| Patent | Date |
|---|
Gastroretentive sustained release formulations of Bergenia ciliata
Grant 11,446,346 - Bharate , et al. September 20, 2 | 2022-09-20 |
Process development for 5-hydroxymethylfurfural (5-HMF) synthesis from carbohydrates
Grant 11,440,894 - Das , et al. September 13, 2 | 2022-09-13 |
File conflict detection
Grant 11,409,716 - Karajgikar , et al. August 9, 2 | 2022-08-09 |
Real-time file system event mapping to cloud events
Grant 11,385,946 - Yanchuleff , et al. July 12, 2 | 2022-07-12 |
Wafer dicing using hybrid laser scribing and plasma etch approach with intermediate breakthrough treatment
Grant 11,355,394 - Lei , et al. June 7, 2 | 2022-06-07 |
Production of Linear Alpha Olefins
App 20220098130 - HIMA BINDU; Vasamsetty Naga Veera ; et al. | 2022-03-31 |
Fractional mirror ratio technique for digital remote temperature sensors, and related systems, methods, and devices
Grant 11,287,329 - Kumar , et al. March 29, 2 | 2022-03-29 |
Near constant delay comparator for closed-loop system
Grant 11,258,395 - Kumar February 22, 2 | 2022-02-22 |
Osseointegrative Surgical Implant And Implant Surgical Kit
App 20220031429 - Kumar; Ajay ; et al. | 2022-02-03 |
Systems and methods for integration of disparate data feeds for unified data monitoring
Grant 11,227,288 - Daines , et al. January 18, 2 | 2022-01-18 |
Hybrid wafer dicing approach using a split beam laser scribing process and plasma etch process
Grant 11,217,536 - Park , et al. January 4, 2 | 2022-01-04 |
Fluid Reactors
App 20210393864 - Strobl; Karlheinz ; et al. | 2021-12-23 |
Proximity contact cover ring for plasma dicing
Grant 11,195,756 - Holden , et al. December 7, 2 | 2021-12-07 |
Virtual File Organizer
App 20210365418 - Kumar; Ajay ; et al. | 2021-11-25 |
Light-absorbing mask for hybrid laser scribing and plasma etch wafer singulation process
Grant 11,158,540 - Li , et al. October 26, 2 | 2021-10-26 |
Near Constant Delay Comparator For Closed-loop System
App 20210320609 - Kumar; Ajay | 2021-10-14 |
Method and system for reliable and secure memory erase
Grant 11,145,368 - Kumar October 12, 2 | 2021-10-12 |
Osseointegrative surgical implant
Grant 11,141,244 - Kumar , et al. October 12, 2 | 2021-10-12 |
Antibodies and Immunoassays for Detection of BMP-15 and GDF-9 Isoforms
App 20210263046 - SAVJANI; Gopal V. ; et al. | 2021-08-26 |
Virtual file organizer
Grant 11,100,057 - Kumar , et al. August 24, 2 | 2021-08-24 |
Method And System For Reliable And Secure Memory Erase
App 20210210140 - Kumar; Ajay | 2021-07-08 |
Using organizational rank to facilitate electronic communication
Grant 11,012,395 - Bagby , et al. May 18, 2 | 2021-05-18 |
Sustained Release Formulations Of Dysoxylum Binefacterum
App 20210137841 - BHARATE; Sonali Sandip ; et al. | 2021-05-13 |
Wafer Dicing Using Femtosecond-based Laser And Plasma Etch
App 20210134676 - Lei; Wei-Sheng ; et al. | 2021-05-06 |
Method for Immunomodulation of using Aza-podophyllotoxin derivatives
App 20210128705 - Kumar; Ajay | 2021-05-06 |
Process Development For 5-hydroxymethylfurfural (5-hmf) Synthesis From Carbohydrates
App 20210122722 - Das; Pralay ; et al. | 2021-04-29 |
Using organizational rank to facilitate electronic communication
Grant 10,938,764 - Bagby , et al. March 2, 2 | 2021-03-02 |
Wafer dicing using femtosecond-based laser and plasma etch
Grant 10,910,271 - Lei , et al. February 2, 2 | 2021-02-02 |
Real-Time File System Event Mapping To Cloud Events
App 20210019201 - Yanchuleff; Jason ; et al. | 2021-01-21 |
Sustained Release Formulations Of Crocus Sativus
App 20200390843 - BHARATE; Sonali Sandip ; et al. | 2020-12-17 |
Fast frequency calculator
Grant 10,866,269 - Kumar , et al. December 15, 2 | 2020-12-15 |
Virtual File Organizer
App 20200387483 - Kumar; Ajay ; et al. | 2020-12-10 |
Circuits for bleeding supply voltage from a device in a power down state
Grant 10,839,921 - Kumar , et al. November 17, 2 | 2020-11-17 |
Real-time file system event mapping to cloud events
Grant 10,838,784 - Yanchuleff , et al. November 17, 2 | 2020-11-17 |
Gastroretentive Sustained Release Formulations Of Bergenia Ciliata
App 20200316150 - Bharate; Sonali Sandip ; et al. | 2020-10-08 |
Circuits For Bleeding Supply Voltage From A Device In A Power Down State
App 20200303020 - Kumar; Ajay ; et al. | 2020-09-24 |
Wafer Dicing Using Femtosecond-based Laser And Plasma Etch
App 20200286787 - Lei; Wei-Sheng ; et al. | 2020-09-10 |
360.degree. ASSISTANCE FOR QCS SCANNER WITH MIXED REALITY AND MACHINE LEARNING TECHNOLOGY
App 20200285225 - Lankehanumaiah; Pavan Tumkur ; et al. | 2020-09-10 |
Reforming catalyst and a process for preparation thereof
Grant 10,751,703 - Sharma , et al. A | 2020-08-25 |
Transfer Arm For Film Frame Substrate Handling During Plasma Singulation Of Wafers
App 20200258780 - A1 | 2020-08-13 |
Methods of reinforcing integrated circuitry of semiconductor devices and related semiconductor devices and packages
Grant 10,734,298 - Yeom , et al. | 2020-08-04 |
File Conflict Detection
App 20200242089 - Karajgikar; Nishant Jaywant ; et al. | 2020-07-30 |
Wafer dicing using femtosecond-based laser and plasma etch
Grant 10,714,390 - Lei , et al. | 2020-07-14 |
Transfer arm for film frame substrate handling during plasma singulation of wafers
Grant 10,692,765 - Holden , et al. | 2020-06-23 |
Circuits for bleeding supply voltage from a device in a power down state
Grant 10,692,581 - Kumar , et al. | 2020-06-23 |
Mitigation of particle contamination for wafer dicing processes
Grant 10,661,383 - Lei , et al. | 2020-05-26 |
Prophy angle with internal airflow generator
Grant 10,631,963 - Kumar | 2020-04-28 |
Wafer Dicing Using Femtosecond-based Laser And Plasma Etch
App 20200118880 - Lei; Wei-Sheng ; et al. | 2020-04-16 |
Fractional Mirror Ratio Technique For Digital Remote Temperature Sensors, And Related Systems, Methods, And Devices
App 20200096395 - Kumar; Ajay ; et al. | 2020-03-26 |
Reforming catalyst and a method of preparation thereof
Grant 10,596,551 - Sharma , et al. | 2020-03-24 |
Wafer Dicing Using Hybrid Laser Scribing And Plasma Etch Approach With Intermediate Breakthrough Treatment
App 20200091001 - Lei; Wei-Sheng ; et al. | 2020-03-19 |
Wafer dicing using femtosecond-based laser and plasma etch
Grant 10,566,238 - Lei , et al. Feb | 2020-02-18 |
Systems and methods for storing frequency information for system calibration/trimming
Grant 10,551,428 - Kumar , et al. Fe | 2020-02-04 |
Hybrid wafer dicing approach using a multiple pass laser scribing process and plasma etch process
Grant 10,535,561 - Park , et al. Ja | 2020-01-14 |
Real-Time File System Event Mapping To Cloud Events
App 20200004606 - Yanchuleff; Jason ; et al. | 2020-01-02 |
Dental Surgical Stent
App 20200000549 - ABEDI; Hamid Reza ; et al. | 2020-01-02 |
Reference noise rejection improvement based on sample and hold circuitry
Grant 10,521,045 - Kumar , et al. Dec | 2019-12-31 |
Low-voltage crystal oscillator circuit compatible with GPIO
Grant 10,523,155 - Vijayaraghavan , et al. Dec | 2019-12-31 |
Antibody Compositions and Immunoassay Methods to Detect Isoforms of Anti-Mullerian Hormone
App 20190391165 - SAVJANI; Gopal V. ; et al. | 2019-12-26 |
Methods Of Reinforcing Integrated Circuitry Of Semiconductor Devices And Related Semiconductor Devices And Packages
App 20190393110 - Yeom; Hyunsoo ; et al. | 2019-12-26 |
Spread Acquisition And Measurement Of Capacitance Sensors And Related Systems, Methods And Devices
App 20190391686 - Kumar; Ajay | 2019-12-26 |
Multiple merchant payment processor platform apparatuses, methods and systems
Grant 10,438,176 - Johnson , et al. O | 2019-10-08 |
Mitigation Of Particle Contamination For Wafer Dicing Processes
App 20190291206 - Lei; Wei-Sheng ; et al. | 2019-09-26 |
Integrated circuit crystal oscillator having digital automatic gain control comprising oscillation detection and amplitude control loops
Grant 10,418,941 - Kumar , et al. Sept | 2019-09-17 |
Hybrid Wafer Dicing Approach Using A Multiple Pass Laser Scribing Process And Plasma Etch Process
App 20190279902 - PARK; Jungrae ; et al. | 2019-09-12 |
Osseointegrative Surgical Implant
App 20190269484 - Kumar; Ajay ; et al. | 2019-09-05 |
Modified heterogeneous catalyst
Grant 10,384,199 - Chintansinh Dharmendrasinh , et al. A | 2019-08-20 |
Reference Noise Rejection Improvement Based on Sample and Hold Circuitry
App 20190250756 - Kumar; Ajay ; et al. | 2019-08-15 |
Alkylidene phosphonate esters as p-glycoprotein inducers
Grant 10,377,781 - Bharate , et al. A | 2019-08-13 |
Mitigation of particle contamination for wafer dicing processes
Grant 10,363,629 - Lei , et al. | 2019-07-30 |
Process for preparing a catalyst
Grant 10,343,149 - Sharma , et al. July 9, 2 | 2019-07-09 |
Fast Frequency Calculator
App 20190146017 - Kumar; Ajay ; et al. | 2019-05-16 |
Apparatus And Methods For Dry Etch With Edge, Side And Back Protection
App 20190096634 - SINGH; Saravjeet ; et al. | 2019-03-28 |
Using Organizational Rank To Facilitate Electronic Communication
App 20190089663 - Bagby; Lance M. ; et al. | 2019-03-21 |
Wafer Dicing Using Femtosecond-based Laser And Plasma Etch
App 20190088549 - Lei; Wei-Sheng ; et al. | 2019-03-21 |
Using Organizational Rank To Facilitate Electronic Communication
App 20190089664 - Bagby; Lance M. ; et al. | 2019-03-21 |
Polyprenylated phloroglucinol compounds as potent P-glycoprotein inducers
Grant 10,202,326 - Bharate , et al. Feb | 2019-02-12 |
Low-Voltage Crystal Oscillator Circuit Compatible With GPIO
App 20190044479 - Vijayaraghavan; Rajan ; et al. | 2019-02-07 |
Method for improving CD micro-loading in photomask plasma etching
Grant 10,199,224 - Mao , et al. Fe | 2019-02-05 |
Using organizational rank to facilitate electronic communication
Grant 10,171,400 - Bagby , et al. J | 2019-01-01 |
Plasma reactor having an array of plural individually controlled gas injectors arranged along a circular side wall
Grant 10,170,280 - Chandrachood , et al. J | 2019-01-01 |
Apparatus and methods for dry etch with edge, side and back protection
Grant 10,170,277 - Singh , et al. J | 2019-01-01 |
Wafer dicing using femtosecond-based laser and plasma etch
Grant 10,163,713 - Lei , et al. Dec | 2018-12-25 |
Voltage measurement circuit
Grant 10,156,596 - Kumar Dec | 2018-12-18 |
Mitigation Of Particle Contamination For Wafer Dicing Processes
App 20180345418 - Lei; Wei-Sheng ; et al. | 2018-12-06 |
Light-absorbing Mask For Hybrid Laser Scribing And Plasma Etch Wafer Singulation Process
App 20180342422 - Li; Wenguang ; et al. | 2018-11-29 |
Periodic kick-starter for a crystal oscillator
Grant 10,135,390 - Kumar November 20, 2 | 2018-11-20 |
N-substituted beta-carbolinium compounds as potent P-glycoprotein inducers
Grant 10,072,009 - Bharate , et al. September 11, 2 | 2018-09-11 |
Pharmaceutical composition for the treatment of multi-drug resistant infections
Grant 10,064,840 - Vishwakarma , et al. September 4, 2 | 2018-09-04 |
Ultra-low power crystal oscillator with adaptive self-start
Grant 10,050,585 - Kumar , et al. August 14, 2 | 2018-08-14 |
Hybrid Wafer Dicing Approach Using A Split Beam Laser Scribing Process And Plasma Etch Process
App 20180226355 - PARK; JUNGRAE ; et al. | 2018-08-09 |
Using PMOS power switch in a combination switching and linear regulator
Grant 10,044,263 - Kumar August 7, 2 | 2018-08-07 |
Adaptive Buffering Rate Technology For Zero Shutter Lag (zsl) Camera-inclusive Devices
App 20180213150 - Gagrani; Gaurav ; et al. | 2018-07-26 |
Circuits For Bleeding Supply Voltage From A Device In A Power Down State
App 20180204626 - Kumar; Ajay ; et al. | 2018-07-19 |
A Reforming Catalyst And A Process For Preparation Thereof
App 20180193822 - Sharma; Nagesh ; et al. | 2018-07-12 |
Asynchronous Crypto Asset Transfer and Social Aggregating, Fractionally Efficient Transfer Guidance, Conditional Triggered Transaction, Datastructures, Apparatuses, Methods and Systems
App 20180191503 - Alwar; Vijaya Subhash ; et al. | 2018-07-05 |
Synergistic Co-pyrolysis Of Biomass And Methane For Hydrocarbon Fuels And Chemicals Production
App 20180142159 - Kumar; Ajay ; et al. | 2018-05-24 |
Hybrid wafer dicing approach using a split beam laser scribing process and plasma etch process
Grant 9,972,575 - Park , et al. May 15, 2 | 2018-05-15 |
Splatter reduction in a small head contra-angle prophy
Grant 9,962,236 - Kumar , et al. May 8, 2 | 2018-05-08 |
Methods and apparatus for controlling photoresist line width roughness with enhanced electron spin control
Grant 9,911,582 - Wu , et al. March 6, 2 | 2018-03-06 |
Systems And Methods For Storing Frequency Information For System Calibration/trimming
App 20180059171 - Kumar; Ajay ; et al. | 2018-03-01 |
Prophy cup for dental handpiece
Grant RE46,696 - Kumar February 6, 2 | 2018-02-06 |
Coupling nut assembly
Grant 9,869,415 - Kumar January 16, 2 | 2018-01-16 |
10-substituted colchicinoids as potent anticancer agents
Grant 9,868,695 - Vishwakarma , et al. January 16, 2 | 2018-01-16 |
Data Injection In Emulation Without Rebooting
App 20180011956 - Kumar; Ajay ; et al. | 2018-01-11 |
Integrated Circuit Crystal Oscillator Having Digital Automatic Gain Control Comprising Oscillation Detection And Amplitude Control Loops
App 20180006605 - Kumar; Ajay ; et al. | 2018-01-04 |
Hybrid wafer dicing approach using a rotating beam laser scribing process and plasma etch process
Grant 9,852,997 - Park , et al. December 26, 2 | 2017-12-26 |
Compounds and methods for the treatment of drug resistance in cancer cells against paclitaxel
App 20170342086 - Kumar; Ajay | 2017-11-30 |
Naphtha reforming process
Grant 9,827,557 - Sharma , et al. November 28, 2 | 2017-11-28 |
N-substituted Beta-carbolinium Compounds As Potent P-glycoprotein Inducers
App 20170334911 - Bharate; Sandip ; et al. | 2017-11-23 |
Polyprenylated Phloroglucinol Compounds As Potent P-glycoprotein Inducers
App 20170320802 - BHARATE; Sandip ; et al. | 2017-11-09 |
Etch mask for hybrid laser scribing and plasma etch wafer singulation process
Grant 9,793,132 - Li , et al. October 17, 2 | 2017-10-17 |
Alkylidene Phosphonate Esters As P-glycoprotein Inducers
App 20170275314 - BHARATE; SANDIP ; et al. | 2017-09-28 |
Hybrid Wafer Dicing Approach Using A Rotating Beam Laser Scribing Process And Plasma Etch Process
App 20170278801 - Park; Jungrae ; et al. | 2017-09-28 |
A Pharmaceutical Composition For The Treatment Of Multi-drug Resistant Infections
App 20170273939 - VISHWAKARMA; Ram ; et al. | 2017-09-28 |
Wafer coating
Grant 9,768,014 - Park , et al. September 19, 2 | 2017-09-19 |
Hybrid Wafer Dicing Approach Using A Split Beam Laser Scribing Process And Plasma Etch Process
App 20170256500 - Park; Jungrae ; et al. | 2017-09-07 |
Electrodes for etch
Grant 9,754,765 - Wu , et al. September 5, 2 | 2017-09-05 |
Reforming Catalyst And A Method Of Preparation Thereof
App 20170239645 - Sharma; Nagesh ; et al. | 2017-08-24 |
Backflow preventer for saliva ejector
Grant 9,737,385 - Kumar August 22, 2 | 2017-08-22 |
Method and device for contactless biometrics identification
Grant 9,734,165 - Kumar , et al. August 15, 2 | 2017-08-15 |
10-substituted Colchicinoids As Potent Anticancer Agents
App 20170226051 - Vishwakarma; Ram A. ; et al. | 2017-08-10 |
Process For Modifying A Heterogeneous Catalyst With An Organometallic Compound, A Heterogeneous Catalyst And System Thereof
App 20170216829 - CHINTANSINH DHARMENDRASINH; Chudasama ; et al. | 2017-08-03 |
Process for the conversion of low polymer wax to paraffin wax, microcrystalline wax, lube and grease base stocks using organic peroxides or hydroperoxides and metal oxides
Grant 9,714,385 - Khan , et al. July 25, 2 | 2017-07-25 |
System And Method Of Producing A Char Support Nickel Catalyst For Use In Syngas Production
App 20170189891 - KUMAR; Ajay ; et al. | 2017-07-06 |
Voltage Measurement Circuit
App 20170168096 - Kumar; Ajay | 2017-06-15 |
Catalyst, A Process For Preparation Of The Catalyst And Application Thereof
App 20170106352 - SHARMA; Nagesh ; et al. | 2017-04-20 |
Multi-layer mask including non-photodefinable laser energy absorbing layer for substrate dicing by laser and plasma etch
Grant 9,620,379 - Lei , et al. April 11, 2 | 2017-04-11 |
Bandgap circuit for current and voltage
Grant 9,612,607 - Kumar , et al. April 4, 2 | 2017-04-04 |
UV-cure pre-treatment of carrier film for wafer dicing using hybrid laser scribing and plasma etch approach
Grant 9,601,375 - Lei , et al. March 21, 2 | 2017-03-21 |
A Process For Preparing A Catalyst
App 20170072387 - Sharma; Nagesh ; et al. | 2017-03-16 |
Catalyst For A Naphtha Reforming Process
App 20170072389 - Sharma; Nagesh ; et al. | 2017-03-16 |
Water soluble mask formation by dry film lamination
Grant 9,583,375 - Lei , et al. February 28, 2 | 2017-02-28 |
A Naphtha Reforming Process
App 20170051212 - Sharma; Nagesh ; et al. | 2017-02-23 |
Ultra-Low Power Crystal Oscillator With Adaptive Self-Start
App 20160373055 - Kumar; Ajay ; et al. | 2016-12-22 |
Periodic Kick-Starter For A Crystal Oscillator
App 20160373056 - Kumar; Ajay | 2016-12-22 |
Etch-resistant Water Soluble Mask For Hybrid Wafer Dicing Using Laser Scribing And Plasma Etch
App 20160365283 - Lei; Wei-Sheng ; et al. | 2016-12-15 |
Method For Improving Cd Micro-loading In Photomask Plasma Etching
App 20160329210 - MAO; Zhigang ; et al. | 2016-11-10 |
Method of 3D biometrics identification
Grant 9,483,681 - Kumar , et al. November 1, 2 | 2016-11-01 |
Uv-cure Pre-treatment Of Carrier Film For Wafer Dicing Using Hybrid Laser Scribing And Plasma Etch Approach
App 20160315009 - Lei; Wei-Sheng ; et al. | 2016-10-27 |
Autoconfigurable Phase-Locked Loop Which Automatically Maintains a Constant Damping Factor and Adjusts the Loop Bandwidth to a Constant Ratio of the Reference Frequency
App 20160301418 - Kumar; Ajay ; et al. | 2016-10-13 |
Method and apparatus for dicing wafers having thick passivation polymer layer
Grant 9,460,966 - Lei , et al. October 4, 2 | 2016-10-04 |
Systems And Methods For Audio Streaming
App 20160286337 - Thekkedathu Sivaraman; Pramod ; et al. | 2016-09-29 |
Antibody Compositions and Immunoassay Methods to Detect Isoforms of Anti-Mullerian Hormone
App 20160274130 - SAVJANI; Gopal V. ; et al. | 2016-09-22 |
Using PMOS Power Switch In A Combination Switching And Linear Regulator
App 20160268885 - Kumar; Ajay | 2016-09-15 |
Water soluble mask formation by dry film vacuum lamination for laser and plasma dicing
Grant 9,443,765 - Lei , et al. September 13, 2 | 2016-09-13 |
Method for Immunomodulation of using Aza-podophyllotoxin derivatives
App 20160250305 - Kumar; Ajay | 2016-09-01 |
Method for improving CD micro-loading in photomask plasma etching
Grant 9,425,062 - Mao , et al. August 23, 2 | 2016-08-23 |
Method of outgassing a mask material deposited over a workpiece in a process tool
Grant 9,412,619 - Kumar , et al. August 9, 2 | 2016-08-09 |
Autoconfigurable phase-locked loop which automatically maintains a constant damping factor and adjusts the loop bandwidth to a constant ratio of the reference frequency
Grant 9,401,722 - kumar , et al. July 26, 2 | 2016-07-26 |
Hybrid Wafer Dicing Approach Using A Polygon Scanning-based Laser Scribing Process And Plasma Etch Process
App 20160197015 - Lei; Wei-Sheng ; et al. | 2016-07-07 |
Process For The Conversion Of Low Polymer Wax To Paraffin Wax, Microcrystalline Wax, Lube And Grease Base Stocks Using Organic Peroxides Or Hydroperoxides And Metal Oxides
App 20160194562 - Khan; Hayat Ullah ; et al. | 2016-07-07 |
Dynamic Ion Radical Sieve And Ion Radical Aperture For An Inductively Coupled Plasma (icp) Reactor
App 20160181067 - SINGH; Saravjeet ; et al. | 2016-06-23 |
Hybrid wafer dicing approach using a line shaped laser beam profile laser scribing process and plasma etch process
Grant 9,355,907 - Lei , et al. May 31, 2 | 2016-05-31 |
Hybrid wafer dicing approach using a rectangular shaped two-dimensional top hat laser beam profile or a linear shaped one-dimensional top hat laser beam profile laser scribing process and plasma etch process
Grant 9,349,648 - Lei , et al. May 24, 2 | 2016-05-24 |
Wafer Dicing Using Femtosecond-based Laser And Plasma Etch
App 20160141210 - Lei; Wei-Sheng ; et al. | 2016-05-19 |
Dicing wafers having solder bumps on wafer backside
Grant 9,343,366 - Lei , et al. May 17, 2 | 2016-05-17 |
Transfer Arm For Film Frame Substrate Handling During Plasma Singulation Of Wafers
App 20160133519 - Holden; James M. ; et al. | 2016-05-12 |
Hybrid wafer dicing approach using a galvo scanner and linear stage hybrid motion laser scribing process and plasma etch process
Grant 9,330,977 - Lei , et al. May 3, 2 | 2016-05-03 |
Screen print mask for laser scribe and plasma etch wafer dicing process
Grant 9,312,177 - Kumar , et al. April 12, 2 | 2016-04-12 |
Method of wafer dicing using hybrid laser scribing and plasma etch approach with mask plasma treatment for improved mask etch resistance
Grant 9,299,611 - Lei , et al. March 29, 2 | 2016-03-29 |
Method and carrier for dicing a wafer
Grant 9,299,614 - Holden , et al. March 29, 2 | 2016-03-29 |
Hybrid Wafer Dicing Approach Using An Adaptive Optics-controlled Laser Scribing Process And Plasma Etch Process
App 20160086851 - Park; Jungrae ; et al. | 2016-03-24 |
Proximity Contact Cover Ring For Plasma Dicing
App 20160086852 - Holden; James M. ; et al. | 2016-03-24 |
Dynamic ion radical sieve and ion radical aperture for an inductively coupled plasma (ICP) reactor
Grant 9,287,093 - Singh , et al. March 15, 2 | 2016-03-15 |
Method And Device For Contactless Biometrics Identification
App 20160070980 - Kumar; Ajay ; et al. | 2016-03-10 |
Methods for reducing line width roughness and/or critical dimension nonuniformity in a patterned photoresist layer
Grant 9,280,051 - Wu , et al. March 8, 2 | 2016-03-08 |
Hybrid wafer dicing approach using an adaptive optics-controlled laser scribing process and plasma etch process
Grant 9,281,244 - Park , et al. March 8, 2 | 2016-03-08 |
Methods And Apparatus For Controlling Photoresist Line Width Roughness With Enhanced Electron Spin Control
App 20160064197 - WU; Banqiu ; et al. | 2016-03-03 |
Dicing processes for thin wafers with bumps on wafer backside
Grant 9,275,902 - Lei , et al. March 1, 2 | 2016-03-01 |
Wafer edge warp suppression for thin wafer supported by tape frame
Grant 9,269,604 - Lei , et al. February 23, 2 | 2016-02-23 |
Method Of Outgassing A Mask Material Deposited Over A Workpiece In A Process Tool
App 20160049313 - KUMAR; PRABHAT ; et al. | 2016-02-18 |
Water soluble mask for substrate dicing by laser and plasma etch
Grant 9,263,308 - Lei , et al. February 16, 2 | 2016-02-16 |
Plasma Reactor Having An Array Of Plural Individually Controlled Gas Injectors Arranged Along A Circular Side Wall
App 20160042917 - Chandrachood; Madhavi R. ; et al. | 2016-02-11 |
Multi-layer Mask Including Non-photodefinable Laser Energy Absorbing Layer For Substrate Dicing By Laser And Plasma Etch
App 20160035577 - LEI; Wei-Sheng ; et al. | 2016-02-04 |
Apparatus and methods for fabricating a photomask substrate for EUV applications
Grant 9,250,514 - Wu , et al. February 2, 2 | 2016-02-02 |
Laser and plasma etch wafer dicing with partial pre-curing of UV release dicing tape for film frame wafer application
Grant 9,252,057 - Chowdhury , et al. February 2, 2 | 2016-02-02 |
Hybrid Wafer Dicing Approach Using A Rectangular Shaped Two-dimensional Top Hat Laser Beam Profile Or A Linear Shaped One-dimensiional Top Hat Laser Beam Profile Laser Scribing Process And Plasma Etch Process
App 20160027697 - Lei; Wei-Sheng ; et al. | 2016-01-28 |
Hybrid wafer dicing approach using a bessel beam shaper laser scribing process and plasma etch process
Grant 9,245,803 - Park , et al. January 26, 2 | 2016-01-26 |
Wafer dicing using femtosecond-based laser and plasma etch
Grant 9,245,802 - Lei , et al. January 26, 2 | 2016-01-26 |
Osseointegrative Surgical Implant
App 20160015483 - Kumar; Ajay ; et al. | 2016-01-21 |
Wafer dicing with etch chamber shield ring for film frame wafer applications
Grant 9,236,305 - Lei , et al. January 12, 2 | 2016-01-12 |
Wafer dicing from wafer backside and front side
Grant 9,224,650 - Lei , et al. December 29, 2 | 2015-12-29 |
Laser and plasma etch wafer dicing using water-soluble die attach film
Grant 9,224,625 - Lei , et al. December 29, 2 | 2015-12-29 |
Mask etch plasma reactor having an array of optical sensors viewing the workpiece backside and a tunable element controlled in response to the optical sensors
Grant 9,218,944 - Chandrachood , et al. December 22, 2 | 2015-12-22 |
Hybrid laser and plasma etch wafer dicing using substrate carrier
Grant 9,218,992 - Singh , et al. December 22, 2 | 2015-12-22 |
Maskless hybrid laser scribing and plasma etching wafer dicing process
Grant 9,209,084 - Lei , et al. December 8, 2 | 2015-12-08 |
Capturing noteworthy portions of audio recordings
Grant 9,202,469 - Moorjani , et al. December 1, 2 | 2015-12-01 |
Adaptive clocking for analog-to-digital conversion
Grant 9,197,238 - Nagaraj , et al. November 24, 2 | 2015-11-24 |
Hybrid wafer dicing approach using a phase modulated laser beam profile laser scribing process and plasma etch process
Grant 9,196,536 - Park , et al. November 24, 2 | 2015-11-24 |
Carrier With Thermally Resistant Film Frame For Supporting Wafer During Singulation
App 20150332970 - Lei; Wei-Sheng ; et al. | 2015-11-19 |
Hybrid wafer dicing approach using laser scribing process based on an elliptical laser beam profile or a spatio-temporal controlled laser beam profile
Grant 9,177,861 - Park , et al. November 3, 2 | 2015-11-03 |
Photoresist treatment method by low bombardment plasma
Grant 9,177,824 - Wu , et al. November 3, 2 | 2015-11-03 |
Method of coating water soluble mask for laser scribing and plasma etch
Grant 9,177,864 - Lei , et al. November 3, 2 | 2015-11-03 |
Using Organizational Rank To Facilitate Electronic Communication
App 20150312192 - Bagby; Lance M. ; et al. | 2015-10-29 |
Wafer Edge Warp Suppression For Thin Wafer Supported By Tape Frame
App 20150311107 - Lei; Wei-Sheng ; et al. | 2015-10-29 |
Dicing Tape Protection For Wafer Dicing Using Laser Scribe Process
App 20150311118 - Lei; Wei-Sheng ; et al. | 2015-10-29 |
Dicing Wafers Having Solder Bumps On Wafer Backside
App 20150303111 - Lei; Wei-Sheng ; et al. | 2015-10-22 |
Personal and pooled virtual machine update
Grant 9,164,755 - Leitman , et al. October 20, 2 | 2015-10-20 |
Method of die singulation using laser ablation and induction of internal defects with a laser
Grant 9,165,832 - Papanu , et al. October 20, 2 | 2015-10-20 |
Water Soluble Mask Formation By Dry Film Lamination
App 20150294892 - Lei; Wei-Sheng ; et al. | 2015-10-15 |
Method of silicon etch for trench sidewall smoothing
Grant 9,159,574 - Yu , et al. October 13, 2 | 2015-10-13 |
Vacuum lamination of polymeric dry films for wafer dicing using hybrid laser scribing and plasma etch approach
Grant 9,159,624 - Lei , et al. October 13, 2 | 2015-10-13 |
Dicing tape protection for wafer dicing using laser scribe process
Grant 9,159,621 - Lei , et al. October 13, 2 | 2015-10-13 |
Hybrid Wafer Dicing Approach Using Collimated Laser Scribing Process And Plasma Etch
App 20150287638 - Park; Jungrae ; et al. | 2015-10-08 |
Electrostatic Dissipative Foams And Process For The Preparation Thereof
App 20150274924 - PANDEY; Jai Krishna ; et al. | 2015-10-01 |
Dicing Processes For Thin Wafers With Bumps On Wafer Backside
App 20150279739 - Lei; Wei-Sheng ; et al. | 2015-10-01 |
Wafer dicing using hybrid laser scribing and plasma etch approach with mask application by vacuum lamination
Grant 9,142,459 - Kumar , et al. September 22, 2 | 2015-09-22 |
Baking Tool For Improved Wafer Coating Process
App 20150255346 - PARK; Jungrae ; et al. | 2015-09-10 |
Approaches For Cleaning A Wafer During Hybrid Laser Scribing And Plasma Etching Wafer Dicing Processes
App 20150255349 - Holden; James Matthew ; et al. | 2015-09-10 |
Baking tool for improved wafer coating process
Grant 9,130,030 - Park , et al. September 8, 2 | 2015-09-08 |
Hybrid dicing process using a blade and laser
Grant 9,130,057 - Kumar , et al. September 8, 2 | 2015-09-08 |
Bi-layer wafer-level underfill mask for wafer dicing and approaches for performing wafer dicing
Grant 9,130,056 - Holden , et al. September 8, 2 | 2015-09-08 |
Laser and plasma etch wafer dicing using physically-removable mask
Grant 9,126,285 - Lei , et al. September 8, 2 | 2015-09-08 |
Wafer dicing using pulse train laser with multiple-pulse bursts and plasma etch
Grant 9,129,904 - Lei , et al. September 8, 2 | 2015-09-08 |
Hybrid Wafer Dicing Approach Using Temporally-controlled Laser Scribing Process And Plasma Etch
App 20150243559 - Park; Jungrae ; et al. | 2015-08-27 |
Dicing tape thermal management by wafer frame support ring cooling during plasma dicing
Grant 9,112,050 - Lei , et al. August 18, 2 | 2015-08-18 |
Wafer dicing method for improving die packaging quality
Grant 9,105,710 - Lei , et al. August 11, 2 | 2015-08-11 |
Troubleshooting routing topology based on a reference topology
Grant 9,106,555 - Agarwal , et al. August 11, 2 | 2015-08-11 |
Improved Wafer Coating
App 20150221505 - Park; Jungrae ; et al. | 2015-08-06 |
Wafer Dicing Using Hybrid Laser Scribing And Plasma Etch Approach With Mask Plasma Treatment For Improved Mask Etch Resistance
App 20150214109 - Lei; Wei-Sheng ; et al. | 2015-07-30 |
Water Soluble Mask Formation By Dry Film Vacuum Lamination For Laser And Plasma Dicing
App 20150214111 - Lei; Wei-Sheng ; et al. | 2015-07-30 |
Singulation of wafers having wafer-level underfill
Grant 9,093,518 - Lei , et al. July 28, 2 | 2015-07-28 |
Surgical Handpiece
App 20150201918 - Kumar; Ajay ; et al. | 2015-07-23 |
Laser Scribing And Plasma Etch For High Die Break Strength And Clean Sidewall
App 20150200119 - EATON; Brad ; et al. | 2015-07-16 |
Residue removal from singulated die sidewall
Grant 9,076,860 - Lei , et al. July 7, 2 | 2015-07-07 |
Method and apparatus for high efficiency gas dissociation in inductive coupled plasma reactor
Grant 9,070,633 - Nangoy , et al. June 30, 2 | 2015-06-30 |
Two adjacent bit values switching current source between three paths
Grant 9,065,476 - Hezar , et al. June 23, 2 | 2015-06-23 |
Method And Carrier For Dicing A Wafer
App 20150162244 - Holden; James M. ; et al. | 2015-06-11 |
Screen Print Mask For Laser Scribe And Plasma Etch Wafer Dicing Process
App 20150162243 - Kumar; Prabhat ; et al. | 2015-06-11 |
Multi-step and asymmetrically shaped laser beam scribing
Grant 9,054,176 - Lei , et al. June 9, 2 | 2015-06-09 |
Uniform masking for wafer dicing using laser and plasma etch
Grant 9,048,309 - Chowdhury , et al. June 2, 2 | 2015-06-02 |
Maskless hybrid laser scribing and plasma etching wafer dicing process
Grant 9,041,198 - Lei , et al. May 26, 2 | 2015-05-26 |
Methods and apparatus for controlling photoresist line width roughness
Grant 9,039,910 - Wu , et al. May 26, 2 | 2015-05-26 |
Laser And Plasma Etch Wafer Dicing With A Double Sided Uv-curable Adhesive Film
App 20150122419 - Chowdhury; Mohammad Kamruzzaman ; et al. | 2015-05-07 |
Increased deposition efficiency and higher chamber conductance with source power increase in an inductively coupled plasma (ICP) chamber
Grant 9,023,227 - Dinev , et al. May 5, 2 | 2015-05-05 |
Wafer dicing using hybrid laser scribing and plasma etch approach with intermediate reactive post mask-opening clean
Grant 9,018,079 - Lei , et al. April 28, 2 | 2015-04-28 |
Method of 3D Biometrics Identification
App 20150110367 - Kumar; Ajay ; et al. | 2015-04-23 |
Maskless Hybrid Laser Scribing And Plasma Etching Wafer Dicing Process
App 20150111364 - Lei; Wei-Sheng ; et al. | 2015-04-23 |
Maskless Hybrid Laser Scribing And Plasma Etching Wafer Dicing Process
App 20150111363 - Lei; Wei-Sheng ; et al. | 2015-04-23 |
Wafer dicing using hybrid laser scribing and plasma etch approach with intermediate non-reactive post mask-opening clean
Grant 9,012,305 - Lei , et al. April 21, 2 | 2015-04-21 |
Method And Apparatus For Dicing Wafers Having Thick Passivation Polymer Layer
App 20150104929 - Lei; Wei-Sheng ; et al. | 2015-04-16 |
Method Of Diced Wafer Transportation
App 20150102467 - Lei; Wei-Sheng ; et al. | 2015-04-16 |
Pre-patterned dry laminate mask for wafer dicing processes
Grant 8,999,816 - Holden , et al. April 7, 2 | 2015-04-07 |
Novel Electrodes For Etch
App 20150090401 - Wu; Banqiu ; et al. | 2015-04-02 |
Optical memory device based on DHFLC material and method of preparing the same
Grant 8,994,911 - Jai , et al. March 31, 2 | 2015-03-31 |
Laser scribing and plasma etch for high die break strength and clean sidewall
Grant 8,993,414 - Eaton , et al. March 31, 2 | 2015-03-31 |
Wafer coating
Grant 8,991,329 - Park , et al. March 31, 2 | 2015-03-31 |
Wafer Dicing from Wafer Backside and Front Side
App 20150079761 - Lei; Wei-Sheng ; et al. | 2015-03-19 |
Alternating Masking And Laser Scribing Approach For Wafer Dicing Using Laser Scribing And Plasma Etch
App 20150079760 - Lei; Wei-Sheng ; et al. | 2015-03-19 |
Substrate patterning using hybrid laser scribing and plasma etching processing schemes
Grant 8,980,727 - Lei , et al. March 17, 2 | 2015-03-17 |
Successive-approximation-register (SAR) analog-to-digital converter (ADC) attenuation capacitor calibration method and apparatus
Grant 8,981,973 - Kumar March 17, 2 | 2015-03-17 |
Substrate dicing by laser ablation and plasma etch damage removal for ultra-thin wafers
Grant 8,980,726 - Lei , et al. March 17, 2 | 2015-03-17 |
Laser-dominated laser scribing and plasma etch hybrid wafer dicing
Grant 8,975,163 - Lei , et al. March 10, 2 | 2015-03-10 |
Wafer dicing from wafer backside
Grant 8,975,162 - Lei , et al. March 10, 2 | 2015-03-10 |
Wafer Dicing Method For Improving Die Packaging Quality
App 20150064878 - LEI; Wei-Sheng ; et al. | 2015-03-05 |
Laser and plasma etch wafer dicing with a double sided UV-curable adhesive film
Grant 8,969,177 - Chowdhury , et al. March 3, 2 | 2015-03-03 |
Methods for controlling defects for extreme ultraviolet lithography (EUVL) photomask substrate
Grant 8,962,224 - Wu , et al. February 24, 2 | 2015-02-24 |
Contactless 3D biometric feature identification system and method thereof
Grant 8,953,854 - Kumar , et al. February 10, 2 | 2015-02-10 |
Wafer dicing using hybrid split-beam laser scribing process with plasma etch
Grant 8,951,819 - Lei , et al. February 10, 2 | 2015-02-10 |
Method And System For Laser Focus Plane Determination In A Laser Scribing Process
App 20150037915 - LEI; Wei-Sheng ; et al. | 2015-02-05 |
Laser and plasma etch wafer dicing using UV-curable adhesive film
Grant 8,946,057 - Lei , et al. February 3, 2 | 2015-02-03 |
Wafer Dicing With Wide Kerf By Laser Scribing And Plasma Etching Hybrid Approach
App 20150028446 - Lei; Wei-Sheng ; et al. | 2015-01-29 |
Method of diced wafer transportation
Grant 8,940,619 - Lei , et al. January 27, 2 | 2015-01-27 |
Water soluble mask formation by dry film lamination
Grant 8,932,939 - Lei , et al. January 13, 2 | 2015-01-13 |
Atomic layer deposition lithography
Grant 8,932,802 - Wu , et al. January 13, 2 | 2015-01-13 |
Laser Scribing And Plasma Etch For High Die Break Strength And Smooth Sidewall
App 20150011073 - Lei; Wei-Sheng ; et al. | 2015-01-08 |
Water soluble mask formation by dry film vacuum lamination for laser and plasma dicing
Grant 8,927,393 - Lei , et al. January 6, 2 | 2015-01-06 |
Bandgap Circuit for Current and Voltage
App 20150002130 - Kumar; Ajay ; et al. | 2015-01-01 |
Method Of Coating Water Soluble Mask For Laser Scribing And Plasma Etch
App 20140377937 - Lei; Wei-Sheng ; et al. | 2014-12-25 |
Photoresist Treatment Method By Low Bombardment Plasma
App 20140370708 - WU; BANQIU ; et al. | 2014-12-18 |
Wafer Dicing Using Femtosecond-based Laser And Plasma Etch
App 20140367041 - Lei; Wei-Sheng ; et al. | 2014-12-18 |
Methods For Reducing Line Width Roughness And/or Critical Dimension Nonuniformity In A Patterned Photoresist Layer
App 20140370709 - WU; BANQIU ; et al. | 2014-12-18 |
Wafer edge warp supression for thin wafer supported by tape frame
Grant 8,912,075 - Lei , et al. December 16, 2 | 2014-12-16 |
Hybrid laser and plasma etch wafer dicing using substrate carrier
Grant 8,912,077 - Singh , et al. December 16, 2 | 2014-12-16 |
Dicing wafers having solder bumps on wafer backside
Grant 8,912,078 - Lei , et al. December 16, 2 | 2014-12-16 |
Laser, Plasma Etch, And Backside Grind Process For Wafer Dicing
App 20140363952 - Lei; Wei-Sheng ; et al. | 2014-12-11 |
Charged Beam Plasma Apparatus For Photomask Manufacture Applications
App 20140356768 - WU; Banqiu ; et al. | 2014-12-04 |
Wafer Dicing With Wide Kerf By Laser Scribing And Plasma Etching Hybrid Approach
App 20140346641 - Lei; Wei-Sheng ; et al. | 2014-11-27 |
Methods For Etching A Substrate
App 20140335679 - LIU; TONG ; et al. | 2014-11-13 |
Coupling Nut Assembly
App 20140284918 - Kumar; Ajay | 2014-09-25 |
Personal And Pooled Virtual Machine Update
App 20140289718 - Leitman; Robert K. ; et al. | 2014-09-25 |
Substrate Laser Dicing Mask Including Laser Energy Absorbing Water-soluble Film
App 20140273401 - LEI; Wei-Sheng ; et al. | 2014-09-18 |
Method For Improving Cd Micro-loading In Photomask Plasma Etching
App 20140273490 - MAO; Zhigang ; et al. | 2014-09-18 |
Method And Apparatus For High Efficiency Gas Dissociation In Inductive Coupled Plasma Reactor
App 20140256148 - NANGOY; Roy C. ; et al. | 2014-09-11 |
Contamination Prevention For Photomask In Extreme Ultraviolet Lithography Application
App 20140253887 - WU; Banqiu ; et al. | 2014-09-11 |
Successive-Approximation-Register (SAR) Analog-to-Digital Converter (ADC) Attenuation Capacitor Calibration Method and Apparatus
App 20140253351 - Kumar; Ajay | 2014-09-11 |
Apparatus And Methods For Fabricating A Photomask Substrate For Euv Applications
App 20140255830 - WU; Banqiu ; et al. | 2014-09-11 |
Multiple Merchant Payment Processor Platform Apparatuses, Methods and Systems
App 20140249999 - Johnson; Alan ; et al. | 2014-09-04 |
Substrate Dicing By Laser Ablation & Plasma Etch Damage Removal For Ultra-thin Wafers
App 20140213042 - LEI; Wei-Sheng ; et al. | 2014-07-31 |
Laser And Plasma Etch Wafer Dicing With Etch Chamber Shield Ring For Film Frame Wafer Applications
App 20140213041 - LEI; Wei-Sheng ; et al. | 2014-07-31 |
Method And Apparatus For Photomask Plasma Etching
App 20140190632 - KUMAR; Ajay ; et al. | 2014-07-10 |
Wafer Dicing From Wafer Backside
App 20140179084 - Lei; Wei-Sheng ; et al. | 2014-06-26 |
Water Soluble Mask For Substrate Dicing By Laser And Plasma Etch
App 20140174659 - Lei; Wei-Sheng ; et al. | 2014-06-26 |
Method For Etching Euv Material Layers Utilized To Form A Photomask
App 20140154615 - Yu; Keven ; et al. | 2014-06-05 |
Hybrid Laser And Plasma Etch Wafer Dicing Using Substrate Carrier
App 20140144585 - Singh; Saravjeet ; et al. | 2014-05-29 |
Papp-a2 As A Marker For Monitoring, Predicting And Diagnosing Preeclampsia
App 20140141456 - Kumar; Ajay ; et al. | 2014-05-22 |
Wafer Dicing Using Hybrid Multi-step Laser Scribing Process With Plasma Etch
App 20140120698 - Lei; Wei-Sheng ; et al. | 2014-05-01 |
Wafer Dicing Using Femtosecond-based Laser And Plasma Etch
App 20140120697 - Lei; Wei-Sheng ; et al. | 2014-05-01 |
| 