Lee; Hee Kon

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lee; Hee Kon.The latest application filed is for "interposer-embedded printed circuit board".

Company Profile

0.7.8

Lee; Hee Kon - Gyunggi-do KR
Lee; Hee Kon - Hwaseong-si N/A KR
Lee; Hee Kon - Hwaseong KR
Lee; Hee Kon - US
Lee, Hee Kon - Suwon KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Interposer-embedded printed circuit board Grant 8,830,689 - Kim , et al. September 9, 2	2014-09-09
Stacked wafer level package and method of manufacturing the same Grant 8,704,350 - Park , et al. April 22, 2	2014-04-22
Method of manufacturing stacked wafer level package Grant 8,658,467 - Park , et al. February 25, 2	2014-02-25
Interposer-embedded Printed Circuit Board App 20120067636 - KIM; Jin Gu ; et al.	2012-03-22
Semiconductor chip package and method of manufacturing the same App 20110198749 - Lee; Hee Kon ; et al.	2011-08-18
Method of manufacturing wafer level package including coating resin over the dicing lines App 20110201156 - Kim; Jin Gu ; et al.	2011-08-18
Package Substrate And Method Of Fabricating The Same App 20110156241 - HONG; Ju Pyo ; et al.	2011-06-30
Method of manufacturing stacked wafer level package App 20110129960 - Park; Seung Wook ; et al.	2011-06-02
Method of manufacturing wafer level package including coating and removing resin over the dicing lines Grant 7,947,530 - Kim , et al. May 24, 2	2011-05-24
Method of manufacturing wafer level package App 20100159646 - Kim; Jin Gu ; et al.	2010-06-24
Stacked wafer level package and method of manufacturing the same App 20100117218 - Park; Seung Wook ; et al.	2010-05-13
Laminated ceramic coupler App 20050062557 - Kang, Nam Ig ; et al.	2005-03-24

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