| Patent | Date |
|---|
Semiconductor package structures and methods of manufacturing the same
Grant 11,456,261 - Lee , et al. September 27, 2 | 2022-09-27 |
Directionally Tunable Optical Reflector
App 20220299707 - Chen; Yu-Hao ; et al. | 2022-09-22 |
Semiconductor Structure And Method Of Manufacturing A Semiconductor Structure
App 20220246818 - CHEN; Yu-Hao ; et al. | 2022-08-04 |
Methods For Making Semiconductor-based Integrated Circuits
App 20220197129 - CHEN; YU-HAO ; et al. | 2022-06-23 |
Semiconductor Package Structures And Methods Of Manufacturing The Same
App 20220165682 - LEE; Hui-Yu ; et al. | 2022-05-26 |
Heat Dissipation Structures
App 20210375717 - HUANG; Po-Hsiang ; et al. | 2021-12-02 |
Method for making a semiconductor device
Grant 11,170,150 - Chang , et al. November 9, 2 | 2021-11-09 |
Electromagnetic Shielding Metal-insulator-metal Capacitor Structure
App 20210320072 - LEE; Hui Yu ; et al. | 2021-10-14 |
Integrated Circuit, Semiconductor Device And Method Of Manufacturing Same
App 20210305213 - CHEN; Chih-Lin ; et al. | 2021-09-30 |
Entangled Inductor Structures
App 20210257156 - CHANG; Ka Fai ; et al. | 2021-08-19 |
Heat dissipation structure including stacked chips surrounded by thermal interface material rings
Grant 11,094,608 - Huang , et al. August 17, 2 | 2021-08-17 |
Electromagnetic shielding metal-insulator-metal capacitor structure
Grant 11,088,084 - Lee , et al. August 10, 2 | 2021-08-10 |
Integrated circuit including a first semiconductor wafer and a second semiconductor wafer, semiconductor device including a first semiconductor wafer and a second semiconductor wafer and method of manufacturing same
Grant 11,043,473 - Chen , et al. June 22, 2 | 2021-06-22 |
Structure and Method for Cooling Three-Dimensional Integrated Circuits
App 20210159225 - Lee; Hui-Yu ; et al. | 2021-05-27 |
Solenoid inductors within a multi-chip package
Grant 10,971,485 - Lee , et al. April 6, 2 | 2021-04-06 |
Entangled inductor structures
Grant 10,943,729 - Chang , et al. March 9, 2 | 2021-03-09 |
Method And System For Verifying Integrated Circuit Stack Having Photonic Device
App 20210057365 - Kuo; Feng-Wei ; et al. | 2021-02-25 |
Structure and method for cooling three-dimensional integrated circuits
Grant 10,910,365 - Lee , et al. February 2, 2 | 2021-02-02 |
Structure and method for cooling three-dimensional integrated circuits
Grant 10,763,253 - Lee , et al. Sep | 2020-09-01 |
Electromagnetic Shielding Metal-insulator-metal Capacitor Structure
App 20200258846 - A1 | 2020-08-13 |
Photonic Heater
App 20200252999 - Kind Code | 2020-08-06 |
Soic Chip Architecture
App 20200168527 - CHANG; Fong-Yuan ; et al. | 2020-05-28 |
Electromagnetic shielding metal-insulator-metal capacitor structure
Grant 10,665,550 - Lee , et al. | 2020-05-26 |
Method For Making A Semiconductor Device
App 20200151382 - CHANG; Chi-Wen ; et al. | 2020-05-14 |
Solenoid Inductors Within A Multi-chip Package
App 20200135709 - LEE; Hui Yu ; et al. | 2020-04-30 |
Entangled Inductor Structures
App 20200135388 - CHANG; Ka Fai ; et al. | 2020-04-30 |
Configurable heating device and method of using the same
Grant 10,634,972 - Lee , et al. | 2020-04-28 |
Photonic heater
Grant 10,638,543 - Lee | 2020-04-28 |
Integrated Circuit, Semiconductor Device And Method Of Manufacturing Same
App 20200126952 - CHEN; Chih-Lin ; et al. | 2020-04-23 |
System for manufacturing a semiconductor device
Grant 10,540,475 - Chang , et al. Ja | 2020-01-21 |
Electromagnetic Shielding Metal-insulator-metal Capacitor Structure
App 20200020644 - LEE; Hui Yu ; et al. | 2020-01-16 |
Second semiconductor wafer attached to a first semiconductor wafer with a through hole connected to an inductor
Grant 10,535,635 - Chen , et al. Ja | 2020-01-14 |
Heat Dissipation Structures
App 20200006194 - HUANG; Po-Hsiang ; et al. | 2020-01-02 |
Structure and Method for Cooling Three-Dimensional Integrated Circuits
App 20200006325 - Lee; Hui Yu ; et al. | 2020-01-02 |
A Second Semiconductor Wafer Attached To A First Semiconductor Wafer With A Through Hole Connected To An Inductor
App 20190385980 - CHEN; Chih-Lin ; et al. | 2019-12-19 |
Methods and systems to estimate power network noise
Grant 10,467,375 - Lee , et al. No | 2019-11-05 |
Configurable Heating Device And Method Of Using The Same
App 20190129272 - LEE; Hui-Yu ; et al. | 2019-05-02 |
Method and system for frequency-aware input/output signal integrity analysis
Grant 10,268,788 - Lee , et al. | 2019-04-23 |
Photonic Heater
App 20190069347 - LEE; HUI YU | 2019-02-28 |
System For Manufacturing A Semiconductor Device
App 20190034578 - CHANG; Chi-Wen ; et al. | 2019-01-31 |
Interposer and semiconductor package with noise suppression features
Grant 10,192,833 - Kuo , et al. Ja | 2019-01-29 |
Configurable Heating Device
App 20180373113 - LEE; Hui-Yu ; et al. | 2018-12-27 |
Semiconductor structure
Grant 10,163,787 - Lee , et al. Dec | 2018-12-25 |
Configurable heating device
Grant 10,162,244 - Lee , et al. Dec | 2018-12-25 |
Method and apparatus of a three dimensional integrated circuit
Grant 10,157,252 - Chang , et al. Dec | 2018-12-18 |
Method And System For Frequency-aware Input/output Signal Integrity Analysis
App 20180336305 - LEE; HUI-YU ; et al. | 2018-11-22 |
Method of manufacturing a semiconductor device
Grant 10,095,827 - Chang , et al. October 9, 2 | 2018-10-09 |
Method Of Manufacturing A Semiconductor Device
App 20180225407 - CHANG; Chi-Wen ; et al. | 2018-08-09 |
Methods And Systems To Estimate Power Network Noise
App 20180165407 - LEE; Hui Yu ; et al. | 2018-06-14 |
Method and system for manufacturing a semiconductor device
Grant 9,934,352 - Chang , et al. April 3, 2 | 2018-04-03 |
Structure and Method for Cooling Three-Dimensional Integrated Circuits
App 20170358572 - Lee; Hui-Yu ; et al. | 2017-12-14 |
Semiconductor Structure
App 20170300611 - LEE; Hui Yu ; et al. | 2017-10-19 |
Integrated circuit design method and system with color-coded components
Grant 9,773,089 - Lee , et al. September 26, 2 | 2017-09-26 |
Structure and method for cooling three-dimensional integrated circuits
Grant 9,748,228 - Lee , et al. August 29, 2 | 2017-08-29 |
Semiconductor structure having a plurality of conductive paths
Grant 9,698,099 - Lee , et al. July 4, 2 | 2017-07-04 |
Partitioning method and system for 3D IC
Grant 9,514,261 - Liu , et al. December 6, 2 | 2016-12-06 |
Integrated Circuit Design Method And System With Color-coded Components
App 20160321392 - LEE; Hui Yu ; et al. | 2016-11-03 |
Method and Apparatus of a Three Dimensional Integrated Circuit
App 20160259877 - Chang; Chi-Wen ; et al. | 2016-09-08 |
Method of performing circuit simulation and generating circuit layout
Grant 9,411,926 - Lee , et al. August 9, 2 | 2016-08-09 |
Integrated circuit design system with color-coded component loading estimate display
Grant 9,390,218 - Lee , et al. July 12, 2 | 2016-07-12 |
Variation modeling
Grant 9,367,654 - Chang , et al. June 14, 2 | 2016-06-14 |
Method and apparatus of a three dimensional integrated circuit
Grant 9,355,205 - Chang , et al. May 31, 2 | 2016-05-31 |
Multi-patterning system and method using pre-coloring or locked patterns
Grant 9,335,624 - Lee , et al. May 10, 2 | 2016-05-10 |
Integrated circuit design system with balanced color assignment
Grant 9,292,646 - Lee March 22, 2 | 2016-03-22 |
Method And System For Manufacturing A Semiconductor Device
App 20160070839 - CHANG; Chi-Wen ; et al. | 2016-03-10 |
Interposer And Semiconductor Package With Noise Suppression Features
App 20160071805 - KUO; Feng-Wei ; et al. | 2016-03-10 |
Method of creating spiral inductor having high Q value
Grant 9,269,485 - Chang , et al. February 23, 2 | 2016-02-23 |
Variation Modeling
App 20150379174 - Chang; Chi-Wen ; et al. | 2015-12-31 |
Integrated Circuit Design System With Balanced Color Assignment
App 20150370945 - LEE; Hui Yu | 2015-12-24 |
Interposer and semiconductor package with noise suppression features
Grant 9,219,039 - Kuo , et al. December 22, 2 | 2015-12-22 |
Method, system and computer program product for designing semiconductor device
Grant 9,213,797 - Chang , et al. December 15, 2 | 2015-12-15 |
Integrated Circuit Design System With Color-coded Component Loading Estimate Display
App 20150254389 - LEE; Hui Yu ; et al. | 2015-09-10 |
Variation factor assignment
Grant 9,129,082 - Chang , et al. September 8, 2 | 2015-09-08 |
Semiconductor Structure
App 20150228576 - LEE; Hui Yu ; et al. | 2015-08-13 |
Method and Apparatus of a Three Dimensional Integrated Circuit
App 20150179568 - Chang; Chi-Wen ; et al. | 2015-06-25 |
Semiconductor structure and method of generating masks for making integrated circuit
Grant 9,053,255 - Lee , et al. June 9, 2 | 2015-06-09 |
Partitioning Method And System For 3d Ic
App 20150149977 - LIU; Heng Kai ; et al. | 2015-05-28 |
Method, System And Computer Program Product For Designing Semiconductor Device
App 20150143311 - CHANG; Chi-Wen ; et al. | 2015-05-21 |
Multi-patterning System And Method
App 20150121317 - LEE; Hui Yu ; et al. | 2015-04-30 |
Structure And Method For Cooling Three-dimensional Integrated Circuits
App 20150060039 - LEE; HUI-YU ; et al. | 2015-03-05 |
Partitioning method and system for 3D IC
Grant 8,966,426 - Liu , et al. February 24, 2 | 2015-02-24 |
Method of radio-frequency and microwave device generation
Grant 8,856,701 - Chen , et al. October 7, 2 | 2014-10-07 |
Method of reducing parasitic mismatch
Grant 8,850,374 - Huang , et al. September 30, 2 | 2014-09-30 |
Method Of Radio-frequency And Microwave Device Generation
App 20140282308 - Chen; Chin-Sheng ; et al. | 2014-09-18 |
Method Of Performing Circuit Simulation And Generating Circuit Layout
App 20140282310 - LEE; Hui Yu ; et al. | 2014-09-18 |
Variation Factor Assignment
App 20140245242 - Chang; Chi-Wen ; et al. | 2014-08-28 |
Method of performing circuit simulation and generating circuit layout
Grant 8,769,476 - Lee , et al. July 1, 2 | 2014-07-01 |
Method of Reducing Parasitic Mismatch
App 20140130001 - Huang; Char-Ming ; et al. | 2014-05-08 |
Semiconductor Structure And Method Of Generating Masks For Making Integrated Circuit
App 20140103545 - LEE; Hui Yu ; et al. | 2014-04-17 |
Macro cell based process design kit for advanced applications
Grant 8,701,055 - Lee , et al. April 15, 2 | 2014-04-15 |
Interposer And Semiconductor Package With Noise Suppression Features
App 20140001609 - KUO; Feng-Wei ; et al. | 2014-01-02 |
System and method for reducing layout-dependent effects
Grant 8,621,409 - Lee , et al. December 31, 2 | 2013-12-31 |
Method Of Performing Circuit Simulation And Generating Circuit Layout
App 20130298091 - LEE; Hui Yu ; et al. | 2013-11-07 |
System And Method For Reducing Layout-dependent Effects
App 20130290916 - LEE; Hui Yu ; et al. | 2013-10-31 |
Interposer And Semiconductor Package With Noise Suppression Features
App 20130134553 - Kuo; Feng Wei ; et al. | 2013-05-30 |
Data correction apparatus, data correction method and tangible machine-readable medium thereof
Grant 8,073,825 - Sheu , et al. December 6, 2 | 2011-12-06 |
Method of Creating Spiral Inductor having High Q Value
App 20110227689 - Chang; Shih-Cheng ; et al. | 2011-09-22 |
Data Correction Apparatus, Data Correction Method And Tangible Machine-readable Medium Thereof
App 20100153817 - SHEU; Shiann-Tsong ; et al. | 2010-06-17 |
Method Of Creating Spiral Inductor Having High Q Value
App 20090140383 - Chang; Shih-Cheng ; et al. | 2009-06-04 |
| 