| Patent | Date |
|---|
Method For Manufacturing A Hybrid Structure
App 20220278269 - Landru; Didier | 2022-09-01 |
Removable structure and removal method using the structure
Grant 11,424,156 - Landru , et al. August 23, 2 | 2022-08-23 |
System For Fracturing A Plurality Of Wafer Assemblies
App 20220181173 - Landru; Didier ; et al. | 2022-06-09 |
Method For Transferring A Useful Layer Onto A Support Substrate
App 20220172983 - Landru; Didier ; et al. | 2022-06-02 |
Method for manufacturing a hybrid structure
Grant 11,349,065 - Landru May 31, 2 | 2022-05-31 |
Method For Transferring A Use Ful Layer To A Carrier Substrate
App 20220157650 - Landru; Didier ; et al. | 2022-05-19 |
Method For Transferring A Useful Layer Onto A Support Substrate
App 20220157651 - Landru; Didier ; et al. | 2022-05-19 |
Method For Transferring Blocks From A Donor Substrate Onto A Receiver Substrate
App 20220148911 - Landru; Didier ; et al. | 2022-05-12 |
Process for smoothing the surface of a semiconductor-on-insulator substrate
Grant 11,276,605 - Kononchuk , et al. March 15, 2 | 2022-03-15 |
Holding Device For An Assembly That Is To Be Fractured
App 20220059370 - Landru; Didier ; et al. | 2022-02-24 |
Method for producing a donor substrate for creating a three-dimensional integrated structure, and method for producing such an integrated structure
Grant 11,239,108 - Gaudin , et al. February 1, 2 | 2022-02-01 |
Vertical furnace with device for trapping contaminants
Grant 11,219,851 - Landru , et al. January 11, 2 | 2022-01-11 |
Substrates Including Useful Layers
App 20210202302 - Landru; Didier ; et al. | 2021-07-01 |
Method Of Mechanical Separation For A Double Layer Transfer
App 20210118717 - Broekaart; Marcel ; et al. | 2021-04-22 |
Method for transferring a useful layer
Grant 10,950,491 - Landru , et al. March 16, 2 | 2021-03-16 |
Method For Producing A Donor Substrate For Creating A Three-dimensional Integrated Structure, And Method For Producing Such An Integrated Structure
App 20210057268 - Gaudin; Gweltaz ; et al. | 2021-02-25 |
Removable Structure And Removal Method Using The Structure
App 20210050249 - Landru; Didier ; et al. | 2021-02-18 |
Method of mechanical separation for a double layer transfer
Grant 10,910,250 - Broekaart , et al. February 2, 2 | 2021-02-02 |
Method For Detecting The Splitting Of A Substrate Weakened By Implanting Atomic Species
App 20210028036 - Rieutord; Francois ; et al. | 2021-01-28 |
Process For Transferring A Thin Layer To A Support Substrate That Have Different Thermal Expansion Coefficients
App 20200186117 - Huyet; Isabelle ; et al. | 2020-06-11 |
Vertical Furnace With Device For Trapping Contaminants
App 20200054978 - Landru; Didier ; et al. | 2020-02-20 |
Thermal treatment system with collector device
Grant 10,510,565 - Landru , et al. Dec | 2019-12-17 |
Process For Smoothing The Surface Of A Semiconductor-on-insulator Substrate
App 20190348319 - Kononchuk; Oleg ; et al. | 2019-11-14 |
Method For Transferring A Useful Layer
App 20190221471 - Landru; Didier ; et al. | 2019-07-18 |
Structure for radiofrequency applications
Grant 10,250,282 - Kononchuk , et al. | 2019-04-02 |
Method for separating a layer from a composite structure
Grant 10,220,603 - Landru | 2019-03-05 |
Process for smoothing the surface of a structure
Grant 10,134,602 - Landru , et al. November 20, 2 | 2018-11-20 |
Composite Structure And Associated Production Method
App 20180316329 - Guenard; Pascal ; et al. | 2018-11-01 |
Method For Manufacturing A Hybrid Structure
App 20180309045 - Landru; Didier | 2018-10-25 |
Method for separating at least two substrates along a selected interface
Grant 10,093,086 - Landru , et al. October 9, 2 | 2018-10-09 |
Thermal Treatment System With Collector Device
App 20180102264 - Landru; Didier ; et al. | 2018-04-12 |
Method for transferring a useful layer
Grant 9,922,867 - Landru , et al. March 20, 2 | 2018-03-20 |
Device for separating two substrates
Grant 9,914,233 - Landru March 13, 2 | 2018-03-13 |
Method for dissolving a silicon dioxide layer
Grant 9,911,624 - Landru , et al. March 6, 2 | 2018-03-06 |
Process for manufacturing a plurality of structures
Grant 9,875,914 - Landru , et al. January 23, 2 | 2018-01-23 |
Structure For Radiofrequency Applications
App 20170331501 - Kononchuk; Oleg ; et al. | 2017-11-16 |
Process for manufacturing a composite structure
Grant 9,799,549 - Kerdiles , et al. October 24, 2 | 2017-10-24 |
Assembly process of two substrates
Grant 9,718,261 - Landru , et al. August 1, 2 | 2017-08-01 |
Process For Smoothing The Surface Of A Structure
App 20170207101 - Landru; Didier ; et al. | 2017-07-20 |
Process for stabilizing a bonding interface, located within a structure which comprises an oxide layer and structure obtained
Grant 9,659,777 - Landru , et al. May 23, 2 | 2017-05-23 |
Process for fabrication of a structure with a view to a subsequent separation
Grant 9,607,879 - Landru March 28, 2 | 2017-03-28 |
Method for transferring a useful layer
Grant 9,589,830 - Landru , et al. March 7, 2 | 2017-03-07 |
Method For Dissolving A Silicon Dioxide Layer
App 20170062236 - Landru; Didier ; et al. | 2017-03-02 |
Method For Separating At Least Two Substrates Along A Selected Interface
App 20160368259 - Landru; Didier ; et al. | 2016-12-22 |
Process For Manufacturing A Plurality Of Structures
App 20160372342 - Landru; Didier ; et al. | 2016-12-22 |
Method Of Mechanical Separation For A Double Layer Transfer
App 20160358805 - Broekaart; Marcel ; et al. | 2016-12-08 |
Method for dissolving a silicon dioxide layer
Grant 9,514,960 - Landru , et al. December 6, 2 | 2016-12-06 |
Method for separating at least two substrates along a selected interface
Grant 9,437,473 - Landru , et al. September 6, 2 | 2016-09-06 |
Method For Transferring A Useful Layer
App 20160233125 - Landru; Didier ; et al. | 2016-08-11 |
Assembly Process Of Two Substrates
App 20160152017 - Landru; Didier ; et al. | 2016-06-02 |
Method For Dissolving A Silicon Dioxide Layer
App 20160056052 - Landru; Didier ; et al. | 2016-02-25 |
Process for realizing a connecting structure
Grant 9,224,704 - Landru December 29, 2 | 2015-12-29 |
Electronic device for radiofrequency or power applications and process for manufacturing such a device
Grant 9,198,294 - Landru , et al. November 24, 2 | 2015-11-24 |
Method For Transferring A Useful Layer
App 20150303098 - Landru; Didier ; et al. | 2015-10-22 |
Process to dissolve the oxide layer in the peripheral ring of a structure of semiconductor-on-insulator type
Grant 9,136,113 - Landru , et al. September 15, 2 | 2015-09-15 |
Device For Separating Two Substrates
App 20150231790 - Landru; Didier | 2015-08-20 |
Method For Separating At Least Two Substrates Along A Selected Interface
App 20150221544 - Landru; Didier ; et al. | 2015-08-06 |
Processing For Fabrication Of A Structure With A View To A Subsequent Sepration
App 20150214098 - Landru; Didier | 2015-07-30 |
Process for fabricating a semiconductor structure employing a temporary bond
Grant 8,951,887 - Letertre , et al. February 10, 2 | 2015-02-10 |
Process For Stabilizing A Bonding Interface, Located Within A Structure Which Comprises An Oxide Layer And Structure Obtained
App 20140357093 - Landru; Didier ; et al. | 2014-12-04 |
Method For Separating A Layer From A Composite Structure
App 20140326416 - Landru; Didier | 2014-11-06 |
Substrate Having A Charged Zone In An Insulating Buried Layer
App 20140225182 - Shaheen; Mohamad A. ; et al. | 2014-08-14 |
Substrate having a charged zone in an insulating buried layer
Grant 8,735,946 - Shaheen , et al. May 27, 2 | 2014-05-27 |
Methods for bonding semiconductor structures involving annealing processes, and bonded semiconductor structures and intermediate structures formed using such methods
Grant 8,716,105 - Sadaka , et al. May 6, 2 | 2014-05-06 |
Process To Dissolve The Oxide Layer In The Peripheral Ring Of A Structure Of Semiconductor-on-insulator Type
App 20140030877 - LANDRU; Didier ; et al. | 2014-01-30 |
Substrate Having A Charged Zone In An Insulating Buried Layer
App 20140015023 - Allibert; Frederic ; et al. | 2014-01-16 |
Method of detaching semi-conductor layers at low temperature
Grant 8,623,740 - Landru , et al. January 7, 2 | 2014-01-07 |
Method of producing a layer of cavities
Grant 8,614,501 - Landru December 24, 2 | 2013-12-24 |
Electronic Device For Radiofrequency Or Power Applications And Process For Manufacturing Such A Device
App 20130294038 - Landru; Didier ; et al. | 2013-11-07 |
Substrate having a charged zone in an insulating buried layer
Grant 8,535,996 - Shaheen , et al. September 17, 2 | 2013-09-17 |
Method for producing a stack of semi-conductor thin films
Grant 8,513,092 - Landru August 20, 2 | 2013-08-20 |
Method for manufacturing components
Grant 8,507,332 - Riou , et al. August 13, 2 | 2013-08-13 |
Methods for bonding semiconductor structures involving annealing processes, and bonded semiconductor structures formed using such methods
Grant 8,501,537 - Sadaka , et al. August 6, 2 | 2013-08-06 |
Process for treating a semiconductor-on-insulator structure
Grant 8,497,190 - Landru , et al. July 30, 2 | 2013-07-30 |
Process for measuring an adhesion energy, and associated substrates
Grant 8,429,960 - Landru April 30, 2 | 2013-04-30 |
Process For Fabricating A Semiconductor Structure Employing A Temporary Bond
App 20120329243 - Letertre; Fabrice ; et al. | 2012-12-27 |
Process for locally dissolving the oxide layer in a semiconductor-on-insulator type structure
Grant 8,324,072 - Veytizou , et al. December 4, 2 | 2012-12-04 |
Methods For Bonding Semiconductor Structures Involving Annealing Processes, And Bonded Semiconductor Structures And Intermediate Structures Formed Using Such Methods
App 20120252189 - Sadaka; Mariam ; et al. | 2012-10-04 |
Methods For Bonding Semiconductor Structures Involving Annealing Processes, And Bonded Semiconductor Structures Formed Using Such Methods
App 20120252162 - Sadaka; Mariam ; et al. | 2012-10-04 |
Process For Treating A Semiconductor-on-insulator Structure
App 20120231636 - Landru; Didier ; et al. | 2012-09-13 |
Process For Realising A Connecting Structure
App 20120094469 - Landru; Didier | 2012-04-19 |
Process For Locally Dissolving The Oxide Layer In A Semiconductor-On-Insulator Type Structure
App 20120094496 - Veytizou; Christelle ; et al. | 2012-04-19 |
Process For Measuring An Adhesion Energy, And Associated Substrates
App 20120048007 - Landru; Didier | 2012-03-01 |
Method Of Producing A Layer Of Cavities
App 20110278597 - Landru; Didier | 2011-11-17 |
Process To Dissolve The Oxide Layer In The Peripheral Ring Of A Structure Of Semiconductor-on-insulator Type
App 20110275226 - Landru; Didier ; et al. | 2011-11-10 |
Method For Manufacturing Components
App 20110266651 - Riou; Gregory ; et al. | 2011-11-03 |
Method Of Detaching Semi-conductor Layers At Low Temperature
App 20110207295 - Landru; Didier ; et al. | 2011-08-25 |
Method To Fabricate And Treat A Structure Of Semiconductor-on-insulator Type, Enabling Displacement Of Dislocations, And Corresponding Structure
App 20110193201 - Kononchuk; Oleg ; et al. | 2011-08-11 |
Process For Manufacturing A Structure Comprising A Germanium Layer On A Substrate
App 20110183493 - Daval; Nicolas ; et al. | 2011-07-28 |
Method For Producing A Stack Of Semi-conductor Thin Films
App 20110177673 - Landru; Didier | 2011-07-21 |
Method For Making A Structure Comprising A Step For Implanting Ions In Order To Stabilize The Adhesive Bonding Interface
App 20110165758 - Bourdelle; Konstantin ; et al. | 2011-07-07 |
SOI substrates with a fine buried insulating layer
Grant 7,892,951 - Landru , et al. February 22, 2 | 2011-02-22 |
Substrate Having A Charged Zone In An Insulating Buried Layer
App 20110012200 - Allibert; Frederic ; et al. | 2011-01-20 |
Soi Substrates With A Fine Buried Insulating Layer
App 20090111243 - Landru; Didier ; et al. | 2009-04-30 |
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