loadpatents
name:-0.0089609622955322
name:-0.0057148933410645
name:-0.0016279220581055
Lan; Chang-Yi Patent Filings

Lan; Chang-Yi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lan; Chang-Yi.The latest application filed is for "fabrication method of package on package structure".

Company Profile
1.6.9
  • Lan; Chang-Yi - Taichung TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method of fabricating electronic package
Grant 10,224,243 - Tang , et al.
2019-03-05
Fabrication Method Of Package On Package Structure
App 20180138158 - Tung; Shih-Hao ;   et al.
2018-05-17
Method Of Fabricating Electronic Package
App 20180068896 - Tang; Shao-Tzu ;   et al.
2018-03-08
Package on package structure and fabrication method thereof
Grant 9,905,546 - Tung , et al. February 27, 2
2018-02-27
Electronic package and fabrication method thereof
Grant 9,805,979 - Tang , et al. October 31, 2
2017-10-31
Electronic Package And Fabrication Method Thereof
App 20160133593 - Tang; Shao-Tzu ;   et al.
2016-05-12
Fabrication method of semiconductor package
Grant 9,112,063 - Hsiao , et al. August 18, 2
2015-08-18
Package On Package Structure And Fabrication Method Thereof
App 20150187741 - Tung; Shih-Hao ;   et al.
2015-07-02
Fabrication Method Of Semiconductor Package
App 20140308780 - Hsiao; Wei Chung ;   et al.
2014-10-16
Semiconductor package and fabrication method thereof
Grant 8,796,867 - Hsiao , et al. August 5, 2
2014-08-05
Semiconductor Package And Fabrication Method Thereof
App 20130307152 - Hsiao; Wei Chung ;   et al.
2013-11-21
Semiconductor Package And Fabrication Method Thereof
App 20130292832 - Tang; Shao-Tzu ;   et al.
2013-11-07

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