Patent | Date |
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Pharmaceutical Composition For Prevention Or Treatment Of Spinal Cord Injury Or Spinal Stenosis App 20220202774 - LEE; Jae Yeol ;   et al. | 2022-06-30 |
Precursor and method for preparing Ni based cathode material for rechargeable lithium ion batteries Grant 11,367,872 - Park , et al. June 21, 2 | 2022-06-21 |
Novel Aminoalkanoic Acid Derivative Containing Biphenyl Group And Antifungal Pharmaceutical Composition Comprising The Same App 20220144755 - PARK; Ki Duk ;   et al. | 2022-05-12 |
Method Of Manufacturing Bamboo Toothbrush And Bamboo Toothbrush Manufactured Thereby App 20220125192 - LEE; Kyung Tae ;   et al. | 2022-04-28 |
Maintaining height of alignment key in semiconductor devices Grant 11,189,572 - Lee , et al. November 30, 2 | 2021-11-30 |
Microfluidic Device For Cerebrovascular Simulation And High-efficiency Blood-brain Barrier Simulation System Comprising Same App 20210348098 - CHO; Seung Woo ;   et al. | 2021-11-11 |
Precursor and method for preparing Ni based cathode material for rechargeable lithium ion batteries Grant 11,114,662 - Park , et al. September 7, 2 | 2021-09-07 |
Composition For Fat Formation Inhibition And Body Fat Reduction, Containing Hydrangenol As Active Ingredient App 20210228463 - LEE; Sun Hee ;   et al. | 2021-07-29 |
Method Of Preventing Or Improving Uv-induced Skin Damage Using Hydroangenol As Active Ingredient App 20210196677 - LEE; Sun Hee ;   et al. | 2021-07-01 |
Novel Kinase For Treating And Preventing Fungal Infections, And Use Thereof App 20210130867 - Bahn; Yong-Sun ;   et al. | 2021-05-06 |
Composition For Preventing Or Improving Uv-induced Skin Damage Using Hydroangenol As Active Ingredient App 20200383892 - LEE; Sun Hee ;   et al. | 2020-12-10 |
Method for preventing or treating colitis disease comprising Lactobacillus sakei K040706 as an active ingredient Grant 10,849,941 - Rhee , et al. December 1, 2 | 2020-12-01 |
Functional Derivative Compounds Of Alanine And Proline Amino Acids And Pharmaceutical Composition Comprising Same App 20200199065 - Park; Ki Duk ;   et al. | 2020-06-25 |
Maintaining Height Of Alignment Key In Semiconductor Devices App 20200027842 - LEE; Kyung-Tae ;   et al. | 2020-01-23 |
PRECURSOR AND METHOD FOR PREPARING Ni BASED CATHODE MATERIAL FOR RECHARGEABLE LITHIUM ION BATTERIES App 20200020944 - PARK; Areum ;   et al. | 2020-01-16 |
PRECURSOR AND METHOD FOR PREPARING Ni BASED CATHODE MATERIAL FOR RECHARGEABLE LITHIUM ION BATTERIES App 20200006762 - PARK; Areum ;   et al. | 2020-01-02 |
Hood latch assembly for vehicle and method of actuating the same Grant 10,415,277 - Lee , et al. Sept | 2019-09-17 |
Method For Preventing Or Treating Colitis Disease Comprising Lactobacillus Sakei K040706 As An Active Ingredient App 20190224255 - RHEE; Young Kyoung ;   et al. | 2019-07-25 |
Smart soft composite actuator Grant 10,079,335 - Ahn , et al. September 18, 2 | 2018-09-18 |
3,4-dihydroquinazoline derivative and combination comprising the same Grant 9,969,697 - Lee , et al. May 15, 2 | 2018-05-15 |
N-phenyl-n'-phenoxycarbonyl-phenylsulfonhydrazide Derivative And Pharmaceutical Composition Comprising The Same App 20180064665 - LEE; Jae Yeol ;   et al. | 2018-03-08 |
Composition for preventing or treating of colitis disease comprising Lactobacillus sakei K040706 as an active ingredient App 20180064766 - RHEE; Young Kyoung ;   et al. | 2018-03-08 |
Hood Latch Assembly For Vehicle And M Ethod Of Actuating The Same App 20170101810 - Lee; Kyung-Tae ;   et al. | 2017-04-13 |
3,4-dihydroquinazoline Derivative And Combination Comprising The Same App 20170081291 - LEE; Jae Yeol ;   et al. | 2017-03-23 |
Use of eupatilin Grant 9,301,943 - Choi , et al. April 5, 2 | 2016-04-05 |
Compound having angiogenesis inhibitory activity, method for preparing same, and pharmaceutical composition comprising same Grant 9,227,955 - Kim , et al. January 5, 2 | 2016-01-05 |
Smart Soft Composite Actuator App 20150001994 - Ahn; Sung Hoon ;   et al. | 2015-01-01 |
Novel Use Of Eupatilin App 20140288168 - Choi; Jung-Hye ;   et al. | 2014-09-25 |
Novel Compound Having Angiogenesis Inhibitory Activity, Method for Preparing Same, and Pharmaceutical Composition Comprising Same App 20140256711 - Kim; Ji Han ;   et al. | 2014-09-11 |
Void boundary structures, semiconductor devices having the void boundary structures and methods of forming the same Grant 8,420,524 - Yu , et al. April 16, 2 | 2013-04-16 |
Void boundary structures, semiconductor devices having the void boundary structures and methods of forming the same App 20110207316 - Yu; Cheong-Sik ;   et al. | 2011-08-25 |
Void boundary structures, semiconductor devices having the void boundary structures and methods of forming the same Grant 7,956,439 - Yu , et al. June 7, 2 | 2011-06-07 |
Semiconductor memory devices including a damascene wiring line Grant 7,768,128 - Cho , et al. August 3, 2 | 2010-08-03 |
Integrated circuit devices including a capacitor Grant 7,679,123 - Oh , et al. March 16, 2 | 2010-03-16 |
Multiple-dyes Sensitized Solar Cells And A Method For Preparing The Same App 20090211638 - PARK; Nam-Gyu ;   et al. | 2009-08-27 |
Capacitor having high electrostatic capacity, integrated circuit device including the capacitor and method of fabricating the same Grant 7,579,643 - Oh , et al. August 25, 2 | 2009-08-25 |
Integrated circuit capacitor structure Grant 7,560,332 - Lee , et al. July 14, 2 | 2009-07-14 |
Cooling arrangement for centering device and spline shaft Grant 7,547,207 - Berceanu , et al. June 16, 2 | 2009-06-16 |
Touch Sensor Type Light-emission Writing Instrument App 20080198581 - LEE; Hyung-Bong ;   et al. | 2008-08-21 |
Method for damascene process Grant 7,351,653 - Ahn , et al. April 1, 2 | 2008-04-01 |
Void boundary structures, semiconductor devices having the void boundary structures and methods of forming the same App 20080042268 - Yu; Cheong-Sik ;   et al. | 2008-02-21 |
Cooling Arrangement For Centering Device And Spline Shaft App 20070275111 - Berceanu; Mihai ;   et al. | 2007-11-29 |
Capacitor having high electrostatic capacity, integrated circuit device including the capacitor and method of fabricating the same App 20070200159 - Oh; Byung-jun ;   et al. | 2007-08-30 |
Integrated Circuit Capacitor Structure App 20070184610 - Lee; Kyoung-woo ;   et al. | 2007-08-09 |
Integrated Circuit Devices Including A Capacitor App 20070145452 - Oh; Byung-jun ;   et al. | 2007-06-28 |
Integrated circuit capacitor structure Grant 7,229,875 - Lee , et al. June 12, 2 | 2007-06-12 |
Metal-insulator-metal capacitor and interconnecting structure Grant 7,220,652 - Kim , et al. May 22, 2 | 2007-05-22 |
Integrated circuit devices including a capacitor Grant 7,208,791 - Oh , et al. April 24, 2 | 2007-04-24 |
Method of forming an insulating structure having an insulating interlayer and a capping layer and method of forming a metal wiring structure using the same Grant 7,202,160 - Kim , et al. April 10, 2 | 2007-04-10 |
Method of forming metal wiring in a semiconductor device Grant 7,183,202 - Lee , et al. February 27, 2 | 2007-02-27 |
Semiconductor memory devices and methods of fabricating the same App 20070035028 - Cho; Young-woo ;   et al. | 2007-02-15 |
Method for damascene process App 20070037383 - Ahn; Jeong-Hoon ;   et al. | 2007-02-15 |
Metal-insulator-metal capacitors and methods of forming the same App 20060183280 - Lee; Sang-Jin ;   et al. | 2006-08-17 |
Method of manufacturing semiconductor device having metal interconnections of different thickness Grant 7,030,022 - Jung , et al. April 18, 2 | 2006-04-18 |
Integrated circuit devices including a capacitor App 20050247968 - Oh, Byung-jun ;   et al. | 2005-11-10 |
Void-free metal interconnection structure and method of forming the same Grant 6,953,745 - Ahn , et al. October 11, 2 | 2005-10-11 |
Integrated circuit devices including a MIM capacitor Grant 6,940,114 - Oh , et al. September 6, 2 | 2005-09-06 |
Method of forming metal wiring in a semiconductor device App 20050153541 - Lee, Sang-Jin ;   et al. | 2005-07-14 |
Method of forming dual damascene interconnection using low-k dielectric Grant 6,911,397 - Jun , et al. June 28, 2 | 2005-06-28 |
Bonding pads with dummy patterns in semiconductor devices and methods of forming the same App 20050127496 - Kwon, Ki-hyoun ;   et al. | 2005-06-16 |
Void-free metal interconnection steucture and method of forming the same App 20050029010 - Ahn, Jeong-hoon ;   et al. | 2005-02-10 |
Method of forming an insulating structure having an insulating interlayer and a capping layer and method of forming a metal wiring structure using the same App 20050026422 - Kim, Yoon-Hae ;   et al. | 2005-02-03 |
Metal-insulator-metal capacitor and interconnecting structure App 20050024979 - Kim, Yoon-hae ;   et al. | 2005-02-03 |
Leg manifold mounting arrangement Grant 6,833,102 - Martino , et al. December 21, 2 | 2004-12-21 |
Semiconductor device including metal interconnection and metal resistor and method of manufacturing the same App 20040238962 - Jung, Mu-Kyeng ;   et al. | 2004-12-02 |
Integrated circuit capacitor structure App 20040137694 - Lee, Kyoung-Woo ;   et al. | 2004-07-15 |
Integrated circuit devices including a MIM capacitor App 20040113190 - Oh, Byung-jun ;   et al. | 2004-06-17 |
Bond pad of semiconductor device and method of fabricating the same Grant 6,746,951 - Liu , et al. June 8, 2 | 2004-06-08 |
Leg manifold mounting arrangement App 20040068855 - Martino, Filippo ;   et al. | 2004-04-15 |
Method of manufacturing semiconductor device having metal interconnections of different thickness App 20040048476 - Jung, Mu-Kyoung ;   et al. | 2004-03-11 |
Method of forming dual damascene interconnection using low-k dielectric App 20030199169 - Jun, Jin-Won ;   et al. | 2003-10-23 |
Method of making a semiconductor device having dual damascene line structure using a patterned etching stopper Grant 6,498,092 - Lee , et al. December 24, 2 | 2002-12-24 |
Bond pad of semiconductor device and method of fabricating the same App 20020047218 - Liu, Seong-ho ;   et al. | 2002-04-25 |
Semiconductor device having dual damascene line structure and method for fabricating the same App 20020030280 - Lee, Kyung-Tae ;   et al. | 2002-03-14 |
Semiconductor device and method of manufacturing a semiconductor device with reduced contact failures App 20010016413 - Lee, Kyung-Tae ;   et al. | 2001-08-23 |