Kuo; Chung-Hsing
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kuo; Chung-Hsing.The latest application filed is for "structure of semiconductor device and method for bonding two substrates".
- Kuo; Chung-Hsing - Taipei TW
- Kuo; Chung-Hsing - Taipei City TW
- Kuo; Chung-hsing - Ann Arbor MI
| Patent | Date |
|---|---|
| Package structure of semiconductor device with improved bonding between the substrates Grant 11,450,633 - Lin , et al. September 20, 2 | 2022-09-20 |
| Structure Of Semiconductor Device And Method For Bonding Two Substrates App 20220005775 - Sheng; Zhirui ; et al. | 2022-01-06 |
| Structure of semiconductor device and method for bonding two substrates Grant 11,164,822 - Kuo , et al. November 2, 2 | 2021-11-02 |
| Package Structure Of Semiconductor Device With Improved Bonding Between The Substrates App 20210202418 - LIN; MING-TSE ; et al. | 2021-07-01 |
| Battery thermal management system including thermal interface material with integrated heater element Grant 10,446,887 - Burrows , et al. Oc | 2019-10-15 |
| Electronics umbrella for electrified vehicle battery packs Grant 10,333,118 - Farha , et al. | 2019-06-25 |
| Sealed battery pack designs Grant 10,199,697 - Addanki , et al. Fe | 2019-02-05 |
| Semiconductor structure Grant 10,192,808 - Hu , et al. Ja | 2019-01-29 |
| Semiconductor Structure App 20190013259 - Hu; Teng-Chuan ; et al. | 2019-01-10 |
| Sealed Battery Pack Designs App 20170346144 - ADDANKI; Hari ; et al. | 2017-11-30 |
| Battery pack thermal management Grant 9,738,176 - Garfinkel , et al. August 22, 2 | 2017-08-22 |
| Electronics Umbrella For Electrified Vehicle Battery Packs App 20170214016 - FARHA; Eid ; et al. | 2017-07-27 |
| Battery Pack Thermal Management App 20160347198 - Garfinkel; George Albert ; et al. | 2016-12-01 |
| Battery pack thermal management Grant 9,440,555 - Garfinkel , et al. September 13, 2 | 2016-09-13 |
| Battery Pack Thermal Management App 20160129805 - Garfinkel; George Albert ; et al. | 2016-05-12 |
| Battery Thermal Management System Including Thermal Interface Material With Integrated Heater Element App 20160020496 - Burrows; Neil Robert ; et al. | 2016-01-21 |
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