loadpatents
Patent applications and USPTO patent grants for Lee; Hao-Chung.The latest application filed is for "light emitting device".
Patent | Date |
---|---|
Light Emitting Device App 20210159369 - Hung; Cheng-Wei ;   et al. | 2021-05-27 |
Light emitting device Grant 10,910,523 - Hung , et al. February 2, 2 | 2021-02-02 |
Light emitting diode module Grant D886,751 - Lee , et al. | 2020-06-09 |
Light emitting diode package Grant D854,195 - Lee , et al. July 16, 2 | 2019-07-16 |
Light emitting module Grant 10,147,709 - Lee , et al. De | 2018-12-04 |
Light Emitting Device App 20180294388 - Hung; Cheng-Wei ;   et al. | 2018-10-11 |
Package method and package Grant 10,090,445 - Hung , et al. October 2, 2 | 2018-10-02 |
Manufacturing Method Of Semiconductor Light-emitting Device App 20180261572 - Hung; Chin-Hua ;   et al. | 2018-09-13 |
Light emitting device using metal substrate for improving heat dissipation efficiency Grant 10,064,272 - Lee , et al. August 28, 2 | 2018-08-28 |
Package Substrate And Package Structure Using The Same App 20180240780 - Lee; Hao-Chung ;   et al. | 2018-08-23 |
Light emitting device and manufacturing method thereof Grant 9,997,676 - Hung , et al. June 12, 2 | 2018-06-12 |
Light Emitting Device Package Structure And Manufacturing Method Thereof App 20180151781 - Lee; Hao-Chung ;   et al. | 2018-05-31 |
Package substrate and package structure using the same Grant 9,953,956 - Lee , et al. April 24, 2 | 2018-04-24 |
Light Emitting Device App 20180049319 - Lee; Hao-Chung ;   et al. | 2018-02-15 |
Light Emitting Module App 20180040594 - Lee; Hao-Chung ;   et al. | 2018-02-08 |
Light emitting device Grant 9,801,274 - Lee , et al. October 24, 2 | 2017-10-24 |
Package Method And Package App 20170288100 - Hung; Chin-Hua ;   et al. | 2017-10-05 |
Light emitting diode package Grant D796,456 - Lee , et al. September 5, 2 | 2017-09-05 |
Light emitting diode package substrate Grant D790,487 - Lee , et al. June 27, 2 | 2017-06-27 |
Package method and package Grant 9,685,596 - Hung , et al. June 20, 2 | 2017-06-20 |
Light Emitting Device And Manufacturing Method Thereof App 20170005238 - Hung; Cheng-Wei ;   et al. | 2017-01-05 |
Light emitting diode package substrate Grant D772,181 - Lee , et al. November 22, 2 | 2016-11-22 |
Light-emitting Diode (led) Package App 20160293806 - Lee; Hao-Chung ;   et al. | 2016-10-06 |
Package Substrate And Package Structure Using The Same App 20160284666 - Lee; Hao-Chung ;   et al. | 2016-09-29 |
Chip Package Structure And Method Of Manufacturing The Same App 20160276546 - Lee; Hao-Chung ;   et al. | 2016-09-22 |
Semiconductor Light-emitting Device And The Manufacturing Method Thereof App 20160276320 - Hung; Chin-Hua ;   et al. | 2016-09-22 |
Light emitting diode package substrate Grant D762,596 - Lee , et al. August 2, 2 | 2016-08-02 |
Light emitting diode module Grant D761,213 - Lee , et al. July 12, 2 | 2016-07-12 |
Light emitting diode package Grant D761,214 - Lee , et al. July 12, 2 | 2016-07-12 |
Light Emitting Device App 20160123568 - Lee; Hao-Chung ;   et al. | 2016-05-05 |
Light Emitting Module App 20160013166 - Lee; Hao-Chung ;   et al. | 2016-01-14 |
Light Emitting Device Package Structure And Manufacturing Method Thereof App 20150333227 - Lee; Hao-Chung ;   et al. | 2015-11-19 |
Package Method And Package App 20150318453 - Hung; Chin-Hua ;   et al. | 2015-11-05 |
Light Emitting Diode Package Structure App 20150311190 - Tsai; Meng-Ting ;   et al. | 2015-10-29 |
Liquid level sensor Grant 9,027,399 - Huang , et al. May 12, 2 | 2015-05-12 |
Support mechanism Grant 8,882,974 - Huang , et al. November 11, 2 | 2014-11-11 |
Cleaning Device App 20140060592 - PAN; HAI-FENG ;   et al. | 2014-03-06 |
System And Method Of Electrolytic Deburring For Metal Pieces App 20130233724 - HSU; HSING-JEN ;   et al. | 2013-09-12 |
Support Mechanism App 20130228455 - HUANG; TIAN-FENG ;   et al. | 2013-09-05 |
Liquid Level Sensor App 20130213495 - HUANG; TIAN-FENG ;   et al. | 2013-08-22 |
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