LEE; Seok Kyu

Patent Applications and Registrations

Patent applications and USPTO patent grants for LEE; Seok Kyu.The latest application filed is for "method for manufacturing electronic component embedding substrate and electronic component embedding substrate".

Company Profile

0.15.34

LEE; Seok Kyu - Yeongi-gun KR
Lee; Seok Kyu - Yeongi KR
Lee; Seok Kyu - Suwon KR
LEE; Seok Kyu - Suwon-si KR
Lee; Seok Kyu - Gyunggi-do N/A KR
Lee; Seok-Kyu - Chungchungbuk-do KR
Lee; Seok-Kyu - Cheonan-si KR
Lee; Seok-Kyu - Chungcheongbuk-do KR
Lee; Seok-Kyu - Daejeon KR
Lee, Seok-Kyu - Chongju KR
Lee, Seok Kyu - Choongchug-namdo KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method For Manufacturing Electronic Component Embedding Substrate And Electronic Component Embedding Substrate App 20160212856 - KIM; Hong Won ; et al.	2016-07-21
Printed Circuit Board App 20150062850 - CHOI; Cheol Ho ; et al.	2015-03-05
Method For Manufacturing Electronic Component Embedding Substrate And Electronic Component Embedding Substrate App 20150049445 - KIM; Hong Won ; et al.	2015-02-19
Electronic Component Embedded Printed Circuit Board And Method For Manufacturing The Same App 20140347834 - LEE; Seok Kyu ; et al.	2014-11-27
Carrier for manufacturing printed circuit board, method of manufacturing the same and method of manufacturing printed circuit board using the same Grant 8,883,016 - Lee , et al. November 11, 2	2014-11-11
Primer-coated Copper Foil Having Superior Adhesive Strength And Method For Producing The Same App 20140186581 - LEE; Seok Kyu ; et al.	2014-07-03
Carrier For Manufacturing Printed Circuit Board, Method Of Manufacturing The Same And Method Of Manufacturing Printed Circuit Board Using The Same App 20140027047 - LEE; Jae Joon ; et al.	2014-01-30
Carrier for manufacturing printed circuit board, method of manufacturing the same and method of manufacturing printed circuit board using the same Grant 8,563,141 - Lee , et al. October 22, 2	2013-10-22
Carrier For Manufacturing Substrate and Method Of Manufacturing Substrate Using The Same App 20130243995 - KIM; Jin Ho ; et al.	2013-09-19
Method Of Manufacturing Coreless Substrate Having Filled Via Pad App 20130243941 - LEE; Seok Kyu ; et al.	2013-09-19
Coreless substrate having filled via pad and method of manufacturing the same Grant 8,445,790 - Lee , et al. May 21, 2	2013-05-21
Carrier for manufacturing substrate and method of manufacturing substrate using the same Grant 8,435,376 - Kim , et al. May 7, 2	2013-05-07
Method of manufacturing printed circuit board having metal bump Grant 8,209,860 - An , et al. July 3, 2	2012-07-03
Carrier For Manufacturing Printed Circuit Board, Method Of Manufacturing The Same And Method Of Manufacturing Printed Circuit Board Using The Same App 20110163064 - LEE; Jae Joon ; et al.	2011-07-07
Method of manufacturing printed circuit board Grant 7,971,352 - Okabe , et al. July 5, 2	2011-07-05
Carrier For Manufacturing Substrate And Method Of Manufacturing Substrate Using The Same App 20110159282 - KIM; Jin Ho ; et al.	2011-06-30
Method of manufacturing printed circuit board App 20110079349 - Cho; Suk Hyeon ; et al.	2011-04-07
Package substrate App 20110076472 - Kim; Jin Ho ; et al.	2011-03-31
Package Substrate App 20110067901 - KIM; Jin Ho ; et al.	2011-03-24
Method Of Manufacturing Printed Circuit Board Having Metal Bump App 20110000083 - AN; Jin Yong ; et al.	2011-01-06
Package Substrate App 20100148348 - LEE; Jae-Joon ; et al.	2010-06-17
Coreless substrate having filled via pad and method of manufacturing the same App 20100096177 - Lee; Seok Kyu ; et al.	2010-04-22
Printed circuit board having round solder bump and method of manufacturing the same App 20100096171 - Lee; Seok Kyu ; et al.	2010-04-22
Printed Circuit Board With Embedded Capacitors Therein, And Process For Manufacturing The Same App 20090325105 - Lee; Seok-Kyu ; et al.	2009-12-31
Printed circuit board and manufacturing method thereof App 20090283302 - Lee; Seok-Kyu ; et al.	2009-11-19
Printed circuit board with embedded capacitors therein, and process for manufacturing the same Grant 7,570,491 - Lee , et al. August 4, 2	2009-08-04
Pharmaceutical composition of amlodipine maleate having enhanced stability App 20090191274 - Lee; Sang-Joon ; et al.	2009-07-30
Method of manufacturing printed circuit board App 20090151160 - Okabe; Shuhichi ; et al.	2009-06-18
Multilayered printed circuit board and manufacturing method thereof App 20090038837 - Okabe; Shuhichi ; et al.	2009-02-12
Injection of Tacrolimus App 20080125456 - Lee; Sang Joon ; et al.	2008-05-29
Printed circuit board including embedded capacitor having high dielectric constant and method of fabricating same Grant 7,351,915 - Ahn , et al. April 1, 2	2008-04-01
Printed circuit board with embedded capacitors and manufacturing method thereof Grant 7,326,858 - Lee , et al. February 5, 2	2008-02-05
Method of producing printed circuit board with embedded resistor Grant 7,284,317 - Cho , et al. October 23, 2	2007-10-23
Printed Circuit Board Including Embedded Capacitor Having High Dielectric Constant And Method Of Fabricating Same App 20070146980 - Ahn; Jin-Yong ; et al.	2007-06-28
Printed circuit board with embedded capacitors therein, and process for manufacturing the same Grant 7,092,237 - Lee , et al. August 15, 2	2006-08-15
Printed circuit board including embedded capacitor and method of fabricating same App 20060115770 - Hong; Jong Kuk ; et al.	2006-06-01
Printed circuit board including embedded capacitor having high dielectric constant and method of fabricating same App 20060044734 - Ahn; Jin-Yong ; et al.	2006-03-02
Method of fabricating PCB including embedded passive chip App 20060014327 - Cho; Suk-Hyeon ; et al.	2006-01-19
Printed circuit board with embedded capacitors therein, and process for manufacturing the same App 20050199681 - Lee, Seok-Kyu ; et al.	2005-09-15
Method of producing printed circuit board with embedded resistor App 20050175385 - Cho, Suk-Hyun ; et al.	2005-08-11
Printed circuit board with embedded capacitors therein, and process for manufacturing the same Grant 6,910,266 - Lee , et al. June 28, 2	2005-06-28
Printed circuit board with embedded capacitors therein, and process for manufacturing the same App 20040118600 - Lee, Seok-Kyu ; et al.	2004-06-24
Printed circuit board with embedded capacitors and manufacturing method thereof App 20040118602 - Lee, Seok-Kyu ; et al.	2004-06-24
Printed circuit board with embedded capacitors therein, and process for manufacturing the same App 20040121266 - Lee, Seok-Kyu ; et al.	2004-06-24
Printed circuit board with buried resistor and manufacturing method thereof App 20030150101 - Park, Keon-Yang ; et al.	2003-08-14
Self-emulsifying matrix type trandermal preparation App 20030129219 - Hong, Chung Il ; et al.	2003-07-10

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