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Patent applications and USPTO patent grants for Lan; Chun-Yen.The latest application filed is for "semiconductor device and manufacturing method thereof".
Patent | Date |
---|---|
Semiconductor Device And Manufacturing Method Thereof App 20220223542 - Lin; Yu-Wei ;   et al. | 2022-07-14 |
Chip package and method of forming the same Grant 11,031,376 - Kuan , et al. June 8, 2 | 2021-06-08 |
Semiconductor Structure And Manufacturing Method Thereof App 20210020581 - Kuan; Hsaing-Pin ;   et al. | 2021-01-21 |
Chip Package And Method Of Forming The Same App 20210020607 - Kuan; Hsaing-Pin ;   et al. | 2021-01-21 |
Semiconductor structure and manufacturing method thereof Grant 10,879,192 - Kuan , et al. December 29, 2 | 2020-12-29 |
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