| Patent | Date |
|---|
Package structure, package-on-package structure and manufacturing method thereof
Grant 11,456,249 - Wang , et al. September 27, 2 | 2022-09-27 |
Chip Package Structure Including A Silicon Substrate Interposer And Methods For Forming The Same
App 20220302003 - PAN; Kuo Lung ; et al. | 2022-09-22 |
Package structure
Grant 11,444,002 - Lai , et al. September 13, 2 | 2022-09-13 |
Semiconductor Package And Manufacturing Method Thereof
App 20220285289 - Hsieh; Wei-Kang ; et al. | 2022-09-08 |
Semiconductor structure including a first surface mount component and a second surface mount component and method of fabricating the semiconductor structure
Grant 11,424,213 - Chang , et al. August 23, 2 | 2022-08-23 |
Package Structure And Manufacturing Method Of Package Structure Thereof
App 20220262758 - Teng; Po-Yuan ; et al. | 2022-08-18 |
Semiconductor structures
Grant 11,417,638 - Lai , et al. August 16, 2 | 2022-08-16 |
Integrated circuit package and method
Grant 11,417,633 - Yu , et al. August 16, 2 | 2022-08-16 |
Cross-Wafer RDLs in Constructed Wafers
App 20220254656 - YU; Chen-Hua ; et al. | 2022-08-11 |
Package Structure Having Hollow Cylinders And Method Of Fabricating The Same
App 20220246570 - Yu; Chen-Hua ; et al. | 2022-08-04 |
System, device and methods of manufacture
Grant 11,404,316 - Yu , et al. August 2, 2 | 2022-08-02 |
Semiconductor Package And Manufacturing Method Thereof
App 20220238505 - Chen; Shih-Wei ; et al. | 2022-07-28 |
Three-Dimension Large System Integration
App 20220223572 - Yu; Chen-Hua ; et al. | 2022-07-14 |
Semiconductor Package And Manufacturing Method Thereof
App 20220216103 - Teng; Po-Yuan ; et al. | 2022-07-07 |
Semiconductor Device Having A Heat Dissipation Structure Connected Chip Package
App 20220208680 - Teng; Po-Yuan ; et al. | 2022-06-30 |
Package structure and manufacturing method of package structure thereof
Grant 11,355,466 - Teng , et al. June 7, 2 | 2022-06-07 |
Electronic assembly, package structure having hollow cylinders and method of fabricating the same
Grant 11,342,295 - Yu , et al. May 24, 2 | 2022-05-24 |
Package Structure And Method Manufacturing The Same
App 20220157689 - Chen; Shih-Wei ; et al. | 2022-05-19 |
Package structure and method of forming the same
Grant 11,322,421 - Chang , et al. May 3, 2 | 2022-05-03 |
Conical-shaped or tier-shaped pillar connections
Grant 11,315,896 - Kuo , et al. April 26, 2 | 2022-04-26 |
Cross-wafer RDLs in constructed wafers
Grant 11,315,805 - Yu , et al. April 26, 2 | 2022-04-26 |
Manufacturing method of semiconductor package including thermal conductive block
Grant 11,309,302 - Chen , et al. April 19, 2 | 2022-04-19 |
Integrated fan-out packages and methods of forming the same
Grant 11,309,294 - Yu , et al. April 19, 2 | 2022-04-19 |
Semiconductor Device and Method of Manufacture
App 20220108961 - Yu; Chen-Hua ; et al. | 2022-04-07 |
Three-dimension large system integration
Grant 11,296,062 - Yu , et al. April 5, 2 | 2022-04-05 |
Semiconductor Package And Method Of Manufacturing The Same
App 20220102314 - Chen; Shih-Wei ; et al. | 2022-03-31 |
Chip Package And Method Of Forming The Same
App 20220102283 - Pan; Kuo-Lung ; et al. | 2022-03-31 |
Semiconductor package and manufacturing method thereof
Grant 11,289,373 - Teng , et al. March 29, 2 | 2022-03-29 |
Semiconductor device having a heat dissipation structure connected chip package
Grant 11,282,791 - Teng , et al. March 22, 2 | 2022-03-22 |
Semiconductor Device Including Heat Dissipation Structure And Fabricating Method Of The Same
App 20220077024 - Teng; Po-Yuan ; et al. | 2022-03-10 |
Semiconductor Structure And Method Of Fabricating The Same
App 20220077102 - Chang; Mao-Yen ; et al. | 2022-03-10 |
Package Structure
App 20220037228 - Lai; Yu-Chia ; et al. | 2022-02-03 |
Package structure and method of manufacturing the same
Grant 11,239,135 - Chen , et al. February 1, 2 | 2022-02-01 |
Package Structure And Method Of Forming The Same
App 20220013422 - Chang; Mao-Yen ; et al. | 2022-01-13 |
Semiconductor device and method of manufacture
Grant 11,211,346 - Yu , et al. December 28, 2 | 2021-12-28 |
Packages with Thick RDLs and Thin RDLs Stacked Alternatingly
App 20210398905 - Teng; Po-Yuan ; et al. | 2021-12-23 |
Semiconductor package and method of manufacturing the same
Grant 11,205,636 - Chen , et al. December 21, 2 | 2021-12-21 |
Segregated Power and Ground Design for Yield Improvement
App 20210391270 - Chun; Shu-Rong ; et al. | 2021-12-16 |
Method Of Manufacturing Semiconductor Package
App 20210391276 - Chiang; Tsung-Hsien ; et al. | 2021-12-16 |
Chip package and method of forming the same
Grant 11,201,118 - Pan , et al. December 14, 2 | 2021-12-14 |
Semiconductor Package Structure Comprising Rigid-flexible Substrate And Manufacturing Method Thereof
App 20210375770 - Wang; Chuei-Tang ; et al. | 2021-12-02 |
IPD Modules with Flexible Connection Scheme in Packaging
App 20210375840 - Lai; Yu-Chia ; et al. | 2021-12-02 |
Semiconductor Device, Circuit Board Structure And Manufacturing Method Thereof
App 20210366872 - Kuo; Tin-Hao ; et al. | 2021-11-25 |
Integrated circuit package and method
Grant 11,183,487 - Lai , et al. November 23, 2 | 2021-11-23 |
Semiconductor device including heat dissipation structure and fabricating method of the same
Grant 11,177,192 - Teng , et al. November 16, 2 | 2021-11-16 |
Package Structures And Methods Of Manufacturing The Same
App 20210343622 - Lai; Yu-Chia ; et al. | 2021-11-04 |
Semiconductor package and manufacturing method thereof
Grant 11,164,819 - Tseng , et al. November 2, 2 | 2021-11-02 |
Package structure having redistribution layer structures
Grant 11,158,576 - Chang , et al. October 26, 2 | 2021-10-26 |
Semiconductor Package and Method
App 20210327806 - Pan; Kuo Lung ; et al. | 2021-10-21 |
Solderless Interconnection Structure and Method of Forming Same
App 20210313287 - Lin; Yu-Wei ; et al. | 2021-10-07 |
Package and Method for Manufacturing the Same
App 20210305123 - Yu; Chen-Hua ; et al. | 2021-09-30 |
Integrated fan-out package
Grant 11,121,070 - Chun , et al. September 14, 2 | 2021-09-14 |
Integrated fan-out device, 3D-IC system, and method
Grant 11,121,052 - Lai , et al. September 14, 2 | 2021-09-14 |
Package Structure, Package-on-package Structure And Manufacturing Method Thereof
App 20210272897 - Wang; Chuei-Tang ; et al. | 2021-09-02 |
Semiconductor package and method of manufacturing semiconductor package
Grant 11,107,772 - Chiang , et al. August 31, 2 | 2021-08-31 |
Segregated power and ground design for yield improvement
Grant 11,107,771 - Chun , et al. August 31, 2 | 2021-08-31 |
Dummy Dies for Reducing Warpage in Packages
App 20210265284 - Yu; Chen-Hua ; et al. | 2021-08-26 |
Integrated Circuit Package and Method
App 20210265228 - Chun; Shu-Rong ; et al. | 2021-08-26 |
Semiconductor package structure comprising rigid-flexible substrate and manufacturing method thereof
Grant 11,094,634 - Wang , et al. August 17, 2 | 2021-08-17 |
IPD modules with flexible connection scheme in packaging
Grant 11,088,125 - Lai , et al. August 10, 2 | 2021-08-10 |
Semiconductor device, circuit board structure and manufacturing method thereof
Grant 11,088,110 - Kuo , et al. August 10, 2 | 2021-08-10 |
Package Structure And Manufacturing Method Of Package Structure Thereof
App 20210242159 - Teng; Po-Yuan ; et al. | 2021-08-05 |
Integrated Circuit Package and Method
App 20210233835 - Lai; Chi-Hui ; et al. | 2021-07-29 |
Semiconductor Package and Method
App 20210233852 - Yu; Chen-Hua ; et al. | 2021-07-29 |
Semiconductor Packages And Methods Of Forming The Same
App 20210225812 - Yu; Chen-Hua ; et al. | 2021-07-22 |
Package structures
Grant 11,062,975 - Lai , et al. July 13, 2 | 2021-07-13 |
System, Device And Methods Of Manufacture
App 20210202312 - Yu; Chen-Hua ; et al. | 2021-07-01 |
Segregated Power and Ground Design for Yield Improvement
App 20210202391 - Chun; Shu-Rong ; et al. | 2021-07-01 |
Semiconductor package and method
Grant 11,049,805 - Pan , et al. June 29, 2 | 2021-06-29 |
Solderless interconnection structure and method of forming same
Grant 11,043,462 - Lin , et al. June 22, 2 | 2021-06-22 |
Integrated Circuit Package And Method
App 20210159217 - Yu; Chen-Hua ; et al. | 2021-05-27 |
Package structure, package-on-package structure and manufacturing method thereof
Grant 11,011,460 - Wang , et al. May 18, 2 | 2021-05-18 |
Dummy dies for reducing warpage in packages
Grant 11,004,803 - Yu , et al. May 11, 2 | 2021-05-11 |
Integrated circuit package and method
Grant 11,004,758 - Chun , et al. May 11, 2 | 2021-05-11 |
Semiconductor package and manufacturing method of semiconductor package
Grant 11,004,827 - Hsieh , et al. May 11, 2 | 2021-05-11 |
Semiconductor package and manufacturing method thereof
Grant 10,985,101 - Lai , et al. April 20, 2 | 2021-04-20 |
Semiconductor package and manufacturing method thereof
Grant 10,985,115 - Teng , et al. April 20, 2 | 2021-04-20 |
Scheme for connector site spacing and resulting structures
Grant 10,985,114 - Chen , et al. April 20, 2 | 2021-04-20 |
Semiconductor structure with conductive structure
Grant 10,978,363 - Tsai , et al. April 13, 2 | 2021-04-13 |
Semiconductor structure with conductive structure
Grant 10,978,362 - Tsai , et al. April 13, 2 | 2021-04-13 |
Integrated circuit package and method
Grant 10,978,382 - Lai , et al. April 13, 2 | 2021-04-13 |
Semiconductor packages and methods of forming the same
Grant 10,971,477 - Yu , et al. April 6, 2 | 2021-04-06 |
Multi-Chip Semiconductor Package
App 20210091059 - Lai; Yu-Chia ; et al. | 2021-03-25 |
IPD Modules with Flexible Connection Scheme in Packaging
App 20210082888 - Lai; Yu-Chia ; et al. | 2021-03-18 |
Cross-Wafer RDLs in Constructed Wafers
App 20210074553 - Yu; Chen-Hua ; et al. | 2021-03-11 |
Bonding Passive Devices on Active Device Dies to Form 3D Packages
App 20210066242 - Yu; Chen-Hua ; et al. | 2021-03-04 |
Surface Treatment Method and Apparatus for Semiconductor Packaging
App 20210050281 - Chang; Chih-Horng ; et al. | 2021-02-18 |
Bump Structure Having A Side Recess And Semiconductor Structure Including The Same
App 20210035938 - Chang; Chih-Horng ; et al. | 2021-02-04 |
Package Structure And Method Of Manufacturing The Same
App 20210020538 - Chen; Shih-Wei ; et al. | 2021-01-21 |
Semicondcutor Package And Method Of Manufacturing The Same
App 20210013177 - Chen; Shih-Wei ; et al. | 2021-01-14 |
Semiconductor Structures
App 20210005586 - Lai; Chi-Hui ; et al. | 2021-01-07 |
Semiconductor Package and Method
App 20210005554 - Huang; Tzu-Sung ; et al. | 2021-01-07 |
Semiconductor Device And Method Of Fabricating The Same
App 20200411439 - Teng; Po-Yuan ; et al. | 2020-12-31 |
Three-Dimension Large System Integration
App 20200411488 - Yu; Chen-Hua ; et al. | 2020-12-31 |
Semiconductor Package And Manufacturing Method Thereof
App 20200402927 - Teng; Po-Yuan ; et al. | 2020-12-24 |
Integrated Circuit Package and Method
App 20200395257 - Chun; Shu-Rong ; et al. | 2020-12-17 |
Dual-sided integrated fan-out package
Grant 10,861,823 - Pan , et al. December 8, 2 | 2020-12-08 |
Semiconductor Package And Manufacturing Method Thereof
App 20200381362 - Tseng; Ying-Cheng ; et al. | 2020-12-03 |
Multi-chip semiconductor package
Grant 10,847,505 - Lai , et al. November 24, 2 | 2020-11-24 |
Chip package with fan-out structure
Grant 10,840,111 - Chen , et al. November 17, 2 | 2020-11-17 |
Bump structure having a side recess and semiconductor structure including the same
Grant 10,833,033 - Chang , et al. November 10, 2 | 2020-11-10 |
Cross-wafer RDLs in constructed wafers
Grant 10,825,696 - Yu , et al. November 3, 2 | 2020-11-03 |
Semiconductor package and method of manufacturing the same
Grant 10,811,384 - Chen , et al. October 20, 2 | 2020-10-20 |
Surface treatment method and apparatus for semiconductor packaging
Grant 10,811,338 - Chang , et al. October 20, 2 | 2020-10-20 |
Semiconductor Package And Manufacturing Method Thereof
App 20200321290 - Teng; Po-Yuan ; et al. | 2020-10-08 |
Semiconductor package and manufacturing method thereof
Grant 10,797,008 - Teng , et al. October 6, 2 | 2020-10-06 |
Semiconductor devices and semiconductor structures
Grant 10,790,269 - Lai , et al. September 29, 2 | 2020-09-29 |
Semiconductor Package And Manufacturing Method Thereof
App 20200303364 - Chen; Shih-Wei ; et al. | 2020-09-24 |
Package Structure Having Redistribution Layer Structures
App 20200303316 - Chang; Chih-Hao ; et al. | 2020-09-24 |
Semiconductor package and method
Grant 10,784,203 - Huang , et al. Sept | 2020-09-22 |
Semiconductor Package And Manufacturing Method Thereof
App 20200294916 - Lai; Yu-Chia ; et al. | 2020-09-17 |
Chip Package And Method Of Forming The Same
App 20200279784 - Pan; Kuo-Lung ; et al. | 2020-09-03 |
Semiconductor Package And Method Of Manufacturing Semiconductor Package
App 20200273806 - Chiang; Tsung-Hsien ; et al. | 2020-08-27 |
Package Structure, Package-on-package Structure And Manufacturing Method Thereof
App 20200258836 - A1 | 2020-08-13 |
Integrated Fan-Out Device, 3D-IC System, and Method
App 20200251397 - Kind Code | 2020-08-06 |
Integrated Fan-out Package And Method Of Forming Same
App 20200251407 - Kind Code | 2020-08-06 |
Semiconductor package and manufacturing method thereof
Grant 10,734,328 - Teng , et al. | 2020-08-04 |
Dummy flip chip bumps for reducing stress
Grant 10,734,347 - Wu , et al. | 2020-08-04 |
Semiconductor Device, Circuit Board Structure And Manufacturing Method Thereof
App 20200243483 - Kuo; Tin-Hao ; et al. | 2020-07-30 |
Integrated Circuit Package and Method
App 20200243429 - Lai; Chi-Hui ; et al. | 2020-07-30 |
Semiconductor Devices And Semiconductor Structures
App 20200243494 - Lai; Chi-Hui ; et al. | 2020-07-30 |
Semiconductor package including thermal relaxation block and manufacturing method thereof
Grant 10,720,416 - Chen , et al. | 2020-07-21 |
Integrated Circuit Package and Method
App 20200212018 - Lai; Chi-Hui ; et al. | 2020-07-02 |
Integrated Circuit Package and Method
App 20200211922 - Chun; Shu-Rong ; et al. | 2020-07-02 |
Package structure having redistribution layer structures
Grant 10,700,008 - Chang , et al. | 2020-06-30 |
Semiconductor Package Structure And Manufacturing Method Thereof
App 20200203280 - Wang; Chuei-Tang ; et al. | 2020-06-25 |
Electronic Assembly, Package Structure And Method Of Fabricating The Same
App 20200203301 - Yu; Chen-Hua ; et al. | 2020-06-25 |
Chip package and method of forming the same
Grant 10,658,258 - Pan , et al. | 2020-05-19 |
Package structure, package-on-package structure and manufacturing method thereof
Grant 10,643,943 - Wang , et al. | 2020-05-05 |
Semicondcutor Package And Method Of Manufacturing The Same
App 20200135692 - Chen; Shih-Wei ; et al. | 2020-04-30 |
Bump-on-Trace Design for Enlarge Bump-to-Trace Distance
App 20200126939 - Wu; Sheng-Yu ; et al. | 2020-04-23 |
Surface Treatment Method and Apparatus for Semiconductor Packaging
App 20200126893 - Chang; Chih-Horng ; et al. | 2020-04-23 |
Semiconductor Package And Manufacturing Method Thereof
App 20200118945 - Teng; Po-Yuan ; et al. | 2020-04-16 |
Package Structures And Methods Of Manufacturing The Same
App 20200105641 - Lai; Yu-Chia ; et al. | 2020-04-02 |
Semiconductor Device And Fabricating Method Of The Same
App 20200105644 - Teng; Po-Yuan ; et al. | 2020-04-02 |
Semicondcutor Package And Manufacturing Method Of Semicondcutor Package
App 20200091114 - Hsieh; Wei Kang ; et al. | 2020-03-19 |
Semiconductor Package And Manufacturing Method Thereof
App 20200091091 - Teng; Po-Yuan ; et al. | 2020-03-19 |
Semiconductor Structure With Conductive Structure
App 20200091022 - TSAI; Pei-Chun ; et al. | 2020-03-19 |
Semiconductor Structure With Conductive Structure
App 20200083125 - TSAI; Pei-Chun ; et al. | 2020-03-12 |
Integrated Fan-Out Packages and Methods of Forming the Same
App 20200075562 - Yu; Chen-Hua ; et al. | 2020-03-05 |
Semiconductor Package And Manufacturing Method Thereof
App 20200058632 - Chen; Shih-Wei ; et al. | 2020-02-20 |
Design Scheme for Connector Site Spacing and Resulting Structures
App 20200058601 - Chen; Yu-Feng ; et al. | 2020-02-20 |
Semicondcutor Package And Manufacturing Method Thereof
App 20200043782 - Teng; Po-Yuan ; et al. | 2020-02-06 |
Dummy Dies for Reducing Warpage in Packages
App 20200006252 - Yu; Chen-Hua ; et al. | 2020-01-02 |
Semiconductor Package and Method
App 20200006220 - Pan; Kuo Lung ; et al. | 2020-01-02 |
Cross-Wafer RDLs in Constructed Wafers
App 20200006089 - Yu; Chen-Hua ; et al. | 2020-01-02 |
Surface treatment method and apparatus for semiconductor packaging
Grant 10,522,444 - Chang , et al. Dec | 2019-12-31 |
Package Structure, Package-on-package Structure And Manufacturing Method Thereof
App 20190393149 - Wang; Chuei-Tang ; et al. | 2019-12-26 |
Bump-on-trace design for enlarge bump-to-trace distance
Grant 10,515,919 - Wu , et al. Dec | 2019-12-24 |
Semiconductor package and manufacturing method thereof
Grant 10,510,686 - Teng , et al. Dec | 2019-12-17 |
Semicondcutor package and method of manufacturing the same
Grant 10,510,713 - Chen , et al. Dec | 2019-12-17 |
Scheme for connector site spacing and resulting structures
Grant 10,504,856 - Chen , et al. Dec | 2019-12-10 |
Package Structure And Method Of Manufacturing The Same
App 20190371734 - Chang; Chih-Hao ; et al. | 2019-12-05 |
Semiconductor structure with conductive structure
Grant 10,490,468 - Tsai , et al. Nov | 2019-11-26 |
Semiconductor Package And Manufacturing Method Thereof
App 20190333869 - Teng; Po-Yuan ; et al. | 2019-10-31 |
Semiconductor packages and methods of forming the same
Grant 10,461,023 - Chang , et al. Oc | 2019-10-29 |
Semiconductor Device and Method of Manufacture
App 20190326236 - Yu; Chen-Hua ; et al. | 2019-10-24 |
Bump Structure Having A Side Recess And Semiconductor Structure Including The Same
App 20190326240 - Chang; Chih-Horng ; et al. | 2019-10-24 |
Multi-Chip Semiconductor Package
App 20190312018 - Lai; Yu-Chia ; et al. | 2019-10-10 |
Solderless Interconnection Structure and Method of Forming Same
App 20190295971 - Lin; Yu-Wei ; et al. | 2019-09-26 |
Integrated Fan-Out Package and the Methods of Manufacturing
App 20190273064 - Yu; Chen-Hua ; et al. | 2019-09-05 |
Dummy Flip Chip Bumps for Reducing Stress
App 20190259724 - Wu; Sheng-Yu ; et al. | 2019-08-22 |
Bump structure having a side recess and semiconductor structure including the same
Grant 10,388,622 - Chang , et al. A | 2019-08-20 |
Trace Design for Bump-on-Trace (BOT) Assembly
App 20190252347 - Lin; Yen-Liang ; et al. | 2019-08-15 |
Method of Manufacturing an Integrated Fan-out Package having Fan-Out Redistribution Layer (RDL) to Accommodate Electrical Connec
App 20190244871 - Yu; Chen-Hua ; et al. | 2019-08-08 |
Semiconductor Packages and Methods of Forming the Same
App 20190244935 - Yu; Chen-Hua ; et al. | 2019-08-08 |
Semiconductor device and method of manufacture
Grant 10,340,236 - Yu , et al. | 2019-07-02 |
Solderless interconnection structure and method of forming same
Grant 10,319,691 - Lin , et al. | 2019-06-11 |
Semiconductor Package and Method
App 20190148301 - Huang; Tzu-Sung ; et al. | 2019-05-16 |
Dummy flip chip bumps for reducing stress
Grant 10,290,600 - Wu , et al. | 2019-05-14 |
Semiconductor Packages And Methods Of Forming The Same
App 20190131223 - Chang; Mao-Yen ; et al. | 2019-05-02 |
Integrated fan-out package
Grant 10,276,509 - Chang , et al. | 2019-04-30 |
Dual-Sided Integrated Fan-Out Package
App 20190123021 - Pan; Kuo Lung ; et al. | 2019-04-25 |
Semiconductor packages and methods of forming the same
Grant 10,269,773 - Yu , et al. | 2019-04-23 |
Trace design for bump-on-trace (BOT) assembly
Grant 10,269,759 - Lin , et al. | 2019-04-23 |
Method of manufacturing an integrated fan-out package having fan-out redistribution layer (RDL) to accommodate electrical connectors
Grant 10,269,674 - Yu , et al. | 2019-04-23 |
Semiconductor Packages and Methods of Forming the Same
App 20190103379 - Yu; Chen-Hua ; et al. | 2019-04-04 |
Integrated Fan-Out Package and the Methods of Manufacturing
App 20190074261 - Yu; Chen-Hua ; et al. | 2019-03-07 |
Semiconductor device having conductive bumps of varying heights
Grant 10,163,844 - Lin , et al. Dec | 2018-12-25 |
Structure and formation method of chip package with fan-out structure
Grant 10,163,801 - Chang , et al. Dec | 2018-12-25 |
Contact area design for solder bonding
Grant 10,157,874 - Tsai , et al. Dec | 2018-12-18 |
Conical-Shaped or Tier-Shaped Pillar Connections
App 20180358316 - Kuo; Tin-Hao ; et al. | 2018-12-13 |
Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices
Grant 10,153,243 - Tseng , et al. Dec | 2018-12-11 |
Dual-sided integrated fan-out package
Grant 10,153,249 - Pan , et al. Dec | 2018-12-11 |
Method of Manufacturing an Integrated Fan-out Package having Fan-Out Redistribution Layer (RDL) to Accommodate Electrical Connectors
App 20180342435 - Yu; Chen-Hua ; et al. | 2018-11-29 |
Substrate design with balanced metal and solder resist density
Grant 10,128,195 - Lin , et al. November 13, 2 | 2018-11-13 |
Integrated fan-out stacked package with fan-out redistribution layer (RDL)
Grant 10,128,213 - Yu , et al. November 13, 2 | 2018-11-13 |
Conical-shaped or tier-shaped pillar connections
Grant 10,056,345 - Kuo , et al. August 21, 2 | 2018-08-21 |
Chip Package With Fan-out Structure
App 20180233382 - CHEN; Shing-Chao ; et al. | 2018-08-16 |
Method of manufacturing an integrated fan-out package having fan-out redistribution layer (RDL) to accommodate electrical connectors
Grant 10,049,953 - Yu , et al. August 14, 2 | 2018-08-14 |
Bump-on-trace structures with high assembly yield
Grant 10,050,000 - Huang , et al. August 14, 2 | 2018-08-14 |
Integrated circuit packaging substrate, semiconductor package, and manufacturing method
Grant 10,043,774 - Lin , et al. August 7, 2 | 2018-08-07 |
Semiconductor Structure With Conductive Structure
App 20180218953 - TSAI; Pei-Chun ; et al. | 2018-08-02 |
Integrated Fan-out Package and the Methods of Manufacturing
App 20180197837 - Yu; Chen-Hua ; et al. | 2018-07-12 |
Protrusion bump pads for bond-on-trace processing
Grant 10,020,276 - Chen , et al. July 10, 2 | 2018-07-10 |
Structures having a tapering curved profile and methods of making same
Grant 10,008,459 - Tsai , et al. June 26, 2 | 2018-06-26 |
Bump structure and method of forming same
Grant 9,966,346 - Chen , et al. May 8, 2 | 2018-05-08 |
Conductive contacts having varying widths and method of manufacturing same
Grant 9,953,939 - Lin , et al. April 24, 2 | 2018-04-24 |
Structure And Formation Method Of Chip Package With Fan-out Structure
App 20180108614 - CHANG; Chih-Horng ; et al. | 2018-04-19 |
Structure and formation method of chip package with fan-out structure
Grant 9,947,552 - Chen , et al. April 17, 2 | 2018-04-17 |
Method for forming semiconductor structure
Grant 9,935,024 - Tsai , et al. April 3, 2 | 2018-04-03 |
Semiconductor structure and manufacturing method of the same
Grant 9,935,073 - Lin , et al. April 3, 2 | 2018-04-03 |
Semiconductor Device and Method of Manufacture
App 20180090457 - Yu; Chen-Hua ; et al. | 2018-03-29 |
Integrated Fan-out Package
App 20180090445 - Chang; Chih-Hao ; et al. | 2018-03-29 |
Isolation rings for packages and the method of forming the same
Grant 9,929,070 - Chang , et al. March 27, 2 | 2018-03-27 |
Bump-on-trace interconnection structure for flip-chip packages
Grant 9,917,035 - Tseng , et al. March 13, 2 | 2018-03-13 |
Method of manufacturing an integrated stacked package with a fan-out redistribution layer (RDL) and a same encapsulating process
Grant 9,917,072 - Yu , et al. March 13, 2 | 2018-03-13 |
Bump Structure Having A Side Recess And Semiconductor Structure Including The Same
App 20180053741 - Chang; Chih-Horng ; et al. | 2018-02-22 |
Interconnect structures for wafer level package and methods of forming same
Grant 9,899,288 - Chang , et al. February 20, 2 | 2018-02-20 |
Integrated fan-out package and method of fabricating the same
Grant 9,870,997 - Chang , et al. January 16, 2 | 2018-01-16 |
Contact area design for solder bonding
Grant 9,871,013 - Tsai , et al. January 16, 2 | 2018-01-16 |
Semiconductor device and method of manufacture
Grant 9,842,815 - Yu , et al. December 12, 2 | 2017-12-12 |
Contact Area Design for Solder Bonding
App 20170345785 - Tsai; Pei-Chun ; et al. | 2017-11-30 |
Integrated Fan-out Package And Method Of Fabricating The Same
App 20170345764 - Chang; Chih-Hao ; et al. | 2017-11-30 |
Bump structure having a side recess and semiconductor structure including the same
Grant 9,824,992 - Chang , et al. November 21, 2 | 2017-11-21 |
Semiconductor package and manufacturing method of the same
Grant 9,812,405 - Chen , et al. November 7, 2 | 2017-11-07 |
Semiconductor Structure And Method For Forming The Same
App 20170316989 - TSAI; Pei-Chun ; et al. | 2017-11-02 |
Structure And Formation Method Of Chip Package With Fan-out Structure
App 20170316957 - CHEN; Shing-Chao ; et al. | 2017-11-02 |
Dummy Flip Chip Bumps for Reducing Stress
App 20170309588 - Wu; Sheng-Yu ; et al. | 2017-10-26 |
Semiconductor Device Having Conductive Bumps Of Varying Heights
App 20170263583 - LIN; YEN-LIANG ; et al. | 2017-09-14 |
Semiconductor Device and Method of Manufacture
App 20170250147 - Yu; Chen-Hua ; et al. | 2017-08-31 |
Interconnect Structures for Wafer Level Package and Methods of Forming Same
App 20170243800 - Chang; Chih-Hao ; et al. | 2017-08-24 |
Semiconductor Devices, Methods of Manufacture Thereof, and Packaged Semiconductor Devices
App 20170229421 - Tseng; Yu-Jen ; et al. | 2017-08-10 |
Dual-Sided Integrated Fan-Out Package
App 20170213808 - Pan; Kuo Lung ; et al. | 2017-07-27 |
Semiconductor Structure And Manufacturing Method Of The Same
App 20170213804 - LIN; YEN-LIANG ; et al. | 2017-07-27 |
Dummy flip chip bumps for reducing stress
Grant 9,711,477 - Wu , et al. July 18, 2 | 2017-07-18 |
Trace Design for Bump-on-Trace (BOT) Assembly
App 20170186723 - Lin; Yen-Liang ; et al. | 2017-06-29 |
Semiconductor device having conductive bumps of varying heights
Grant 9,679,862 - Lin , et al. June 13, 2 | 2017-06-13 |
Interconnect structures for wafer level package and methods of forming same
Grant 9,659,896 - Chang , et al. May 23, 2 | 2017-05-23 |
Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices
Grant 9,646,923 - Tseng , et al. May 9, 2 | 2017-05-09 |
Interconnection Structure and Method of Forming Same
App 20170117245 - Lin; Yu-Wei ; et al. | 2017-04-27 |
Semiconductor structure and manufacturing method of the same
Grant 9,633,965 - Lin , et al. April 25, 2 | 2017-04-25 |
Isolation Rings for Packages and the Method of Forming the Same
App 20170103933 - Chang; Chih-Horng ; et al. | 2017-04-13 |
Dual-sided integrated fan-out package
Grant 9,620,465 - Pan , et al. April 11, 2 | 2017-04-11 |
Integrated Fan-out Stacked SiP and the Methods of Manufacturing
App 20170084576 - Yu; Chen-Hua ; et al. | 2017-03-23 |
Integrated Fan-Out Package and the Methods of Manufacturing
App 20170084555 - Yu; Chen-Hua ; et al. | 2017-03-23 |
Conductive Contacts Having Varying Widths And Method Of Manufacturing Same
App 20170069587 - Lin; Yen-Liang ; et al. | 2017-03-09 |
Bump Structure Having A Side Recess And Semiconductor Structure Including The Same
App 20170062371 - Chang; Chih-Horng ; et al. | 2017-03-02 |
Methods and apparatus for bump-on-trace chip packaging
Grant 9,583,367 - Huang , et al. February 28, 2 | 2017-02-28 |
Protrusion Bump Pads for Bond-on-Trace Processing
App 20170053885 - Chen; Chen-Shien ; et al. | 2017-02-23 |
Design Scheme for Connector Site Spacing and Resulting Structures
App 20170047298 - Chen; Yu-Feng ; et al. | 2017-02-16 |
Semiconductor device, integrated circuit structure using the same, and manufacturing method thereof
Grant 9,559,069 - Chen , et al. January 31, 2 | 2017-01-31 |
Isolation rings for packages and the method of forming the same
Grant 9,548,245 - Chang , et al. January 17, 2 | 2017-01-17 |
Bump-on-Trace Structures with High Assembly Yield
App 20170005059 - Huang; Chih-Fan ; et al. | 2017-01-05 |
Substrate Design with Balanced Metal and Solder Resist Density
App 20160365322 - Lin; Yu-Wei ; et al. | 2016-12-15 |
Method of forming bump structure having a side recess and semiconductor structure including the same
Grant 9,520,379 - Chang , et al. December 13, 2 | 2016-12-13 |
Conical-Shaped or Tier-Shaped Pillar Connections
App 20160358876 - Kuo; Tin-Hao ; et al. | 2016-12-08 |
Protrusion bump pads for bond-on-trace processing
Grant 9,508,637 - Chen , et al. November 29, 2 | 2016-11-29 |
Conductive contacts having varying widths and method of manufacturing same
Grant 9,508,668 - Lin , et al. November 29, 2 | 2016-11-29 |
Semiconductor Package And Manufacturing Method Of The Same
App 20160336281 - CHEN; GUAN-YU ; et al. | 2016-11-17 |
Interconnection structure and method of forming same
Grant 9,496,233 - Lin , et al. November 15, 2 | 2016-11-15 |
Scheme for connector site spacing and resulting structures
Grant 9,484,317 - Chen , et al. November 1, 2 | 2016-11-01 |
Bump-on-trace structures with high assembly yield
Grant 9,472,525 - Huang , et al. October 18, 2 | 2016-10-18 |
Connecting function chips to a package to form package-on-package
Grant 9,449,941 - Tsai , et al. September 20, 2 | 2016-09-20 |
Semiconductor package and manufacturing method of the same
Grant 9,431,351 - Chen , et al. August 30, 2 | 2016-08-30 |
Substrate design with balanced metal and solder resist density
Grant 9,425,117 - Lin , et al. August 23, 2 | 2016-08-23 |
Conical-shaped or tier-shaped pillar connections
Grant 9,425,136 - Kuo , et al. August 23, 2 | 2016-08-23 |
Treating copper surfaces for packaging
Grant 9,425,180 - Chang , et al. August 23, 2 | 2016-08-23 |
Integrated Circuit Packaging Substrate, Semiconductor Package, And Manufacturing Method
App 20160240502 - LIN; Yu-Wei ; et al. | 2016-08-18 |
Semiconductor Device, Integrated Circuit Structure Using The Same, And Manufacturing Method Thereof
App 20160225729 - CHEN; Yu-Feng ; et al. | 2016-08-04 |
Package structure and method of forming the same
Grant 9,406,634 - Shieh , et al. August 2, 2 | 2016-08-02 |
Contact Area Design For Solder Bonding
App 20160190082 - Tsai; Pei-Chun ; et al. | 2016-06-30 |
Dummy Flip Chip Bumps for Reducing Stress
App 20160181220 - Wu; Sheng-Yu ; et al. | 2016-06-23 |
Bump Structure Having A Side Recess And Semiconductor Structure Including The Same
App 20160181223 - Chang; Chih-Horng ; et al. | 2016-06-23 |
Interconnect Structures for Wafer Level Package and Methods of Forming Same
App 20160172329 - Chang; Chih-Hao ; et al. | 2016-06-16 |
Semiconductor Device And Method Of Manufacturing The Same
App 20160155715 - LIN; YEN-LIANG ; et al. | 2016-06-02 |
Bump-on-Trace Design for Enlarge Bump-to-Trace Distance
App 20160118360 - Wu; Sheng-Yu ; et al. | 2016-04-28 |
Semiconductor Package And Manufacturing Method Of The Same
App 20160111378 - CHEN; GUAN-YU ; et al. | 2016-04-21 |
Bump structure having a side recess and semiconductor structure including the same
Grant 9,318,458 - Chang , et al. April 19, 2 | 2016-04-19 |
Bump-on-Trace Structures with High Assembly Yield
App 20160086901 - Huang; Chih-Fan ; et al. | 2016-03-24 |
Methods and apparatus for package on package devices with reversed stud bump through via interconnections
Grant 9,293,449 - Hu , et al. March 22, 2 | 2016-03-22 |
Dummy flip chip bumps for reducing stress
Grant 9,287,234 - Wu , et al. March 15, 2 | 2016-03-15 |
Design Scheme for Connector Site Spacing and Resulting Structures
App 20160071812 - Chen; Yu-Feng ; et al. | 2016-03-10 |
Bump-on-trace design for enlarge bump-to-trace distance
Grant 9,269,688 - Wu , et al. February 23, 2 | 2016-02-23 |
Semiconductor Structure And Manufacturing Method Of The Same
App 20160043051 - LIN; Yen-Liang ; et al. | 2016-02-11 |
Landing areas of bonding structures
Grant 9,257,385 - Chang , et al. February 9, 2 | 2016-02-09 |
Methods and Apparatus for bump-on-trace Chip Packaging
App 20160035591 - Huang; Chang-Chia ; et al. | 2016-02-04 |
Substrate Design with Balanced Metal and Solder Resist Density
App 20150380332 - Lin; Yu-Wei ; et al. | 2015-12-31 |
Bump Structure and Method of Forming Same
App 20150357301 - Chen; Guan-Yu ; et al. | 2015-12-10 |
Bump-on-trace structures with high assembly yield
Grant 9,209,149 - Huang , et al. December 8, 2 | 2015-12-08 |
Scheme for connector site spacing and resulting structures
Grant 9,190,348 - Chen , et al. November 17, 2 | 2015-11-17 |
Conductive Contacts Having Varying Widths And Method Of Manufacturing Same
App 20150325542 - Lin; Yen-Liang ; et al. | 2015-11-12 |
Bump Structure Having A Side Recess And Semiconductor Structure Including The Same
App 20150318253 - CHANG; Chih-Horng ; et al. | 2015-11-05 |
Methods and apparatus for bump-on-trace chip packaging
Grant 9,165,796 - Lin , et al. October 20, 2 | 2015-10-20 |
Substrate design with balanced metal and solder resist density
Grant 9,153,550 - Lin , et al. October 6, 2 | 2015-10-06 |
Isolation Rings for Packages and the Method of Forming the Same
App 20150262882 - Chang; Chih-Horng ; et al. | 2015-09-17 |
Package Structure And Method Of Forming The Same
App 20150243622 - SHIEH; Yuh Chern ; et al. | 2015-08-27 |
Bump structure and method of forming same
Grant 9,111,817 - Chen , et al. August 18, 2 | 2015-08-18 |
Bump structure having a single side recess
Grant 9,105,533 - Chang , et al. August 11, 2 | 2015-08-11 |
Conductive contacts having varying widths and method of manufacturing same
Grant 9,105,530 - Lin , et al. August 11, 2 | 2015-08-11 |
Elongated bump structure for semiconductor devices
Grant 9,093,332 - Kuo , et al. July 28, 2 | 2015-07-28 |
Protrusion Bump Pads for Bond-on-Trace Processing
App 20150194379 - Chen; Chen-Shien ; et al. | 2015-07-09 |
Trace Design for Bump-on-Trace (BOT) Assembly
App 20150187719 - Lin; Yen-Liang ; et al. | 2015-07-02 |
Isolation rings for packages and the method of forming the same
Grant 9,048,333 - Chang , et al. June 2, 2 | 2015-06-02 |
Bump-on-trace (BOT) structures
Grant 9,041,223 - Shieh , et al. May 26, 2 | 2015-05-26 |
Bump-on-Trace Structures with High Assembly Yield
App 20150130051 - Huang; Chih-Fan ; et al. | 2015-05-14 |
Substrate Design with Balanced Metal and Solder Resist Density
App 20150130050 - Lin; Yu-Wei ; et al. | 2015-05-14 |
Bump-on-Trace Design for Enlarge Bump-to-Trace Distance
App 20150123266 - Wu; Sheng-Yu ; et al. | 2015-05-07 |
Treating Copper Surfaces for Packaging
App 20150104903 - Chang; Chih-Horng ; et al. | 2015-04-16 |
Solder mask shape for BOT laminate packages
Grant 9,006,909 - Chang , et al. April 14, 2 | 2015-04-14 |
Bump Structure Having A Single Side Recess
App 20150084186 - CHANG; Chih-Horng ; et al. | 2015-03-26 |
Structure and method for bump to landing trace ratio
Grant 8,981,576 - Yu , et al. March 17, 2 | 2015-03-17 |
Methods and Apparatus for Package on Package Devices with Reversed Stud Bump Through Via Interconnections
App 20150072476 - Hu; Yen-Chang ; et al. | 2015-03-12 |
Extending metal traces in bump-on-trace structures
Grant 8,970,033 - Chen , et al. March 3, 2 | 2015-03-03 |
Dummy Flip Chip Bumps for Reducing Stress
App 20150004751 - Wu; Sheng-Yu ; et al. | 2015-01-01 |
Pillar structure having a non-planar surface for semiconductor devices
Grant 08921222 - | 2014-12-30 |
Pillar structure having a non-planar surface for semiconductor devices
Grant 8,921,222 - Kuo , et al. December 30, 2 | 2014-12-30 |
Elongated bumps in integrated circuit devices
Grant 8,922,006 - Lin , et al. December 30, 2 | 2014-12-30 |
Elongated bumps in integrated circuit devices
Grant 08922006 - | 2014-12-30 |
Methods and apparatus for package on package devices with reversed stud bump through via interconnections
Grant 8,922,005 - Hu , et al. December 30, 2 | 2014-12-30 |
Dummy flip chip bumps for reducing stress
Grant 8,912,649 - Wu , et al. December 16, 2 | 2014-12-16 |
Treating copper surfaces for packaging
Grant 8,907,479 - Chang , et al. December 9, 2 | 2014-12-09 |
Methods and Apparatus for bump-on-trace Chip Packaging
App 20140346673 - Lin; Yen-Liang ; et al. | 2014-11-27 |
Pillar Structure having a Non-Planar Surface for Semiconductor Devices
App 20140302669 - Kuo; Tin-Hao ; et al. | 2014-10-09 |
Bump structures
Grant 8,853,853 - Chang , et al. October 7, 2 | 2014-10-07 |
Design Scheme for Connector Site Spacing and Resulting Structures
App 20140291838 - Chen; Yu-Feng ; et al. | 2014-10-02 |
Surface Treatment Method and Apparatus for Semiconductor Packaging
App 20140252614 - Chang; Chih-Horng ; et al. | 2014-09-11 |
Treating Copper Surfaces for Packaging
App 20140252600 - Chang; Chih-Horng ; et al. | 2014-09-11 |
Apparatus and method for three dimensional integrated circuits
Grant 8,823,170 - Wu , et al. September 2, 2 | 2014-09-02 |
Pillar structure having a non-planar surface for semiconductor devices
Grant 8,803,319 - Kuo , et al. August 12, 2 | 2014-08-12 |
Solder Mask Shape for BOT Laminate Packages
App 20140186591 - Chang; Chih-Horng ; et al. | 2014-07-03 |
Isolation Rings for Packages and the Method of Forming the Same
App 20140179062 - Chang; Chih-Horng ; et al. | 2014-06-26 |
Semiconductor Devices, Methods of Manufacture Thereof, and Packaged Semiconductor Devices
App 20140167253 - Tseng; Yu-Jen ; et al. | 2014-06-19 |
Apparatus and Method for Three Dimensional Integrated Circuits
App 20140159232 - Wu; Sheng-Yu ; et al. | 2014-06-12 |
Structure and Method for Bump to Landing Trace Ratio
App 20140131865 - Yu; Chen-Hua ; et al. | 2014-05-15 |
Isolation rings for blocking the interface between package components and the respective molding compound
Grant 8,710,681 - Chang , et al. April 29, 2 | 2014-04-29 |
Bump-on-trace Interconnection Structure For Flip-chip Packages
App 20140110847 - TSENG; Yu-Jen ; et al. | 2014-04-24 |
Bump Structure and Method of Forming Same
App 20140077358 - Chen; Guan-Yu ; et al. | 2014-03-20 |
Interconnection Structure and Method of Forming Same
App 20140077360 - Lin; Yu-Wei ; et al. | 2014-03-20 |
Metal Bump and Method of Manufacturing Same
App 20140077365 - Lin; Yen-Liang ; et al. | 2014-03-20 |
Ladder Bump Structures and Methods of Making Same
App 20140077359 - Tsai; Pei-Chun ; et al. | 2014-03-20 |
Method for designing a package and substrate layout
Grant 8,664,041 - Tseng , et al. March 4, 2 | 2014-03-04 |
Structure and method for bump to landing trace ratio
Grant 8,643,196 - Yu , et al. February 4, 2 | 2014-02-04 |
Reflow system and method for conductive connections
Grant 8,623,756 - Chuang , et al. January 7, 2 | 2014-01-07 |
Isolation Rings for Packages and the Method of Forming the Same
App 20130320572 - Chang; Chih-Horng ; et al. | 2013-12-05 |
Semiconductor devices and methods of manufacturing and packaging thereof
Grant 8,598,691 - Wu , et al. December 3, 2 | 2013-12-03 |
Pillar Structure having a Non-Planar Surface for Semiconductor Devices
App 20130292827 - Kuo; Tin-Hao ; et al. | 2013-11-07 |
Conical-Shaped or Tier-Shaped Pillar Connections
App 20130270699 - Kuo; Tin-Hao ; et al. | 2013-10-17 |
Trace Layout Method in Bump-on-Trace Structures
App 20130270693 - Tseng; Yu-Jen ; et al. | 2013-10-17 |
Methods and Apparatus for Package on Package Devices with Reversed Stud Bump Through Via Interconnections
App 20130270682 - Hu; Yen-Chang ; et al. | 2013-10-17 |
Elongated Bumps in Integrated Circuit Devices
App 20130256874 - Lin; Yen-Liang ; et al. | 2013-10-03 |
Pillar structure having a non-planar surface for semiconductor devices
Grant 8,546,945 - Kuo , et al. October 1, 2 | 2013-10-01 |
Landing Areas of Bonding Structures
App 20130147030 - Chang; Chih-Horng ; et al. | 2013-06-13 |
Semiconductor Devices and Methods of Manufacturing and Packaging Thereof
App 20130062741 - Wu; Sheng-Yu ; et al. | 2013-03-14 |
Pillar Structure Having A Non-planar Surface For Semiconductor Devices
App 20130056869 - Kuo; Tin-Hao ; et al. | 2013-03-07 |
Dummy Flip Chip Bumps for Reducing Stress
App 20130043583 - Wu; Sheng-Yu ; et al. | 2013-02-21 |
Bump Structures
App 20130026619 - CHANG; Chih-Horng ; et al. | 2013-01-31 |
Structure And Method For Bump To Landing Trace Ratio
App 20130026614 - Yu; Chen-Hua ; et al. | 2013-01-31 |
Reflow System and Method for Conductive Connections
App 20120329264A1 - | 2012-12-27 |
Pillar structure having a non-planar surface for semiconductor devices
Grant 8,318,596 - Kuo , et al. November 27, 2 | 2012-11-27 |
Reduced-stress bump-on-trace (BOT) structures
Grant 8,288,871 - Shieh , et al. October 16, 2 | 2012-10-16 |
Substrate stand-offs for semiconductor devices
Grant 8,227,924 - Shen , et al. July 24, 2 | 2012-07-24 |
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