loadpatents
Patent applications and USPTO patent grants for Lee; Yongkoon.The latest application filed is for "semiconductor package".
Patent | Date |
---|---|
Semiconductor Package App 20220262748 - KANG; Myungsam ;   et al. | 2022-08-18 |
Semiconductor package Grant 11,329,014 - Kang , et al. May 10, 2 | 2022-05-10 |
Semiconductor Package And Method Of Manufacturing The Semiconductor Package App 20220102309 - Lee; Sangkyu ;   et al. | 2022-03-31 |
Semiconductor Package Including Heat Spreader Layer App 20220102236 - Kim; Jingu ;   et al. | 2022-03-31 |
Semiconductor Package Including Antenna App 20220051996 - Lee; Yongkoon ;   et al. | 2022-02-17 |
Semiconductor Packages And Method Of Manufacturing Semiconductor Packages App 20220006173 - LEE; Yongkoon ;   et al. | 2022-01-06 |
Semiconductor Package App 20210398923 - KANG; Myungsam ;   et al. | 2021-12-23 |
Semiconductor Package App 20200312797 - KANG; Myungsam ;   et al. | 2020-10-01 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.