loadpatents
Patent applications and USPTO patent grants for Lan; Chang-Yi.The latest application filed is for "fabrication method of package on package structure".
Patent | Date |
---|---|
Method of fabricating electronic package Grant 10,224,243 - Tang , et al. | 2019-03-05 |
Fabrication Method Of Package On Package Structure App 20180138158 - Tung; Shih-Hao ;   et al. | 2018-05-17 |
Method Of Fabricating Electronic Package App 20180068896 - Tang; Shao-Tzu ;   et al. | 2018-03-08 |
Package on package structure and fabrication method thereof Grant 9,905,546 - Tung , et al. February 27, 2 | 2018-02-27 |
Electronic package and fabrication method thereof Grant 9,805,979 - Tang , et al. October 31, 2 | 2017-10-31 |
Electronic Package And Fabrication Method Thereof App 20160133593 - Tang; Shao-Tzu ;   et al. | 2016-05-12 |
Fabrication method of semiconductor package Grant 9,112,063 - Hsiao , et al. August 18, 2 | 2015-08-18 |
Package On Package Structure And Fabrication Method Thereof App 20150187741 - Tung; Shih-Hao ;   et al. | 2015-07-02 |
Fabrication Method Of Semiconductor Package App 20140308780 - Hsiao; Wei Chung ;   et al. | 2014-10-16 |
Semiconductor package and fabrication method thereof Grant 8,796,867 - Hsiao , et al. August 5, 2 | 2014-08-05 |
Semiconductor Package And Fabrication Method Thereof App 20130307152 - Hsiao; Wei Chung ;   et al. | 2013-11-21 |
Semiconductor Package And Fabrication Method Thereof App 20130292832 - Tang; Shao-Tzu ;   et al. | 2013-11-07 |
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