Le Vaillant; Yves Mathieu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Le Vaillant; Yves Mathieu.The latest application filed is for "wafer and method of producing a substrate by transfer of a layer that includes foreign species".

Company Profile

0.6.9

Le Vaillant; Yves Mathieu - Crolles FR
Le Vaillant; Yves-Mathieu - Grenoble FR
Le Vaillant, Yves Mathieu - Crolles Cedex FR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Wafer and method of producing a substrate by transfer of a layer that includes foreign species Grant 7,645,684 - Letertre , et al. January 12, 2	2010-01-12
Wafer and method of producing a substrate by transfer of a layer that includes foreign species Grant 7,535,115 - Letertre , et al. May 19, 2	2009-05-19
Wafer And Method Of Producing A Substrate By Transfer Of A Layer That Includes Foreign Species App 20080248631 - Letertre; Fabrice ; et al.	2008-10-09
Recycling a wafer comprising a buffer layer, after having separated a thin layer therefrom Grant 7,378,729 - Ghyselen , et al. May 27, 2	2008-05-27
Recycling of a wafer comprising a multi-layer structure after taking-off a thin layer Grant 7,256,075 - Ghyselen , et al. August 14, 2	2007-08-14
Tools and methods for disuniting semiconductor wafers Grant 7,187,162 - Kerdiles , et al. March 6, 2	2007-03-06
Method of fabricating a structure with an oxide layer of a desired thickness on a Ge or SiGe substrate App 20060270244 - Daval; Nicolas ; et al.	2006-11-30
Substrate with refractive index matching App 20060197096 - Kerdiles; Sebastien ; et al.	2006-09-07
Recycling a wafer comprising a buffer layer, after having separated a thin layer therefrom App 20060076578 - Ghyselen; Bruno ; et al.	2006-04-13
Wafer and method of producing a substrate by transfer of a layer that includes foreign species App 20060060922 - Letertre; Fabrice ; et al.	2006-03-23
Wafer and method of producing a substrate by transfer of a layer that includes foreign species Grant 7,008,859 - Letertre , et al. March 7, 2	2006-03-07
Methods for producing a semiconductor entity App 20050191779 - Le Vaillant, Yves Mathieu ; et al.	2005-09-01
Recycling of a wafer comprising a multi-layer structure after taking-off a thin layer App 20050167002 - Ghyselen, Bruno ; et al.	2005-08-04
Tools and methods for disuniting semiconductor wafers App 20040166653 - Kerdiles, Sebastien ; et al.	2004-08-26
Wafer and method of producing a substrate by transfer of a layer that includes foreign species App 20040121558 - Letertre, Fabrice ; et al.	2004-06-24

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