOI; Soo-Min ;   et al.
2014-11-27
Chip package
Grant 8,866,280 - Choi , et al. October 21, 2
2014-10-21
Stacked semiconductor package assembly having hollowed substrate
Grant 7,964,952 - Lee June 21, 2
2011-06-21
Chip Package
App 20090261470 - Choi; Soo-Min ;   et al.
2009-10-22
Stacked Semiconductor Package Assembly Having Hollowed Substrate
App 20090179319 - Lee; Young Gue
2009-07-16
Stacked semiconductor package assembly having hollowed substrate
Grant 7,528,474 - Lee May 5, 2
2009-05-05
Package structure and manufacturing method thereof
App 20080237821 - Kim; Hyeongno ;   et al.
2008-10-02
Package structure and method of manufacturing the same
App 20080237820 - Kim; Hyeongno ;   et al.
2008-10-02
Package structure and manufacturing method thereof
App 20080197468 - Kim; Hyeongno ;   et al.
2008-08-21
Chip Package And Fabricating Process Thereof
App 20080128890 - CHOI; SOO-MIN ;   et al.
2008-06-05
Stacked Semiconductor Package Assembly Having Hollowed Substrate
App 20060267175 - Lee; Young Gue
2006-11-30

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