Lee; Ui-Hyoung

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lee; Ui-Hyoung.The latest application filed is for "semiconductor package".

Company Profile

0.7.10

Lee; Ui-Hyoung - Hwaseong-si KR
Lee; Ui-hyoung - Seoul N/A KR
LEE; Ui-hyoung - Hwaseong-City KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Joint structures having organic preservative films Grant 9,082,680 - Choi , et al. July 14, 2	2015-07-14
Semiconductor assembly and semiconductor package including a solder channel Grant 8,710,657 - Park , et al. April 29, 2	2014-04-29
Semiconductor Package App 20130256876 - LEE; Ui-hyoung ; et al.	2013-10-03
Joint Structures Having Organic Preservative Films App 20130000978 - Choi; Ju-Il ; et al.	2013-01-03
Apparatus And Method For Electroplating For Semiconductor Substrate App 20120292195 - LEE; Ui Hyoung ; et al.	2012-11-22
Method For Manufacturing Semiconductor Package And Semiconductor Package Manufactured Using The Same App 20120129333 - YIM; Ha-Young ; et al.	2012-05-24
Through-silicon via structures providing reduced solder spreading and methods of fabricating the same Grant 8,183,673 - Hwang , et al. May 22, 2	2012-05-22
Semiconductor Assembly And Semiconductor Package Including A Solder Channel App 20120086123 - PARK; JEONG-WOO ; et al.	2012-04-12
Method of manufacturing the semiconductor device Grant 8,114,772 - Lee , et al. February 14, 2	2012-02-14
Method of Manufacturing the Semiconductor Device App 20110097891 - Lee; Kyu-Ha ; et al.	2011-04-28
Inductor for a system-on-a-chip and a method for manufacturing the same Grant 7,807,337 - Lee , et al. October 5, 2	2010-10-05
Through-silicon Via Structures Providing Reduced Solder Spreading And Methods Of Fabricating The Same App 20100096753 - Hwang; Son-Kwan ; et al.	2010-04-22
Inductor For A System-on-a-chip And A Method For Manufacturing The Same App 20080102409 - LEE; Hyo-Jong ; et al.	2008-05-01
Methods of fabricating damascene interconnection line in semiconductor devices and semiconductor devices fabricated using such methods App 20070059923 - Lee; Hyo-jong ; et al.	2007-03-15
Inductor for a system-on-a-chip and method for manufacturing the same App 20050116317 - Lee, Hyo-Jong ; et al.	2005-06-02

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