Lee; Wei Ti

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lee; Wei Ti.The latest application filed is for "xps metrology for process control in selective deposition".

Company Profile

9.38.38

Lee; Wei Ti - San Jose CA
Lee; Wei Ti - Albany NY
LEE; WEI TI - Rubino Circle CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
XPS metrology for process control in selective deposition Grant 11,346,795 - Larson , et al. May 31, 2	2022-05-31
Hybridization for characterization and metrology Grant 11,295,969 - Muthinti , et al. April 5, 2	2022-04-05
Feed-forward of multi-layer and multi-process information using XPS and XRF technologies Grant 11,029,148 - Pois , et al. June 8, 2	2021-06-08
Xps Metrology For Process Control In Selective Deposition App 20210025839 - Larson; Charles Thomas ; et al.	2021-01-28
Feed-forward Of Multi-layer And Multi-process Information Using Xps And Xrf Technologies App 20200370885 - Pois; Heath A. ; et al.	2020-11-26
XPS metrology for process control in selective deposition Grant 10,801,978 - Larson , et al. October 13, 2	2020-10-13
Method And System For Non-destructive Metrology Of Thin Layers App 20200191734 - Lee; Wei Ti ; et al.	2020-06-18
Hybridization For Characterization And Metrology App 20200168489 - MUTHINTI; GANGADHARA RAJA ; et al.	2020-05-28
Feed-forward of multi-layer and multi-process information using XPS and XRF technologies Grant 10,648,802 - Pois , et al.	2020-05-12
Method and system for non-destructive metrology of thin layers Grant 10,533,961 - Lee , et al. Ja	2020-01-14
Feed-forward Of Multi-layer And Multi-process Information Using Xps And Xrf Technologies App 20190360800 - Pois; Heath A. ; et al.	2019-11-28
Xps Metrology For Process Control In Selective Deposition App 20190277783 - Larson; Charles Thomas ; et al.	2019-09-12
Feed-forward Of Multi-layer And Multi-process Information Using Xps And Xrf Technologies App 20190033069 - Pois; Heath A. ; et al.	2019-01-31
Method And System For Non-destructive Metrology Of Thin Layers App 20180328871 - Lee; Wei Ti ; et al.	2018-11-15
Feed-forward of multi-layer and multi-process information using XPS and XRF technologies Grant 10,082,390 - Pois , et al. September 25, 2	2018-09-25
Method And System For Non-destructive Metrology Of Thin Layers App 20180172609 - LEE; Wei Ti ; et al.	2018-06-21
Silicon germanium thickness and composition determination using combined XPS and XRF technologies Grant 9,952,166 - Pois , et al. April 24, 2	2018-04-24
Methods for forming barrier/seed layers for copper interconnect structures Grant 9,926,639 - Kim , et al. March 27, 2	2018-03-27
Resistive switching devices having a switching layer and an intermediate electrode layer and methods of formation thereof Grant 9,818,939 - Jameson, III , et al. November 14, 2	2017-11-14
Silicon Germanium Thickness And Composition Determination Using Combined Xps And Xrf Technologies App 20170176357 - Pois; Heath A. ; et al.	2017-06-22
Feed-Forward of Multi-Layer and Multi-Process Information using XPS and XRF Technologies App 20170160081 - Pois; Heath A. ; et al.	2017-06-08
Silicon germanium thickness and composition determination using combined XPS and XRF technologies Grant 9,594,035 - Pois , et al. March 14, 2	2017-03-14
Gas line weldment design and process for CVD aluminum Grant 9,593,417 - Lee , et al. March 14, 2	2017-03-14
Resistive Switching Devices Having a Switching Layer and an Intermediate Electrode Layer and Methods of Formation Thereof App 20160118585 - Jameson, III; John R. ; et al.	2016-04-28
Programmable Resistance Memory Elements With Electrode Interface Layer And Memory Devices Including The Same App 20160043310 - Gopalan; Chakravarthy ; et al.	2016-02-11
Resistive switching devices having a switching layer and an intermediate electrode layer and methods of formation thereof Grant 9,252,359 - Jameson, III , et al. February 2, 2	2016-02-02
Silicon Germanium Thickness And Composition Determination Using Combined Xps And Xrf Technologies App 20150308969 - Pois; Heath A. ; et al.	2015-10-29
Formation of liner and barrier for tungsten as gate electrode and as contact plug to reduce resistance and enhance device performance Grant 9,129,945 - Lee , et al. September 8, 2	2015-09-08
Solid electrolyte memory elements with electrode interface for improved performance Grant 9,099,633 - Gopalan , et al. August 4, 2	2015-08-04
Programmable memory elements, devices and methods having physically localized structure Grant 8,895,953 - Shields , et al. November 25, 2	2014-11-25
Resistive switching devices having a buffer layer and methods of formation thereof Grant 8,866,122 - Lee , et al. October 21, 2	2014-10-21
Programmable Impedance Memory Elements And Corresponding Methods App 20140293676 - Lee; Wei Ti ; et al.	2014-10-02
Resistive switching devices having alloyed electrodes and methods of formation thereof Grant 8,847,192 - Lee , et al. September 30, 2	2014-09-30
Resistive Switching Devices Having a Switching Layer And An Intermediate Electrode Layer and Methods of Formation Thereof App 20140246641 - Jameson, III; John R. ; et al.	2014-09-04
Gas Line Weldment Design And Process For Cvd Aluminum App 20140053776 - LEE; Wei Ti ; et al.	2014-02-27
Metal gate structures and methods for forming thereof Grant 8,637,390 - Ganguli , et al. January 28, 2	2014-01-28
Solid Electrolyte Memory Elements With Electrode Interface For Improved Performance App 20130285004 - Gopalan; Chakravarthy ; et al.	2013-10-31
Gas line weldment design and process for CVD aluminum Grant 8,535,443 - Lee , et al. September 17, 2	2013-09-17
Chemical Vapor Deposition (cvd) Of Ruthenium Films And Applications For Same App 20130146468 - KIM; HOON ; et al.	2013-06-13
Resistive Switching Devices Having Alloyed Electrodes And Methods of Formation Thereof App 20130062587 - Lee; Wei Ti ; et al.	2013-03-14
Methods For Forming Barrier/seed Layers For Copper Interconnect Structures App 20120012465 - KIM; HOON ; et al.	2012-01-19
Chemical Vapor Deposition Of Ruthenium Films Containing Oxygen Or Carbon App 20110312148 - KIM; HOON ; et al.	2011-12-22
Metal Gate Structures And Methods For Forming Thereof App 20110298062 - GANGULI; SESHADRI ; et al.	2011-12-08
Formation Of Liner And Barrier For Tungsten As Gate Electrode And As Contact Plug To Reduce Resistance And Enhance Device Performance App 20110233778 - Lee; Sang-Hyeob ; et al.	2011-09-29
Aluminum contact integration on cobalt silicide junction Grant 7,867,900 - Lee , et al. January 11, 2	2011-01-11
Unique passivation technique for a CVD blocker plate to prevent particle formation Grant 7,857,947 - Ritchie , et al. December 28, 2	2010-12-28
Substrate Processing System And Methods Thereof App 20100304027 - Lee; Wei Ti ; et al.	2010-12-02
Deposition processes for titanium nitride barrier and aluminum Grant 7,824,743 - Lee , et al. November 2, 2	2010-11-02
Ampoule splash guard apparatus Grant 7,699,295 - Lee , et al. April 20, 2	2010-04-20
Ampoule Splash Guard Apparatus App 20090114157 - LEE; WEI TI ; et al.	2009-05-07
Aluminum Contact Integration On Cobalt Silicide Junction App 20090087983 - LEE; WEI TI ; et al.	2009-04-02
Deposition Processes For Titanium Nitride Barrier And Aluminum App 20090087585 - LEE; WEI TI ; et al.	2009-04-02
Ampoule splash guard apparatus Grant 7,464,917 - Lee , et al. December 16, 2	2008-12-16
Aluminum sputtering while biasing wafer Grant 7,378,002 - Lee , et al. May 27, 2	2008-05-27
Band shield for substrate processing chamber App 20070113783 - Lee; Wei Ti ; et al.	2007-05-24
Ampoule splash guard apparatus App 20070079759 - Lee; Wei Ti ; et al.	2007-04-12
Aluminum sputtering while biasing wafer App 20070045103 - Lee; Wei Ti ; et al.	2007-03-01
Unique Passivation Technique For A Cvd Blocker Plate To Prevent Particle Formation App 20070022952 - Ritchie; Alan A. ; et al.	2007-02-01
Gas Line Weldment Design And Process For Cvd Aluminum App 20070023144 - Lee; Wei Ti ; et al.	2007-02-01
CVD-PVD deposition process Grant 6,716,733 - Lee , et al. April 6, 2	2004-04-06
CVD-PVD deposition process App 20030228746 - Lee, Wei Ti ; et al.	2003-12-11
Plasma-enhanced chemical vapor deposition of a metal nitride layer Grant 6,656,831 - Lee , et al. December 2, 2	2003-12-02
Liner materials Grant 6,528,180 - Lee , et al. March 4, 2	2003-03-04

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