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Patent applications and USPTO patent grants for Lack; Craig D..The latest application filed is for "novel polymer films and textile laminates containing such polymer films".
Patent | Date |
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Novel Polymer Films and Textile Laminates Containing Such Polymer Films App 20080143012 - Norvell; Jean ;   et al. | 2008-06-19 |
Unique wine flavor protector App 20080078737 - Brennan; Christopher H. ;   et al. | 2008-04-03 |
Polishing composition Grant 7,070,485 - Lack , et al. July 4, 2 | 2006-07-04 |
Adjustably insulative construct App 20050144696 - Lack, Craig D. ;   et al. | 2005-07-07 |
Adjustably insulative construct Grant 6,910,235 - Lack , et al. June 28, 2 | 2005-06-28 |
Novel polymer films and textile laminates containing such polymer films App 20050136762 - Norvell, Jean ;   et al. | 2005-06-23 |
Novel polymer films and textile laminates containing such polymer films App 20050124242 - Norvell, Jean ;   et al. | 2005-06-09 |
Pressure relief valve in connector assembly of inflatable articles App 20050062284 - Schreiner, Juergen ;   et al. | 2005-03-24 |
Connector assembly for flexible inflatable articles App 20050046182 - Trapp, Benjamin M. ;   et al. | 2005-03-03 |
Adjustably insulative construct App 20040040087 - Lack, Craig D. ;   et al. | 2004-03-04 |
Composition and method for polishing in metal CMP Grant 6,699,299 - Sachan , et al. March 2, 2 | 2004-03-02 |
Polishing of semiconductor substrates Grant 6,641,631 - Thomas , et al. November 4, 2 | 2003-11-04 |
Composition and method for polishing in metal CMP App 20030181046 - Sachan, Vikas ;   et al. | 2003-09-25 |
Composition and method for polishing in metal CMP Grant 6,616,717 - Sachan , et al. September 9, 2 | 2003-09-09 |
Compositions for insulator and metal CMP and methods relating thereto Grant 6,607,424 - Costas , et al. August 19, 2 | 2003-08-19 |
Chemical mechanical planarization of metal substrates Grant 6,602,436 - Mandigo , et al. August 5, 2 | 2003-08-05 |
Dissolution of metal particles produced by polishing Grant 6,602,112 - Tran , et al. August 5, 2 | 2003-08-05 |
CMP polishing composition for semiconductor devices containing organic polymer particles Grant 6,568,997 - Costas , et al. May 27, 2 | 2003-05-27 |
Polishing composition having organic polymer particles App 20020173243 - Costas, Wesley D. ;   et al. | 2002-11-21 |
CMP polishing composition for semiconductor devices containing organic polymer particles App 20020173241 - Costas, Wesley D. ;   et al. | 2002-11-21 |
Chemical mechanical polishing slurries for metal Grant 6,447,373 - Lack , et al. September 10, 2 | 2002-09-10 |
Polishing of semiconductor substrates App 20020083650 - Thomas, Terence M. ;   et al. | 2002-07-04 |
Polishing composition App 20020062600 - Mandigo, Glenn C. ;   et al. | 2002-05-30 |
Chemical mechanical planarization of metal substrates App 20020058426 - Mandigo, Glenn C. ;   et al. | 2002-05-16 |
Control of removal rates in CMP App 20020019202 - Thomas, Terence M. ;   et al. | 2002-02-14 |
Polishing composition App 20010044264 - Lack, Craig D. ;   et al. | 2001-11-22 |
Printing of polishing pads App 20010041511 - Lack, Craig D. ;   et al. | 2001-11-15 |
Dissolution of metal particles produced by polishing App 20010039166 - Tran, Tony Quan ;   et al. | 2001-11-08 |
Retention of a polishing pad on a platen App 20010031612 - Scott, Diane B. ;   et al. | 2001-10-18 |
Composition and method for polishing in metal CMP App 20010024933 - Sachan, Vikas ;   et al. | 2001-09-27 |
Non-slip, waterproof, water vapor permeable fabric Grant 5,948,707 - Crawley , et al. September 7, 1 | 1999-09-07 |
Patch electrode Grant 5,269,810 - Hull , et al. December 14, 1 | 1993-12-14 |
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