loadpatents
name:-0.030256986618042
name:-0.024679899215698
name:-0.010767936706543
Kuan; Shih-Fan Patent Filings

Kuan; Shih-Fan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kuan; Shih-Fan.The latest application filed is for "apparatuses including redistribution layers and related microelectronic devices".

Company Profile
9.22.24
  • Kuan; Shih-Fan - Taoyuan TW
  • Kuan; Shih-Fan - Taoyuan City TW
  • Kuan; Shih-Fan - Taoyuan County N/A TW
  • Kuan; Shih-Fan - Tao-Yuan Hsien TW
  • Kuan, Shih-Fan - Luju Shiang TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Apparatuses including redistribution layers and related microelectronic devices
Grant 11,211,351 - Kuan , et al. December 28, 2
2021-12-28
Front opening unified pod
Grant 10,903,103 - Kuan January 26, 2
2021-01-26
Method of manufacturing a semiconductor structure
Grant 10,825,722 - Kuan November 3, 2
2020-11-03
Apparatuses Including Redistribution Layers And Related Microelectronic Devices
App 20200294945 - Kuan; Shih-Fan ;   et al.
2020-09-17
Methods of manufacturing a multi-device package
Grant 10,679,958 - Kuan , et al.
2020-06-09
Multi-device packages and related microelectronic devices
Grant 10,593,637 - Kuan , et al.
2020-03-17
Semiconductor devices
Grant 10,566,332 - Wang , et al. Feb
2020-02-18
Semiconductor package with embedded MIM capacitor, and method of fabricating thereof
Grant 10,381,302 - Shih , et al. A
2019-08-13
Methods of manufacturing a multi-device package
Grant 10,373,922 - Kuan , et al.
2019-08-06
Front Opening Unified Pod
App 20190229000 - KUAN; Shih-Fan
2019-07-25
Semiconductor Devices
App 20190088658 - Wang; Kuo-Chen ;   et al.
2019-03-21
Methods Of Manufacturing A Multi-device Package
App 20190088606 - Kuan; Shih-Fan ;   et al.
2019-03-21
Methods for fabricating a semiconductor memory device
Grant 10,163,909 - Wang , et al. Dec
2018-12-25
Multi-device Packages And Related Semiconductor Devices
App 20180358315 - Kuan; Shih-Fan ;   et al.
2018-12-13
Semiconductor Package With Embedded Mim Capacitor, And Method Of Fabricating Thereof
App 20180190582 - SHIH; Shing-Yih ;   et al.
2018-07-05
Semiconductor Memory Device Having Coplanar Digit Line Contacts And Storage Node Contacts In Memory Array And Method For Fabricating The Same
App 20180102366 - Wang; Kuo-Chen ;   et al.
2018-04-12
Semiconductor memory device having coplanar digit line contacts and storage node contacts in memory array and method for fabricating the same
Grant 9,881,924 - Wang , et al. January 30, 2
2018-01-30
Semiconductor Memory Device Having Coplanar Digit Line Contacts And Storage Node Contacts In Memory Array And Method For Fabricating The Same
App 20170330882 - Wang; Kuo-Chen ;   et al.
2017-11-16
Multi-device Package And Manufacturing Method Thereof
App 20170033078 - KUAN; Shih-Fan ;   et al.
2017-02-02
Multi-device package and manufacturing method thereof
Grant 9,543,270 - Kuan , et al. January 10, 2
2017-01-10
Multi-device Package And Manufacturing Method Thereof
App 20160358870 - KUAN; Shih-Fan ;   et al.
2016-12-08
Fan-out Wafer Level Package And Fabrication Method Thereof
App 20160351462 - Kuan; Shih-Fan ;   et al.
2016-12-01
Silicon interposer and fabrication method thereof
Grant 9,455,243 - Kuan , et al. September 27, 2
2016-09-27
Stack capacitor structure and forming method
Grant 8,384,191 - Kuan February 26, 2
2013-02-26
Stack Capacitor Structure And Forming Method
App 20120299153 - Kuan; Shih-Fan
2012-11-29
Method of fabricating storage node with supported structure of stacked capacitor
Grant 7,749,856 - Kuan , et al. July 6, 2
2010-07-06
Method Of Fabricating Storage Node With Supported Structure Of Stacked Capacitor
App 20100047992 - Kuan; Shih-Fan ;   et al.
2010-02-25
Word line structure with single-sided partially recessed gate structure
Grant 7,358,576 - Kuan , et al. April 15, 2
2008-04-15
Word line structure with single-sided partially recessed gate structure
App 20060030091 - Kuan; Shih-Fan ;   et al.
2006-02-09
World line structure with single-sided partially recessed gate structure
Grant 6,991,978 - Kuan , et al. January 31, 2
2006-01-31
Semiconductor Device And Fabricating Method Thereof
App 20050275109 - Kuan, Shih-Fan ;   et al.
2005-12-15
Method of fabricating semiconductor device
Grant 6,972,248 - Yang , et al. December 6, 2
2005-12-06
Method for forming contact window
App 20050260847 - Yang, J. H. ;   et al.
2005-11-24
Method for fabricating a trench capacitor
Grant 6,960,503 - Hsu , et al. November 1, 2
2005-11-01
Method of fabricating semiconductor device
App 20050202666 - Yang, Sweehan J.H. ;   et al.
2005-09-15
Method for manufacturing gate structure with sides of its metal layer partially removed
Grant 6,943,099 - Kuan , et al. September 13, 2
2005-09-13
Method of manufacturing semiconductor device featuring formation of conductive plugs
Grant 6,933,229 - Kuan , et al. August 23, 2
2005-08-23
Method for forming DRAM cell bit line and bit line contact structure
Grant 6,930,043 - Wu , et al. August 16, 2
2005-08-16
Method for manufacturing gate structure of memory
App 20050176244 - Kuan, Shih-Fan ;   et al.
2005-08-11
World line structure with single-sided partially recessed gate structure
App 20050167763 - Kuan, Shih-Fan ;   et al.
2005-08-04
Method For Manufacturing Gate Structure With Sides Of Its Metal Layer Partially Removed
App 20050170624 - Kuan, Shih-Fan ;   et al.
2005-08-04
Method For Fabricating A Trench Capacitor
App 20050106831 - Hsu, Ping ;   et al.
2005-05-19
Method for forming DRAM cell bit line and bit line contact structure
App 20050026409 - Wu, Kuo-Chien ;   et al.
2005-02-03
[semiconductor Device And Fabricating Method Thereof]
App 20050012218 - KUAN, SHIH-FAN ;   et al.
2005-01-20
Method for forming DRAM cell bit-line contact
App 20050003307 - Kuan, Shih-Fan ;   et al.
2005-01-06

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