Lai; Zhiming
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lai; Zhiming.The latest application filed is for "chip packaging structure, and packaging method thereof".
- Lai; Zhiming - Jiangsu CN
- LAI; Zhiming - Jingyin CN
- Lai; Zhiming - Jiangyin CN
| Patent | Date |
|---|---|
| Chip packaging structure, and packaging method thereof Grant 10,777,477 - Zhang , et al. September 15, 2 | 2020-09-15 |
| Chip Packaging Structure, And Packaging Method Thereof App 20190214324 - ZHANG; Li ; et al. | 2019-07-11 |
| Led Packaging Structure App 20160322539 - ZHANG; Li ; et al. | 2016-11-03 |
| Method for packaging low-K chip Grant 8,987,055 - Zhang , et al. March 24, 2 | 2015-03-24 |
| Low-k Chip Packaging Structure App 20140191379 - Zhang; Li ; et al. | 2014-07-10 |
| Method For Packaging Low-k Chip App 20140162404 - Zhang; Li ; et al. | 2014-06-12 |
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