Lee; Joo Han

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lee; Joo Han.The latest application filed is for "microneedle percutaneous patch containing donepezil".

Company Profile

5.20.27

Lee; Joo Han - Gyeonggi-do KR
Lee; Joo Han - Pohang KR
Lee; Joo-han - Seongnam-si KR
Lee; Joo-han - Asan-si N/A KR
Lee; Joo Han - Seoul KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Microneedle Percutaneous Patch Containing Donepezil App 20200179272 - Kim; Tae Hyung ; et al.	2020-06-11
Mouse with D4R iRNA in the intercalating cell mass of the amygdala Grant 10,668,061 - Kim , et al.	2020-06-02
Preparing conditioning disk for chemical mechanical polishing and chemical mechanical polishing method including the same Grant 10,525,566 - Hong , et al. J	2020-01-07
Pad conditioner having reduced friction and method of manufacturing the same Grant 10,478,941 - Yoon , et al. Nov	2019-11-19
Chemical Mechanical Polishing Method And Method For Fabricating Semiconductor Device App 20190091833 - HAN; Sol ; et al.	2019-03-28
CMP pad conditioner Grant 10,166,653 - Lee , et al. J	2019-01-01
Chemical Mechanical Polishing Method, Method Of Manufacturing Semiconductor Device, And Semiconductor Manufacturing Apparatus App 20180104792 - HONG; Myung-ki ; et al.	2018-04-19
Pharmaceutical Composition For Treating Posttraumatic Stress Disorder App 20180064707 - Kim; Joung-Hun ; et al.	2018-03-08
Array printed circuit board, method of replacing defective single printed circuit board of the same, and method of manufacturing electronic apparatus using the same Grant 9,451,691 - Kim , et al. September 20, 2	2016-09-20
CMP apparatus Grant 9,421,668 - Lee , et al. August 23, 2	2016-08-23
CMP pad conditioner, and method for producing the CMP pad conditioner Grant 9,314,901 - Lee , et al. April 19, 2	2016-04-19
Slot-mounted printed circuit board having small insertion force Grant 9,313,891 - Jung , et al. April 12, 2	2016-04-12
Compound having angiogenesis inhibitory activity, method for preparing same, and pharmaceutical composition comprising same Grant 9,227,955 - Kim , et al. January 5, 2	2016-01-05
Cmp Apparatus App 20150140900 - Lee; Seh Kwang ; et al.	2015-05-21
Array Printed Circuit Board, Method Of Replacing Defective Single Printed Circuit Board Of The Same, And Method Of Manufacturing Electronic Apparatus Using The Same App 20150075844 - KIM; Young-hoon ; et al.	2015-03-19
Semiconductor Package Module Having Self-assembled Insulation Thin Film And Method Of Manufacturing The Semiconductor Package Module App 20140334108 - JUNG; Jin-San ; et al.	2014-11-13
Novel Compound Having Angiogenesis Inhibitory Activity, Method for Preparing Same, and Pharmaceutical Composition Comprising Same App 20140256711 - Kim; Ji Han ; et al.	2014-09-11
Antihypertensive pharmaceutical composition Grant 8,765,776 - Kim , et al. July 1, 2	2014-07-01
Cmp Pad Conditioner App 20140154960 - Lee; Seh Kwang ; et al.	2014-06-05
Pad Conditioning and Wafer Retaining Ring and Manufacturing Method Thereof App 20140154956 - LEE; Seh Kwang ; et al.	2014-06-05
Cmp Pad Conditioner, And Method For Producing The Cmp Pad Conditioner App 20140094101 - Lee; Seh Kwang ; et al.	2014-04-03
Conditioner For Soft Pad And Method For Manufacturing Same App 20130344779 - Lee; Seh Kwang ; et al.	2013-12-26
Slot-Mounted Printed Circuit Board Having Small Insertion Force App 20130314887 - Jung; Jin-San ; et al.	2013-11-28
Semiconductor module socket apparatus Grant 8,587,946 - Lee , et al. November 19, 2	2013-11-19
Antihypertensive Pharmaceutical Composition App 20120264772 - Kim; Seung Ho ; et al.	2012-10-18
Semiconductor Module And System Including The Same App 20120182653 - LEE; Joo-Han ; et al.	2012-07-19
Pad Conditioner Having Reduced Friction And Method Of Manufacturing The Same App 20110250826 - YOON; So Young ; et al.	2011-10-13
Semiconductor Package Module Having Self-assembled Insulation Thin Film And Method Of Manufacturing The Semiconductor Package Module App 20110194260 - Jung; Jin-san ; et al.	2011-08-11
Semiconductor Module Socket Apparatus App 20110170264 - Lee; Joo-han ; et al.	2011-07-14
Conditioner for Chemical Mechanical Planarization Pad App 20100015898 - An; Jung Soo ; et al.	2010-01-21
Method Of Electroless Plating App 20100015362 - LEE; Joo-Han ; et al.	2010-01-21
Conditioner for chemical mechanical planarization pad App 20060128288 - An; Jung Soo ; et al.	2006-06-15

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