| Patent | Date |
|---|
Turbine airfoil and turbine including same
Grant 11,448,074 - Park , et al. September 20, 2 | 2022-09-20 |
Turbine Airfoil And Turbine Including Same
App 20220220857 - PARK; Jung Shin ; et al. | 2022-07-14 |
Test structure and evaluation method for semiconductor photo overlay
Grant 10,930,571 - Lee , et al. February 23, 2 | 2021-02-23 |
Gas turbine blade
Grant 10,927,681 - Lee February 23, 2 | 2021-02-23 |
Gas Turbine Blade
App 20200300096 - LEE; Ki Don | 2020-09-24 |
Novel Test Structure And Evaluation Method For Semiconductor Photo Overlay
App 20200251391 - Kind Code | 2020-08-06 |
Gas turbine blade
Grant 10,378,361 - Lee , et al. A | 2019-08-13 |
Interconnect structure formed with a high aspect ratio single damascene copper line on a non-damascene via
Grant 10,211,093 - Lee , et al. Feb | 2019-02-19 |
Gas Turbine Blade
App 20180051570 - Lee; Ki Don ; et al. | 2018-02-22 |
Interconnect Structure Formed With A High Aspect Ratio Single Damascene Copper Line On A Non-damascene Via
App 20180012796 - LEE; Ki-Don ; et al. | 2018-01-11 |
Stacked Damascene Structures For Microelectronic Devices
App 20160268199 - LEE; Ki-Don ; et al. | 2016-09-15 |
Stacked damascene structures for microelectronic devices
Grant 9,431,343 - Lee , et al. August 30, 2 | 2016-08-30 |
Embedded polysilicon resistor in integrated circuits formed by a replacement gate process
Grant 9,240,404 - Lim , et al. January 19, 2 | 2016-01-19 |
IC resistor formed with integral heatsinking structure
Grant 9,111,779 - Park , et al. August 18, 2 | 2015-08-18 |
Embedded Polysilicon Resistor In Integrated Circuits Formed By A Replacement Gate Process
App 20150008531 - LIM; Kwan-Yong ; et al. | 2015-01-08 |
Embedded polysilicon resistor in integrated circuits formed by a replacement gate process
Grant 8,865,542 - Lim , et al. October 21, 2 | 2014-10-21 |
Embedded Polysilicon Resistor in Integrated Circuits Formed by a Replacement Gate Process
App 20140183657 - Lim; Kwan-Yong ; et al. | 2014-07-03 |
Ic Resistor Formed With Integral Heatsinking Structure
App 20100032770 - Park; Young-Joon ; et al. | 2010-02-11 |
Electrically inactive via for electromigration reliability improvement
Grant 7,566,652 - Lee , et al. July 28, 2 | 2009-07-28 |
Electrically inactive via for electromigration reliability improvement
App 20080017989 - Lee; Ki-Don ; et al. | 2008-01-24 |
Multiple copper vias for integrated circuit metallization
Grant 7,078,817 - Ho , et al. July 18, 2 | 2006-07-18 |
Mechanical cooling fin for interconnects
Grant 7,031,163 - Lee , et al. April 18, 2 | 2006-04-18 |
Multiple copper vias for integrated circuit metallization and methods of fabricating same
Grant 6,919,639 - Ho , et al. July 19, 2 | 2005-07-19 |
Multiple copper vias for integrated circuit metallization
App 20050093163 - Ho, Paul S. ; et al. | 2005-05-05 |
Mechanical cooling fin for interconnects
App 20040125572 - Lee, Ki-Don ; et al. | 2004-07-01 |
Multiple copper vias for integrated circuit metallization and methods of fabricating same
App 20040070078 - Ho, Paul S. ; et al. | 2004-04-15 |
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