Lee; Jae Kul
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lee; Jae Kul.The latest application filed is for "semiconductor package".
- Lee; Jae Kul - Suwon-si KR
- Lee; Jae Kul - Suson-Si KR
- Lee; Jae-Kul - Sejong KR
- LEE; Jae-Kul - Suwon KR
- Lee; Jae-Kul - Seoul N/A KR
| Patent | Date |
|---|---|
| Semiconductor package Grant 10,847,476 - Myung , et al. November 24, 2 | 2020-11-24 |
| Fan-out sensor package Grant 10,748,828 - Jung , et al. A | 2020-08-18 |
| Semiconductor package Grant 10,741,498 - Heo , et al. A | 2020-08-11 |
| Electronic component package with electromagnetic wave shielding Grant 10,692,791 - Kuroyanagi , et al. | 2020-06-23 |
| Semiconductor Package App 20200168565 - Myung; Jun Woo ; et al. | 2020-05-28 |
| Fan-out sensor package and optical-type fingerprint sensor module including the same Grant 10,629,641 - Lee | 2020-04-21 |
| Fan-out sensor package Grant 10,615,212 - Jung , et al. | 2020-04-07 |
| Semiconductor Package App 20200020638 - Heo; Yu Seon ; et al. | 2020-01-16 |
| Electronic Component Package App 20190371692 - KUROYANAGI; Akihisa ; et al. | 2019-12-05 |
| Fan-out semiconductor package Grant 10,438,927 - Jung , et al. O | 2019-10-08 |
| Fan-out Sensor Package App 20190237375 - JUNG; Ha Yong ; et al. | 2019-08-01 |
| Fan-out Sensor Package App 20190189667 - JUNG; Ha Yong ; et al. | 2019-06-20 |
| Fan-out Semiconductor Package App 20190189589 - JUNG; Ha Yong ; et al. | 2019-06-20 |
| Fan-out Sensor Package And Optical-type Fingerprint Sensor Module Including The Same App 20190123082 - LEE; Jae Kul | 2019-04-25 |
| Method of manufacturing insulation film and printed circuit board Grant 9,907,182 - Ham , et al. February 27, 2 | 2018-02-27 |
| Method Of Manufacturing Insulation Film And Printed Circuit Board App 20170086303 - HAM; Ho-Hyung ; et al. | 2017-03-23 |
| Common Mode Filter And Manufacturing Method Thereof App 20160055964 - PARK; Seung-Wook ; et al. | 2016-02-25 |
| Circuit board and method of manufacturing the same Grant 9,035,196 - Park , et al. May 19, 2 | 2015-05-19 |
| Method of manufacturing a printed circuit board (PCB) Grant 8,929,091 - Han , et al. January 6, 2 | 2015-01-06 |
| Circuit Board And Method Of Manufacturing The Same App 20140174809 - PARK; Seung Wook ; et al. | 2014-06-26 |
| Method Of Processing Cavity Of Core Substrate App 20140123486 - JEONG; Jin-Soo ; et al. | 2014-05-08 |
| Method of processing cavity of core substrate Grant 8,633,397 - Jeong , et al. January 21, 2 | 2014-01-21 |
| Electro device embedded printed circuit board and manufacturing method thereof Grant 8,284,562 - Lee , et al. October 9, 2 | 2012-10-09 |
| Bare chip embedded PCB Grant 8,184,448 - Han , et al. May 22, 2 | 2012-05-22 |
| Method of manufacturing a PCB having an embedded bare chip App 20110277320 - Han; Kyung-Jin ; et al. | 2011-11-17 |
| Electro Device Embedded Printed Circuit Board And Manufacturing Method Thereof App 20110216513 - LEE; Doo-Hwan ; et al. | 2011-09-08 |
| Method of manufacturing a component-embedded printed circuit board Grant 8,011,086 - Lee , et al. September 6, 2 | 2011-09-06 |
| Printed circuit board and manufacturing method thereof Grant 7,947,906 - Lee , et al. May 24, 2 | 2011-05-24 |
| Method Of Processing Cavity Of Core Substrate App 20110048780 - Jeong; Jin-Soo ; et al. | 2011-03-03 |
| Semiconductor chip having alignment mark and method of manufacturing the same Grant 7,812,465 - Lee , et al. October 12, 2 | 2010-10-12 |
| Semiconductor chip having alignment mark and method of manufacturing the same App 20090315194 - Lee; Jae Kul ; et al. | 2009-12-24 |
| Printed circuit board with weak magnetic field sensor Grant 7,394,249 - Kang , et al. July 1, 2 | 2008-07-01 |
| Method of manufacturing a component-embedded printed circuit board App 20080052906 - Lee; Doo-Hwan ; et al. | 2008-03-06 |
| Bare chip embedded PCB and method of the same App 20070181988 - Han; Kyung-Jin ; et al. | 2007-08-09 |
| Printed circuit board and manufacturing method thereof App 20070074900 - Lee; Doo-Hwan ; et al. | 2007-04-05 |
| Eccentric rotor and vibration motor having the rotor App 20060255670 - Ki; Hyun-Seung ; et al. | 2006-11-16 |
| Printed circuit board with weak magnetic field sensor and method of fabricating the same App 20060001422 - kang; Myung-Sam ; et al. | 2006-01-05 |
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