loadpatents
Patent applications and USPTO patent grants for Kung; Chun-Hao.The latest application filed is for "magnetic slurry for highly efficiency cmp".
Patent | Date |
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Semiconductor device structure with interconnect structure and method for forming the same Grant 11,417,566 - Kung , et al. August 16, 2 | 2022-08-16 |
Chemical mechanical polishing method Grant 11,373,879 - Chen , et al. June 28, 2 | 2022-06-28 |
Magnetic Slurry for Highly Efficiency CMP App 20210327720 - Chen; Yen-Ting ;   et al. | 2021-10-21 |
Semiconductor structure with doped contact plug and method for forming the same Grant 11,145,751 - Chen , et al. October 12, 2 | 2021-10-12 |
Chemical Mechanical Polish Slurry and Method of Manufacture App 20210313190 - Kung; Chun-Hao ;   et al. | 2021-10-07 |
Chemical Mechanical Polishing Apparatus And Method App 20210205950 - Wang; Shang-Yu ;   et al. | 2021-07-08 |
Magnetic slurry for highly efficient CMP Grant 11,056,352 - Chen , et al. July 6, 2 | 2021-07-06 |
Chemical mechanical polish slurry and method of manufacture Grant 11,043,396 - Kung , et al. June 22, 2 | 2021-06-22 |
Chemical mechanical polishing apparatus and method Grant 10,953,514 - Wang , et al. March 23, 2 | 2021-03-23 |
Chemical Mechanical Polishing Apparatus And Method App 20210078130 - Wang; Shang-Yu ;   et al. | 2021-03-18 |
Mega-sonic Vibration Assisted Chemical Mechanical Planarization App 20210016415 - Kung; Chun-Hao ;   et al. | 2021-01-21 |
Chemical Mechanical Polishing Method App 20200411329 - CHEN; TUNG-KAI ;   et al. | 2020-12-31 |
Chemical mechanical polishing method Grant 10,777,423 - Chen , et al. Sept | 2020-09-15 |
CMP cleaning system and method Grant 10,741,381 - Kuo , et al. A | 2020-08-11 |
Self-healing Polishing Pad App 20200039022 - Kung; Chun-Hao ;   et al. | 2020-02-06 |
Semiconductor Device Structure with Interconnect Structure and Method for Forming the Same App 20200043777 - Kung; Chun-Hao ;   et al. | 2020-02-06 |
Magnetic Slurry for Highly Efficient CMP App 20200043747 - Chen; Yen-Ting ;   et al. | 2020-02-06 |
Chemical Mechanical Polish Slurry and Method of Manufacture App 20200043745 - Kung; Chun-Hao ;   et al. | 2020-02-06 |
Semiconductor Structure With Doped Contact Plug And Method For Forming The Same App 20190305107 - CHEN; Kuo-Ju ;   et al. | 2019-10-03 |
Chemical Mechanical Polishing Method App 20190157103 - CHEN; TUNG-KAI ;   et al. | 2019-05-23 |
CMP Cleaning System and Method App 20180174829 - Kuo; Kaw-Wei ;   et al. | 2018-06-21 |
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