Lee; Teck Kheng

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lee; Teck Kheng.The latest application filed is for "methods of fluxless micro-piercing of solder balls, and resulting devices".

Company Profile

1.74.69

Lee; Teck Kheng - Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Methods of fluxless micro-piercing of solder balls, and resulting devices Grant 10,515,918 - Lee Dec	2019-12-24
Methods Of Fluxless Micro-piercing Of Solder Balls, And Resulting Devices App 20190019774 - Lee; Teck Kheng	2019-01-17
Methods of fluxless micro-piercing of solder balls, and resulting devices Grant 10,163,840 - Lee Dec	2018-12-25
Multilayer structure for a semiconductor device and a method of forming a multilayer structure for a semiconductor device Grant 9,806,013 - Lee , et al. October 31, 2	2017-10-31
Computer systems having an interposer including a flexible material Grant 9,412,677 - Lee August 9, 2	2016-08-09
Multilayer Structure For A Semiconductor Device And A Method Of Forming A Multilayer Structure For A Semiconductor Device App 20160211206 - Lee; Teck Kheng ; et al.	2016-07-21
Microelectronic devices and methods for manufacturing microelectronic devices Grant 9,153,526 - Lee October 6, 2	2015-10-06
Microelectronic devices and microelectronic support devices, and associated assemblies and methods Grant 9,129,862 - Lee , et al. September 8, 2	2015-09-08
Methods Of Fluxless Micro-piercing Of Solder Balls, And Resulting Devices App 20150008577 - Lee; Teck Kheng	2015-01-08
Microelectronic Devices And Methods For Manufacturing Microelectronic Devices App 20140332938 - Lee; Teck Kheng	2014-11-13
Microelectronic Devices And Microelectronic Support Devices, And Associated Assemblies And Methods App 20140326488 - Lee; Teck Kheng ; et al.	2014-11-06
Microelectronic devices and microelectronic support devices, and associated assemblies and methods Grant 8,778,732 - Lee , et al. July 15, 2	2014-07-15
Microelectronic devices and methods for manufacturing microelectronic devices Grant 8,742,572 - Lee June 3, 2	2014-06-03
Methods of fluxless micro-piercing of solder balls, and resulting devices Grant 8,669,173 - Lee March 11, 2	2014-03-11
Microelectronic devices and methods for manufacturing microelectronic devices Grant 8,604,598 - Lee December 10, 2	2013-12-10
Partitioned through-layer via and associated systems and methods Grant 8,536,046 - Lee September 17, 2	2013-09-17
Methods Of Fluxless Micro-piercing Of Solder Balls, And Resulting Devices App 20130234328 - Lee; Teck Kheng	2013-09-12
Microelectronic Devices And Methods For Manufacturing Microelectronic Devices App 20130181356 - Lee; Teck Kheng	2013-07-18
Partitioned Through-layer Via And Associated Systems And Methods App 20130145619 - Lee; Teck Kheng	2013-06-13
Elimination of RDL using tape base flip chip on flex for die stacking Grant 8,441,113 - Lee May 14, 2	2013-05-14
Methods of fluxless micro-piercing of solder balls, and resulting devices Grant 8,436,478 - Lee May 7, 2	2013-05-07
Partitioned through-layer via and associated systems and methods Grant 8,367,538 - Lee February 5, 2	2013-02-05
Microelectronic devices Grant 8,310,048 - Lee November 13, 2	2012-11-13
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices Grant 8,283,761 - Lee , et al. October 9, 2	2012-10-09
Semiconductor device assemblies Grant 8,269,326 - Lee September 18, 2	2012-09-18
Elimination of RDL Using Tape Base Flip Chip on Flex for Die Stacking App 20120153468 - Lee; Teck Kheng	2012-06-21
Microelectronic Devices And Methods For Manufacturing Microelectronic Devices App 20120119344 - Lee; Teck Kheng	2012-05-17
Microelectronic devices and microelectronic support devices, and associated assemblies and methods Grant 8,174,101 - Lee , et al. May 8, 2	2012-05-08
Elimination of RDL using tape base flip chip on flex for die stacking Grant 8,125,065 - Lee February 28, 2	2012-02-28
Microelectronic devices and methods for manufacturing microelectronic devices Grant 8,101,464 - Lee January 24, 2	2012-01-24
Balanced semiconductor device packages including lead frame with floating leads and associated methods Grant 8,084,846 - Lee , et al. December 27, 2	2011-12-27
Packaged Microelectronic Devices And Methods For Manufacturing Packaged Microelectronic Devices App 20110254144 - Lee; Teck Kheng ; et al.	2011-10-20
Microelectronic Devices And Microelectronic Support Devices, And Associated Assemblies And Methods App 20110252623 - Lee; Teck Kheng ; et al.	2011-10-20
Semiconductor Device Assemblies App 20110204499 - Lee; Teck Kheng	2011-08-25
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices Grant 7,968,376 - Lee , et al. June 28, 2	2011-06-28
Microelectronic devices and microelectronic support devices, and associated assemblies and methods Grant 7,968,369 - Lee , et al. June 28, 2	2011-06-28
Apparatus for flip-chip packaging providing testing capability Grant 7,915,718 - Lee , et al. March 29, 2	2011-03-29
Interposer configured to reduce the profiles of semiconductor device assemblies, packages including the same, and methods Grant 7,902,648 - Lee March 8, 2	2011-03-08
Partitioned through-layer via and associated systems and methods Grant 7,830,018 - Lee November 9, 2	2010-11-09
Methods Of Fluxless Micro-piercing Of Solder Balls, And Resulting Devices App 20100264541 - Lee; Teck Kheng	2010-10-21
Methods of fluxless micro-piercing of solder balls, and resulting devices Grant 7,749,887 - Lee July 6, 2	2010-07-06
Microfeature Workpiece Substrates Having Through-substrate Vias, And Associated Methods Of Formation App 20100052183 - Lee; Teck Kheng ; et al.	2010-03-04
Interposer including at least one passive element at least partially defined by a recess formed therein, system including same, and wafer-scale interposer Grant 7,663,206 - Lee February 16, 2	2010-02-16
Packaged Microelectronic Devices And Methods For Manufacturing Packaged Microelectronic Devices App 20100029043 - Lee; Teck Kheng ; et al.	2010-02-04
Microfeature workpiece substrates having through-substrate vias, and associated methods of formation Grant 7,622,377 - Lee , et al. November 24, 2	2009-11-24
Packaged microelectronic devices with a lead frame Grant 7,612,436 - Lee , et al. November 3, 2	2009-11-03
Microelectronic Devices And Methods For Manufacturing Microelectronic Devices App 20090236736 - Lee; Teck Kheng	2009-09-24
Methods of forming semiconductor assemblies Grant 7,569,473 - Lee , et al. August 4, 2	2009-08-04
Method of fabricating microelectronic devices Grant 7,553,699 - Lee June 30, 2	2009-06-30
Methods Of Fluxless Micro-piercing Of Solder Balls, And Resulting Devices App 20090152719 - Lee; Teck Kheng	2009-06-18
Methods for assembly and packaging of flip chip configured dice with interposer Grant 7,534,660 - Lee May 19, 2	2009-05-19
Flip chip packaging using recessed interposer terminals Grant 7,531,906 - Lee May 12, 2	2009-05-12
Intrinsic thermal enhancement for FBGA package Grant 7,521,794 - Yee , et al. April 21, 2	2009-04-21
Method of manufacturing an interposer including at least one passive element at least partially defined by a recess therein Grant 7,494,889 - Lee February 24, 2	2009-02-24
Intrinsic thermal enhancement for FBGA package Grant 7,459,346 - Yee , et al. December 2, 2	2008-12-02
Methods of manufacturing interposers with flexible solder pad elements Grant 7,422,978 - Lee September 9, 2	2008-09-09
Interposers with flexible solder pad elements Grant 7,397,129 - Lee July 8, 2	2008-07-08
Balanced semiconductor device packages including lead frame with floating leads and associated methods App 20080122072 - Lee; Teck Kheng ; et al.	2008-05-29
Methods for packaging and encapsulating semiconductor device assemblies that include tape substrates Grant 7,354,795 - Lee , et al. April 8, 2	2008-04-08
Elimination of RDL using tape base flip chip on flex for die stacking App 20080074852 - Lee; Teck Kheng	2008-03-27
Methods for assembly and packaging of flip chip configured dice with interposer Grant 7,348,215 - Lee March 25, 2	2008-03-25
Microelectronic devices and methods for manufacturing microelectronic devices App 20080057621 - Lee; Teck Kheng	2008-03-06
Microelectronic devices and methods for manufacturing microelectronic devices App 20080032447 - Lee; Teck Kheng	2008-02-07
Double bumping of flexible substrate for first and second level interconnects Grant 7,320,933 - Lee , et al. January 22, 2	2008-01-22
Interposer With Flexible Solder Pad Elements App 20070285884 - Lee; Teck Kheng	2007-12-13
Ultrathin leadframe BGA circuit package Grant 7,294,911 - Lee , et al. November 13, 2	2007-11-13
Methods Of Forming Semiconductor Assemblies App 20070231964 - Lee; Teck Kheng ; et al.	2007-10-04
Systems for degating packaged semiconductor devices with tape substrates Grant 7,250,687 - Lee , et al. July 31, 2	2007-07-31
Methods for packaging and encapsulating semiconductor device assemblies that include tape substrates App 20070158801 - Lee; Teck Kheng ; et al.	2007-07-12
Semiconductor die packages with recessed interconnecting structures Grant 7,230,330 - Lee , et al. June 12, 2	2007-06-12
Microelectronic Devices And Microelectronic Support Devices, And Associated Assemblies And Methods App 20070105272 - Lee; Teck Kheng ; et al.	2007-05-10
Ultrathin leadframe BGA circuit package App 20070099344 - Lee; Teck Kheng ; et al.	2007-05-03
Elimination of RDL using tape base flip chip on flex for die stacking Grant 7,189,593 - Lee March 13, 2	2007-03-13
Mold gates and tape substrates including the mold gates Grant 7,190,081 - Lee , et al. March 13, 2	2007-03-13
Microfeature workpiece substrates having through-substrate vias, and associated methods of formation App 20070045826 - Lee; Teck Kheng ; et al.	2007-03-01
Microelectronic devices and microelectronic support devices, and associated assemblies and methods App 20070045797 - Lee; Teck Kheng ; et al.	2007-03-01
Ultrathin leadframe BGA circuit package Grant 7,183,134 - Lee , et al. February 27, 2	2007-02-27
Flip chip packaging using recessed interposer terminals Grant 7,161,237 - Lee January 9, 2	2007-01-09
Intrinsic thermal enhancement for FBGA package App 20060289989 - Yee; Pak Hong ; et al.	2006-12-28
Flip chip packaging using recessed interposer terminals App 20060284312 - Lee; Teck Kheng	2006-12-21
Interposer configured to reduce the profiles of semiconductor device assemblies and packages including the same and methods Grant 7,145,225 - Lee December 5, 2	2006-12-05
Semiconductor device modules, semiconductor devices, and microelectronic devices App 20060267171 - Lee; Teck Kheng	2006-11-30
Intrinsic thermal enhancement for FBGA package Grant 7,138,711 - Yee , et al. November 21, 2	2006-11-21
Elimination of RDL using tape base flip chip on flex for die stacking Grant 7,129,584 - Lee October 31, 2	2006-10-31
Method and apparatus for flip-chip packaging providing testing capability App 20060240595 - Lee; Teck Kheng ; et al.	2006-10-26
Interposer substrate and wafer scale interposer substrate member for use with flip-chip configured semiconductor dice Grant 7,122,907 - Lee October 17, 2	2006-10-17
Semiconductor die packages with recessed interconnecting structures and methods for assembling the same Grant 7,112,520 - Lee , et al. September 26, 2	2006-09-26
BOC BGA package for die with I-shaped bond pad layout Grant 7,112,048 - Lim , et al. September 26, 2	2006-09-26
Interposer with flexible solder pad elements and methods of manufacturing the same Grant 7,105,918 - Lee September 12, 2	2006-09-12
Interposers with flexible solder pad elements App 20060175699 - Lee; Teck Kheng	2006-08-10
Interposer configured to reduce the profiles of semiconductor device assemblies, packages including the same, and methods App 20060175690 - Lee; Teck Kheng	2006-08-10
Microelectronic devices including underfill apertures Grant 7,087,994 - Lee August 8, 2	2006-08-08
Methods for assembly and packaging of flip chip configured dice with interposer Grant 7,087,460 - Lee August 8, 2	2006-08-08
Interposer including at least one passive element at least partially defined by a recess formed therein, system including same, and wafer-scale interposer App 20060125047 - Lee; Teck Kheng	2006-06-15
Tape substrates with mold gate support structures that are coplanar with conductive traces thereof and associated methods Grant 7,057,297 - Lee , et al. June 6, 2	2006-06-06
Methods of manufacturing interposers with flexible solder pad elements App 20060094159 - Lee; Teck Kheng	2006-05-04
Method for package reduction in stacked chip and board assemblies Grant 7,005,316 - Lee , et al. February 28, 2	2006-02-28
Interposer including at least one passive element at least partially defined by a recess formed therein, method of manufacture, system including same, and wafer-scale interposer App 20060024900 - Lee; Teck Kheng	2006-02-02
Interposer with flexible solder pad elements and methods of manufacturing the same App 20060022328 - Lee; Teck Kheng	2006-02-02
Method and apparatus for dielectric filling of flip chip on interposer assembly Grant 6,975,035 - Lee December 13, 2	2005-12-13
Mold gates, tape substrates with the mold gates, and packaging methods App 20050253250 - Lee, Teck Kheng ; et al.	2005-11-17
Systems for degating packaged semiconductor device with tape substrates App 20050253238 - Lee, Teck Kheng ; et al.	2005-11-17
Innovative solder ball pad structure to ease design rule, methods of fabricating same and substrates, electronic device assemblies and systems employing same Grant 6,940,179 - Lee September 6, 2	2005-09-06
Intrinsic thermal enhancement for FBGA package App 20050186704 - Yee, Pak Hong ; et al.	2005-08-25
Tape substrates with mold gate support structures that are coplanar with conductive traces thereof and associated methods App 20050051880 - Lee, Teck Kheng ; et al.	2005-03-10
Semiconductor die packages with recessed interconnecting structures App 20050029550 - Lee, Teck Kheng ; et al.	2005-02-10
Ultrathin leadframe BGA circuit package App 20050026386 - Lee, Teck Kheng ; et al.	2005-02-03
Microelectronic Devices Including Underfill Apertures App 20040224437 - Lee, Teck Kheng	2004-11-11
Elimination of RDL using tape base flip chip on flex for die stacking App 20040219713 - Lee, Teck Kheng	2004-11-04
Double bumping of flexible substrate for first and second level interconnects App 20040198033 - Lee, Teck Kheng ; et al.	2004-10-07
Methods for assembly and packaging of flip chip configured dice with interposer App 20040197955 - Lee, Teck Kheng	2004-10-07
Methods for assembly and packaging of flip chip configured dice with interposer App 20040197952 - Lee, Teck Kheng	2004-10-07
Innovative solder ball pad structure to ease design rule, methods of fabricating same and substrates, electronic device assemblies and systems employing same App 20040173915 - Lee, Teck Kheng	2004-09-09
Apparatus for package reduction in stacked chip and board assemblies Grant 6,787,917 - Lee , et al. September 7, 2	2004-09-07
Interposer substrate and wafer scale interposer substrate member for use with flip-chip configured semiconductor dice App 20040159957 - Lee, Teck Kheng	2004-08-19
Innovative solder ball pad structure to ease design rule, methods of fabricating same and substrates, electronic device assemblies and systems employing same Grant 6,762,503 - Lee July 13, 2	2004-07-13
Method of manufacturing microelectronic devices, including methods of underfilling microelectronic components through an underfill aperture Grant 6,756,251 - Lee June 29, 2	2004-06-29
BOC BGA package for die with I-shaped bond pad layout Grant 6,720,666 - Lim , et al. April 13, 2	2004-04-13
Innovative Solder Ball Pad Structure To Ease Design Rule, Methods Of Fabricating Same And Substrates, Electronic Device Assemblies And Systems Employing Same App 20040041393 - Lee, Teck Kheng	2004-03-04
Double bumping of flexible substrate for first and second level interconnects App 20040036170 - Lee, Teck Kheng ; et al.	2004-02-26
BOC BGA package for die with I-shaped bond pad layout Grant 6,692,987 - Lim , et al. February 17, 2	2004-02-17
Intrinsic thermal enhancement for FBGA package App 20030230799 - Yee, Pak Hong ; et al.	2003-12-18
BOC BGA package for die with I-shaped bond pad layout App 20030211660 - Lim, Thiam Chye ; et al.	2003-11-13
BOC BGA package for die with I-shaped bond pad layout App 20030211659 - Lim, Thiam Chye ; et al.	2003-11-13
Ultrathin leadframe BGA circuit package App 20030197267 - Lee, Teck Kheng ; et al.	2003-10-23
Method and apparatus for flip-chip packaging providing testing capability App 20030164551 - Lee, Teck Kheng ; et al.	2003-09-04
Method and apparatus for dielectric filling of flip chip on interposer assembly App 20030164541 - Lee, Teck Kheng	2003-09-04
Flip chip packaging using recessed interposer terminals App 20030164548 - Lee, Teck Kheng	2003-09-04
Semiconductor die packages with recessed interconnecting structures and methods for assembling the same App 20030164540 - Lee, Teck Kheng ; et al.	2003-09-04
Methods for assembly and packaging of flip chip configured dice with interposer App 20030166312 - Lee, Teck Kheng	2003-09-04
Apparatus for package reduction in stacked chip and board assemblies App 20030164550 - Lee, Teck Kheng ; et al.	2003-09-04
BOC BGA package for die with I-shaped bond pad layout App 20030148557 - Lim, Thiam Chye ; et al.	2003-08-07
Elimination of RDL using tape base flip chip on flex for die stacking App 20030134450 - Lee, Teck Kheng	2003-07-17
Apparatus for package reduction in stacked chip and board assemblies Grant 6,583,502 - Lee , et al. June 24, 2	2003-06-24
Method and apparatus for package reduction in stacked chip and board assemblies App 20030102546 - Lee, Teck Kheng ; et al.	2003-06-05
Microelectronic devices and methods of manufacture App 20030042617 - Lee, Teck Kheng	2003-03-06
Method and apparatus for package reduction in stacked chip and board assemblies App 20020149097 - Lee, Teck Kheng ; et al.	2002-10-17